NL7202402A - - Google Patents
Info
- Publication number
- NL7202402A NL7202402A NL7202402A NL7202402A NL7202402A NL 7202402 A NL7202402 A NL 7202402A NL 7202402 A NL7202402 A NL 7202402A NL 7202402 A NL7202402 A NL 7202402A NL 7202402 A NL7202402 A NL 7202402A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB571271A GB1376748A (en) | 1971-03-01 | 1971-03-01 | Methods of manufacturing semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7202402A true NL7202402A (xx) | 1972-09-05 |
Family
ID=9801226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7202402A NL7202402A (xx) | 1971-03-01 | 1972-02-24 |
Country Status (9)
Country | Link |
---|---|
US (1) | US3813761A (xx) |
BE (1) | BE780066A (xx) |
CA (1) | CA958818A (xx) |
CH (1) | CH538196A (xx) |
DE (1) | DE2208461A1 (xx) |
FR (1) | FR2128465A1 (xx) |
GB (1) | GB1376748A (xx) |
NL (1) | NL7202402A (xx) |
SE (1) | SE368115B (xx) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4927778A (en) * | 1988-08-05 | 1990-05-22 | Eastman Kodak Company | Method of improving yield of LED arrays |
DE19914323A1 (de) * | 1999-03-30 | 2000-10-26 | Kesper Druckwalzen Gmbh | Verfahren und Vorrichtung zur Herstellung eines Druckwerkzeugs |
US20120313213A1 (en) * | 2011-06-07 | 2012-12-13 | Raytheon Company | Polygon shaped power amplifier chips |
JP6475084B2 (ja) * | 2015-05-21 | 2019-02-27 | 臼井国際産業株式会社 | トルクセンサ用シャフトの製造設備およびその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3193418A (en) * | 1960-10-27 | 1965-07-06 | Fairchild Camera Instr Co | Semiconductor device fabrication |
US3187403A (en) * | 1962-04-24 | 1965-06-08 | Burroughs Corp | Method of making semiconductor circuit elements |
US3374533A (en) * | 1965-05-26 | 1968-03-26 | Sprague Electric Co | Semiconductor mounting and assembly method |
US3590478A (en) * | 1968-05-20 | 1971-07-06 | Sony Corp | Method of forming electrical leads for semiconductor device |
US3716911A (en) * | 1969-06-20 | 1973-02-20 | Siemens Ag | Method of producing small area semiconductor components |
-
1971
- 1971-03-01 GB GB571271A patent/GB1376748A/en not_active Expired
-
1972
- 1972-02-23 DE DE19722208461 patent/DE2208461A1/de active Pending
- 1972-02-24 NL NL7202402A patent/NL7202402A/xx unknown
- 1972-02-25 CH CH273172A patent/CH538196A/de not_active IP Right Cessation
- 1972-02-28 SE SE02449/72A patent/SE368115B/xx unknown
- 1972-02-28 CA CA135,674A patent/CA958818A/en not_active Expired
- 1972-02-29 US US00230265A patent/US3813761A/en not_active Expired - Lifetime
- 1972-03-01 BE BE780066A patent/BE780066A/xx unknown
- 1972-03-01 FR FR7207040A patent/FR2128465A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
SE368115B (xx) | 1974-06-17 |
CH538196A (de) | 1973-06-15 |
FR2128465A1 (xx) | 1972-10-20 |
BE780066A (fr) | 1972-09-01 |
GB1376748A (en) | 1974-12-11 |
CA958818A (en) | 1974-12-03 |
DE2208461A1 (de) | 1972-09-28 |
US3813761A (en) | 1974-06-04 |