SE375431B - - Google Patents

Info

Publication number
SE375431B
SE375431B SE7209038A SE903872A SE375431B SE 375431 B SE375431 B SE 375431B SE 7209038 A SE7209038 A SE 7209038A SE 903872 A SE903872 A SE 903872A SE 375431 B SE375431 B SE 375431B
Authority
SE
Sweden
Application number
SE7209038A
Inventor
W Newsam
Original Assignee
Plessey Handel Investment Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Handel Investment Ag filed Critical Plessey Handel Investment Ag
Publication of SE375431B publication Critical patent/SE375431B/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
SE7209038A 1971-07-09 1972-07-07 SE375431B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3225171A GB1356632A (en) 1971-07-09 1971-07-09 Multiplayer printed-circuit boards

Publications (1)

Publication Number Publication Date
SE375431B true SE375431B (xx) 1975-04-14

Family

ID=10335698

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7209038A SE375431B (xx) 1971-07-09 1972-07-07

Country Status (4)

Country Link
US (1) US3923359A (xx)
DE (1) DE2233578A1 (xx)
GB (1) GB1356632A (xx)
SE (1) SE375431B (xx)

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US4159508A (en) * 1975-12-22 1979-06-26 Fujitsu Limited Multilayer printed wiring board
JPS53129863A (en) * 1977-04-19 1978-11-13 Fujitsu Ltd Multilayer printed board
DE2722736C2 (de) * 1977-05-17 1982-04-08 Auergesellschaft Gmbh, 1000 Berlin Mehrpolige Anschlußleiste
FR2404990A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
US4195896A (en) * 1977-11-21 1980-04-01 Wescom, Inc. Program plug
US4237546A (en) * 1979-01-31 1980-12-02 Technology Marketing, Inc. Multi-layered back plane for a computer system
JPS56101672U (xx) * 1979-12-28 1981-08-10
US4339784A (en) * 1980-08-11 1982-07-13 Rca Corporation Solder draw pad
DE3041726C2 (de) * 1980-11-05 1983-01-20 Standard Elektrik Lorenz Ag, 7000 Stuttgart Geräteeinsatz der Vertikalbauweise
DE3108546A1 (de) * 1981-03-06 1982-09-16 Siemens AG, 1000 Berlin und 8000 München Durchkontaktierung fuer mehrlagen-leiterplatten
US4582374A (en) * 1981-10-26 1986-04-15 Amp Incorporated High density interconnect system
US4489364A (en) * 1981-12-31 1984-12-18 International Business Machines Corporation Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface
US4489999A (en) * 1983-02-15 1984-12-25 Motorola, Inc. Socket and flexible PC board assembly and method for making
US4588239A (en) * 1983-03-02 1986-05-13 4C Electronics, Inc. Programmed socket
FR2555011B1 (fr) * 1983-11-15 1986-01-24 Thomson Csf Carte imprimee a empreintes
US4546413A (en) * 1984-06-29 1985-10-08 International Business Machines Corporation Engineering change facility on both major surfaces of chip module
US4793058A (en) * 1985-04-04 1988-12-27 Aries Electronics, Inc. Method of making an electrical connector
US4846705A (en) * 1985-04-09 1989-07-11 The Grass Valley Group, Inc. Backplan connector
US4664458A (en) * 1985-09-19 1987-05-12 C W Industries Printed circuit board connector
US4906987A (en) * 1985-10-29 1990-03-06 Ohio Associated Enterprises, Inc. Printed circuit board system and method
US4686607A (en) * 1986-01-08 1987-08-11 Teradyne, Inc. Daughter board/backplane assembly
US4868980A (en) * 1986-12-23 1989-09-26 Ltv Aerospace & Defense Company Method of designing and manufacturing circuits using universal circuit board
DE3863105D1 (de) * 1987-03-20 1991-07-11 Siemens Ag Rueckwandleiterplatte.
EP0284844B1 (de) * 1987-03-20 1991-06-05 Siemens Aktiengesellschaft Rückwandleiterplatte
US5282112A (en) * 1987-03-20 1994-01-25 Siemens Aktiengesellschaft Backplane having a jumper plug to connect socket connections to a bus line
EP0285831B1 (de) * 1987-03-20 1991-06-05 Siemens Aktiengesellschaft Rückwandleiterplatte
EP0284845B1 (de) * 1987-03-20 1991-06-05 Siemens Aktiengesellschaft Rückwandleiterplatte
US4799904A (en) * 1987-07-29 1989-01-24 Mill-Max Mfg. Corp. Compliant tail connector
US4835345A (en) * 1987-09-18 1989-05-30 Compaq Computer Corporation Printed wiring board having robber pads for excess solder
US4900878A (en) * 1988-10-03 1990-02-13 Hughes Aircraft Company Circuit terminations having improved electrical and structural integrity
US5420754A (en) * 1990-09-28 1995-05-30 At&T Corp. Stacked board assembly for computing machines, including routing boards
US5390081A (en) * 1993-03-22 1995-02-14 Stratus Computer, Inc. Fault-tolerant power distribution system for rack-mounted hardware
US5572409A (en) * 1994-02-08 1996-11-05 Prolinx Labs Corporation Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board
US5808351A (en) * 1994-02-08 1998-09-15 Prolinx Labs Corporation Programmable/reprogramable structure using fuses and antifuses
US5537108A (en) * 1994-02-08 1996-07-16 Prolinx Labs Corporation Method and structure for programming fuses
US5834824A (en) * 1994-02-08 1998-11-10 Prolinx Labs Corporation Use of conductive particles in a nonconductive body as an integrated circuit antifuse
US5917229A (en) * 1994-02-08 1999-06-29 Prolinx Labs Corporation Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect
