CA958818A - Method of manufacturing semiconductor devices with diagonal metallization - Google Patents

Method of manufacturing semiconductor devices with diagonal metallization

Info

Publication number
CA958818A
CA958818A CA135,674A CA135674A CA958818A CA 958818 A CA958818 A CA 958818A CA 135674 A CA135674 A CA 135674A CA 958818 A CA958818 A CA 958818A
Authority
CA
Canada
Prior art keywords
metallization
diagonal
semiconductor devices
manufacturing semiconductor
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA135,674A
Other languages
English (en)
Other versions
CA135674S (en
Inventor
Alan Foster
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA958818A publication Critical patent/CA958818A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thyristors (AREA)
CA135,674A 1971-03-01 1972-02-28 Method of manufacturing semiconductor devices with diagonal metallization Expired CA958818A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB571271A GB1376748A (en) 1971-03-01 1971-03-01 Methods of manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
CA958818A true CA958818A (en) 1974-12-03

Family

ID=9801226

Family Applications (1)

Application Number Title Priority Date Filing Date
CA135,674A Expired CA958818A (en) 1971-03-01 1972-02-28 Method of manufacturing semiconductor devices with diagonal metallization

Country Status (9)

Country Link
US (1) US3813761A (fr)
BE (1) BE780066A (fr)
CA (1) CA958818A (fr)
CH (1) CH538196A (fr)
DE (1) DE2208461A1 (fr)
FR (1) FR2128465A1 (fr)
GB (1) GB1376748A (fr)
NL (1) NL7202402A (fr)
SE (1) SE368115B (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4927778A (en) * 1988-08-05 1990-05-22 Eastman Kodak Company Method of improving yield of LED arrays
DE19914323A1 (de) * 1999-03-30 2000-10-26 Kesper Druckwalzen Gmbh Verfahren und Vorrichtung zur Herstellung eines Druckwerkzeugs
US20120313213A1 (en) * 2011-06-07 2012-12-13 Raytheon Company Polygon shaped power amplifier chips
JP6475084B2 (ja) * 2015-05-21 2019-02-27 臼井国際産業株式会社 トルクセンサ用シャフトの製造設備およびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3193418A (en) * 1960-10-27 1965-07-06 Fairchild Camera Instr Co Semiconductor device fabrication
US3187403A (en) * 1962-04-24 1965-06-08 Burroughs Corp Method of making semiconductor circuit elements
US3374533A (en) * 1965-05-26 1968-03-26 Sprague Electric Co Semiconductor mounting and assembly method
US3590478A (en) * 1968-05-20 1971-07-06 Sony Corp Method of forming electrical leads for semiconductor device
US3716911A (en) * 1969-06-20 1973-02-20 Siemens Ag Method of producing small area semiconductor components

Also Published As

Publication number Publication date
SE368115B (fr) 1974-06-17
CH538196A (de) 1973-06-15
FR2128465A1 (fr) 1972-10-20
BE780066A (fr) 1972-09-01
GB1376748A (en) 1974-12-11
DE2208461A1 (de) 1972-09-28
NL7202402A (fr) 1972-09-05
US3813761A (en) 1974-06-04

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