SE366140B - - Google Patents

Info

Publication number
SE366140B
SE366140B SE16807/70A SE1680770A SE366140B SE 366140 B SE366140 B SE 366140B SE 16807/70 A SE16807/70 A SE 16807/70A SE 1680770 A SE1680770 A SE 1680770A SE 366140 B SE366140 B SE 366140B
Authority
SE
Sweden
Application number
SE16807/70A
Inventor
T Allington
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of SE366140B publication Critical patent/SE366140B/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/255Means for correcting the capacitance value
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/02Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/032Housing; Enclosing; Embedding; Filling the housing or enclosure plural layers surrounding the resistive element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/02Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/034Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49099Coating resistive material on a base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Paints Or Removers (AREA)
  • Ceramic Capacitors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
SE16807/70A 1969-12-12 1970-12-11 SE366140B (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US88462969A 1969-12-12 1969-12-12

Publications (1)

Publication Number Publication Date
SE366140B true SE366140B (ja) 1974-04-08

Family

ID=25385018

Family Applications (1)

Application Number Title Priority Date Filing Date
SE16807/70A SE366140B (ja) 1969-12-12 1970-12-11

Country Status (9)

Country Link
US (1) US3669733A (ja)
JP (1) JPS503503B1 (ja)
BE (1) BE760176A (ja)
CA (1) CA950142A (ja)
DE (1) DE2059919A1 (ja)
FR (1) FR2073534A5 (ja)
GB (1) GB1332333A (ja)
NL (1) NL7018118A (ja)
SE (1) SE366140B (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4037315A (en) * 1975-04-28 1977-07-26 Tektronix, Inc. Thermal printing head
US4031272A (en) * 1975-05-09 1977-06-21 Bell Telephone Laboratories, Incorporated Hybrid integrated circuit including thick film resistors and thin film conductors and technique for fabrication thereof
US4041440A (en) * 1976-05-13 1977-08-09 General Motors Corporation Method of adjusting resistance of a thick-film thermistor
US4301439A (en) * 1978-12-26 1981-11-17 Electro Materials Corp. Of America Film type resistor and method of producing same
DE3000940C2 (de) * 1979-01-12 1984-02-02 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Abmischung für im Siebdruck aufzubringende Abdeckmasken und Schichtbildner
US4300184A (en) * 1979-07-11 1981-11-10 Johnson Controls, Inc. Conformal coating for electrical circuit assemblies
US4439814A (en) * 1982-08-12 1984-03-27 General Electric Company Laser adjustable capacitor and fabrication process
US4508754A (en) * 1982-08-19 1985-04-02 Gte Automatic Electric Inc. Method of adding fine line conductive/resistive patterns to a thick film microcircuit
JPH062415B2 (ja) * 1983-04-20 1994-01-12 キヤノン株式会社 インクジェットヘッド及び該インクジェットヘッドの製造方法
JPS59227101A (ja) * 1983-06-07 1984-12-20 株式会社日本自動車部品総合研究所 厚膜抵抗
US4453199A (en) * 1983-06-17 1984-06-05 Avx Corporation Low cost thin film capacitor
US4693780A (en) * 1985-02-22 1987-09-15 Siemens Aktiengesellschaft Electrical isolation and leveling of patterned surfaces
US4792779A (en) * 1986-09-19 1988-12-20 Hughes Aircraft Company Trimming passive components buried in multilayer structures
JPS63140558A (ja) * 1986-12-02 1988-06-13 Toshiba Corp 厚膜回路基板
US4938997A (en) * 1989-05-01 1990-07-03 Ag Communication Systems Corporation Process for making hybrid microcircuits providing accurate thick film resistor printing
DE19631477A1 (de) * 1996-08-03 1998-02-05 Bosch Gmbh Robert In Hybridtechnik hergestellte abgleichbare Spannungsteiler-Anordnung
JPH1154301A (ja) * 1997-08-07 1999-02-26 Murata Mfg Co Ltd チップ型サーミスタ
JP2001338801A (ja) * 2000-05-30 2001-12-07 Matsushita Electric Ind Co Ltd 抵抗器およびその製造方法
WO2009152422A1 (en) * 2008-06-13 2009-12-17 E.I. Du Pont De Nemours And Company Insulating paste for low temperature curing application
CN117877788B (zh) * 2024-01-30 2024-08-30 平江县岳峰云母新材料有限公司 一种用于电子元器件绝缘的云母纸复合材料及其制备方法

Also Published As

Publication number Publication date
CA950142A (en) 1974-06-25
US3669733A (en) 1972-06-13
NL7018118A (ja) 1971-06-15
FR2073534A5 (fr) 1971-10-01
GB1332333A (en) 1973-10-03
JPS503503B1 (ja) 1975-02-05
DE2059919A1 (de) 1971-06-16
BE760176A (fr) 1971-05-17

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