US5726482A (en) * 1994-02-08 1998-03-10 Prolinx Labs Corporation Device-under-test card for a burn-in board
US5813881A (en) * 1994-02-08 1998-09-29 Prolinx Labs Corporation Programmable cable and cable adapter using fuses and antifuses
US5414219A (en) * 1994-04-22 1995-05-09 At&T Corp. Printed circuit board circuit control device
US5587890A (en) * 1994-08-08 1996-12-24 Cooper Industries, Inc. Vehicle electric power distribution system
US5929517A (en) 1994-12-29 1999-07-27 Tessera, Inc. Compliant integrated circuit package and method of fabricating the same
US5962815A (en) * 1995-01-18 1999-10-05 Prolinx Labs Corporation Antifuse interconnect between two conducting layers of a printed circuit board
US6091608A (en) * 1995-02-08 2000-07-18 Compaq Computer Corporation Method and apparatus for simplified and compact component addition to a printed circuit board
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
US5767575A (en) * 1995-10-17 1998-06-16 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
US5872338A (en) * 1996-04-10 1999-02-16 Prolinx Labs Corporation Multilayer board having insulating isolation rings
US5777853A (en) * 1996-05-03 1998-07-07 Ast Research, Inc. Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equal printouts per size
US5751557A (en) * 1996-06-21 1998-05-12 Ast Research, Inc. Printed circuit board having a triple pattern footprint for receiving one of three component packages
US6034427A (en) * 1998-01-28 2000-03-07 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
US6624508B2 (en) * 2000-01-03 2003-09-23 Sophia Wireless, Inc. High frequency, low cost package for semiconductor devices
US6928583B2 (en) * 2001-04-11 2005-08-09 Stratus Technologies Bermuda Ltd. Apparatus and method for two computing elements in a fault-tolerant server to execute instructions in lockstep
US7335995B2 (en) 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
US6977440B2 (en) 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
DE10297316T5 (de) 2001-10-09 2004-12-09 Tessera, Inc., San Jose Gestapelte Baugruppen
WO2004017399A1 (en) * 2002-08-16 2004-02-26 Tessera, Inc. Microelectronic packages with self-aligning features
US7294928B2 (en) * 2002-09-06 2007-11-13 Tessera, Inc. Components, methods and assemblies for stacked packages
US7071547B2 (en) 2002-09-11 2006-07-04 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
US7071420B2 (en) * 2002-12-18 2006-07-04 Micron Technology, Inc. Methods and apparatus for a flexible circuit interposer
US7061121B2 (en) 2003-11-12 2006-06-13 Tessera, Inc. Stacked microelectronic assemblies with central contacts
DE102004042729B4 (de) * 2004-09-03 2018-02-01 Robert Bosch Gmbh Bio-Chip mit einem Elektrodenarray auf einem Substrat
US20060118332A1 (en) * 2004-12-02 2006-06-08 Litton Systems, Inc. Multilayered circuit board for high-speed, differential signals
US7629680B2 (en) * 2006-03-22 2009-12-08 Intel Corporation Direct power delivery into an electronic package
US7545029B2 (en) 2006-08-18 2009-06-09 Tessera, Inc. Stack microelectronic assemblies
US7645943B2 (en) * 2007-07-11 2010-01-12 Delphi Technologies, Inc. Configurable printed circuit board
US8198547B2 (en) 2009-07-23 2012-06-12 Lexmark International, Inc. Z-directed pass-through components for printed circuit boards
WO2012099597A1 (en) * 2011-01-21 2012-07-26 Lexmark International, Inc. Z-directed pass- through components for printed circuit boards
US8653377B2 (en) * 2011-04-05 2014-02-18 Raytheon Company Microelectronic assemblies
US8943684B2 (en) 2011-08-31 2015-02-03 Lexmark International, Inc. Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board
US9009954B2 (en) 2011-08-31 2015-04-21 Lexmark International, Inc. Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material
US9078374B2 (en) 2011-08-31 2015-07-07 Lexmark International, Inc. Screening process for manufacturing a Z-directed component for a printed circuit board
JP6273182B2 (ja) * 2014-08-25 2018-01-31 株式会社東芝 電子機器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1069236B (xx) * 1956-09-04 1959-11-19
US3300686A (en) * 1963-07-30 1967-01-24 Ibm Compatible packaging of miniaturized circuit modules
US3372309A (en) * 1965-12-23 1968-03-05 Gen Motors Corp Multilayer electronic module
US3462832A (en) * 1966-10-24 1969-08-26 Gen Dynamics Corp Process for fabricating high density multilayer electrical interconnections
GB1187619A (en) * 1967-12-08 1970-04-08 Ferranti Ltd Improvements relating to Electrical Interconnection Grids
US3493671A (en) * 1968-11-15 1970-02-03 Norman H Horwitz Universal circuit board and method of forming same
US3605063A (en) * 1969-03-12 1971-09-14 Marvin C Stewart System for interconnecting electrical components
US3660726A (en) * 1970-10-12 1972-05-02 Elfab Corp Multi-layer printed circuit board and method of manufacture

Also Published As

Publication number Publication date
DE2233578A1 (de) 1973-01-25
GB1356632A (en) 1974-06-12
US3923359A (en) 1975-12-02

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