SE368115B - - Google Patents
Info
- Publication number
- SE368115B SE368115B SE02449/72A SE244972A SE368115B SE 368115 B SE368115 B SE 368115B SE 02449/72 A SE02449/72 A SE 02449/72A SE 244972 A SE244972 A SE 244972A SE 368115 B SE368115 B SE 368115B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB571271A GB1376748A (en) | 1971-03-01 | 1971-03-01 | Methods of manufacturing semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE368115B true SE368115B (fr) | 1974-06-17 |
Family
ID=9801226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE02449/72A SE368115B (fr) | 1971-03-01 | 1972-02-28 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3813761A (fr) |
| BE (1) | BE780066A (fr) |
| CA (1) | CA958818A (fr) |
| CH (1) | CH538196A (fr) |
| DE (1) | DE2208461A1 (fr) |
| FR (1) | FR2128465A1 (fr) |
| GB (1) | GB1376748A (fr) |
| NL (1) | NL7202402A (fr) |
| SE (1) | SE368115B (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4927778A (en) * | 1988-08-05 | 1990-05-22 | Eastman Kodak Company | Method of improving yield of LED arrays |
| DE19914323A1 (de) * | 1999-03-30 | 2000-10-26 | Kesper Druckwalzen Gmbh | Verfahren und Vorrichtung zur Herstellung eines Druckwerkzeugs |
| US20120313213A1 (en) * | 2011-06-07 | 2012-12-13 | Raytheon Company | Polygon shaped power amplifier chips |
| JP6475084B2 (ja) * | 2015-05-21 | 2019-02-27 | 臼井国際産業株式会社 | トルクセンサ用シャフトの製造設備およびその製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3193418A (en) * | 1960-10-27 | 1965-07-06 | Fairchild Camera Instr Co | Semiconductor device fabrication |
| US3187403A (en) * | 1962-04-24 | 1965-06-08 | Burroughs Corp | Method of making semiconductor circuit elements |
| US3374533A (en) * | 1965-05-26 | 1968-03-26 | Sprague Electric Co | Semiconductor mounting and assembly method |
| US3590478A (en) * | 1968-05-20 | 1971-07-06 | Sony Corp | Method of forming electrical leads for semiconductor device |
| CH507590A (de) * | 1969-06-20 | 1971-05-15 | Siemens Ag | Verfahren zum Herstellen von kleinflächigen Halbleiterbauelementen |
-
1971
- 1971-03-01 GB GB571271A patent/GB1376748A/en not_active Expired
-
1972
- 1972-02-23 DE DE19722208461 patent/DE2208461A1/de active Pending
- 1972-02-24 NL NL7202402A patent/NL7202402A/xx unknown
- 1972-02-25 CH CH273172A patent/CH538196A/de not_active IP Right Cessation
- 1972-02-28 CA CA135,674A patent/CA958818A/en not_active Expired
- 1972-02-28 SE SE02449/72A patent/SE368115B/xx unknown
- 1972-02-29 US US00230265A patent/US3813761A/en not_active Expired - Lifetime
- 1972-03-01 BE BE780066A patent/BE780066A/fr unknown
- 1972-03-01 FR FR7207040A patent/FR2128465A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| GB1376748A (en) | 1974-12-11 |
| CH538196A (de) | 1973-06-15 |
| CA958818A (en) | 1974-12-03 |
| BE780066A (fr) | 1972-09-01 |
| NL7202402A (fr) | 1972-09-05 |
| FR2128465A1 (fr) | 1972-10-20 |
| US3813761A (en) | 1974-06-04 |
| DE2208461A1 (de) | 1972-09-28 |