SE379674B - - Google Patents
Info
- Publication number
- SE379674B SE379674B SE7305651A SE7305651A SE379674B SE 379674 B SE379674 B SE 379674B SE 7305651 A SE7305651 A SE 7305651A SE 7305651 A SE7305651 A SE 7305651A SE 379674 B SE379674 B SE 379674B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/04—Etching of light metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- ing And Chemical Polishing (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47039645A JPS5123266B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1972-04-21 | 1972-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE379674B true SE379674B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-10-20 |
Family
ID=12558809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7305651A SE379674B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1972-04-21 | 1973-04-19 |
Country Status (5)
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51142765U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1975-05-12 | 1976-11-17 | ||
| DE2801218C3 (de) * | 1978-01-12 | 1980-11-20 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum elektrolytischen Ätzen einer rekristallisierten Aluminiumfolie und deren Verwendung |
| GB2040101B (en) * | 1978-07-13 | 1982-09-15 | Tokyo Shibaura Electric Co | Method of fabricating printed ciurcuits |
| JPS5435271U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1978-07-21 | 1979-03-08 | ||
| JPS5568380U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1978-10-31 | 1980-05-10 | ||
| JPS599050A (ja) | 1982-07-08 | 1984-01-18 | 日立電線株式会社 | 銅張積層板の製造方法 |
| JPS6155994A (ja) * | 1984-08-27 | 1986-03-20 | 信越化学工業株式会社 | 銅張りフレキシブルプリント回路用基板 |
| DE3510201A1 (de) * | 1985-03-21 | 1986-09-25 | Bayer Ag, 5090 Leverkusen | Elektrische leiterplatten |
| DE3510202A1 (de) * | 1985-03-21 | 1986-09-25 | Bayer Ag, 5090 Leverkusen | Elektrische leiterplatten |
| JPS63103075A (ja) * | 1986-10-14 | 1988-05-07 | エドワ−ド アドラ− | マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品 |
| US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
| EP1843649A3 (en) | 1998-09-03 | 2007-10-31 | Ibiden Co., Ltd. | Multilayered printed circuit board and manufacturing method therefor |
| AU2003901559A0 (en) * | 2003-04-07 | 2003-05-01 | Unisearch Limited | Glass texturing method |
| US8198540B2 (en) * | 2006-06-06 | 2012-06-12 | Mitsubishi Materials Corporation | Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power module |
| DE102016113641A1 (de) * | 2016-07-25 | 2018-01-25 | Christian-Albrechts-Universität Zu Kiel | Aluminium-Kupfer-Konnektor aufweisend eine Heterostruktur und Verfahren zur Herstellung der Heterostruktur |
| DE102021111149A1 (de) | 2021-04-29 | 2022-11-03 | Christian-Albrechts-Universität zu Kiel, Körperschaft des öffentlichen Rechts | Polymer-kompositstruktur aufweisend eine aluminium-polymer verankerungsschicht sowie ätzverfahren |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2930741A (en) * | 1960-03-29 | Electrolytic capacitors | ||
| BE516819A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1952-01-10 | |||
| US2932599A (en) * | 1955-05-09 | 1960-04-12 | Sanders Associates Inc | Method of preparation of thermoplastic resin coated printed circuit |
| US3438127A (en) * | 1965-10-21 | 1969-04-15 | Friden Inc | Manufacture of circuit modules using etched molds |
| US3574070A (en) * | 1967-05-11 | 1971-04-06 | Shipley Co | Metal plating over plastic |
| US3784440A (en) * | 1969-12-31 | 1974-01-08 | Macdermid Inc | Aluminum-clad plastic substrate laminates |
-
1972
- 1972-04-21 JP JP47039645A patent/JPS5123266B2/ja not_active Expired
-
1973
- 1973-04-19 DE DE2320099A patent/DE2320099C3/de not_active Expired
- 1973-04-19 SE SE7305651A patent/SE379674B/xx unknown
- 1973-04-19 GB GB1897173A patent/GB1374934A/en not_active Expired
- 1973-04-20 US US353106A patent/US3876479A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE2320099A1 (de) | 1973-10-25 |
| GB1374934A (en) | 1974-11-20 |
| JPS5123266B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1976-07-15 |
| DE2320099B2 (de) | 1974-07-18 |
| DE2320099C3 (de) | 1979-10-11 |
| US3876479A (en) | 1975-04-08 |
| JPS49139A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1974-01-05 |