SE316536B - - Google Patents

Info

Publication number
SE316536B
SE316536B SE844466A SE844466A SE316536B SE 316536 B SE316536 B SE 316536B SE 844466 A SE844466 A SE 844466A SE 844466 A SE844466 A SE 844466A SE 316536 B SE316536 B SE 316536B
Authority
SE
Sweden
Prior art keywords
sintered
molybdenum
face
copper
plate
Prior art date
Application number
SE844466A
Other languages
English (en)
Inventor
F Kuhrt
H Schreiner
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE316536B publication Critical patent/SE316536B/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/002—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Powder Metallurgy (AREA)
SE844466A 1965-06-22 1966-06-21 SE316536B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0097721 1965-06-22

Publications (1)

Publication Number Publication Date
SE316536B true SE316536B (enExample) 1969-10-27

Family

ID=7520937

Family Applications (1)

Application Number Title Priority Date Filing Date
SE844466A SE316536B (enExample) 1965-06-22 1966-06-21

Country Status (12)

Country Link
US (1) US3858096A (enExample)
AT (1) AT263941B (enExample)
BE (1) BE682817A (enExample)
CH (1) CH449780A (enExample)
DE (1) DE1514483B2 (enExample)
DK (1) DK135650B (enExample)
ES (1) ES328163A1 (enExample)
FR (1) FR1484261A (enExample)
GB (1) GB1132748A (enExample)
NL (1) NL6608661A (enExample)
NO (1) NO119600B (enExample)
SE (1) SE316536B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2014289A1 (de) * 1970-03-25 1971-10-14 Semikron Gleichrichterbau Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung
NL7203094A (enExample) * 1971-03-11 1972-09-13
GB1506735A (en) * 1975-03-21 1978-04-12 Westinghouse Brake & Signal Semiconductor devices
US4127863A (en) * 1975-10-01 1978-11-28 Tokyo Shibaura Electric Co., Ltd. Gate turn-off type thyristor with separate semiconductor resistive wafer providing emitter ballast
DE2556469C3 (de) * 1975-12-15 1978-09-07 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement mit Druckkontakt
CS182611B1 (en) * 1976-03-18 1978-04-28 Pavel Reichel Power semiconducting element
US4392153A (en) * 1978-05-01 1983-07-05 General Electric Company Cooled semiconductor power module including structured strain buffers without dry interfaces
JPS57130441A (en) * 1981-02-06 1982-08-12 Hitachi Ltd Integrated circuit device
US4769744A (en) * 1983-08-04 1988-09-06 General Electric Company Semiconductor chip packages having solder layers of enhanced durability
JPH0642337Y2 (ja) * 1984-07-05 1994-11-02 三菱電機株式会社 半導体装置
EP0638928B1 (de) * 1993-08-09 1998-10-14 Siemens Aktiengesellschaft Leistungs-Halbleiterbauelement mit Druckkontakt
US6727524B2 (en) * 2002-03-22 2004-04-27 Kulite Semiconductor Products, Inc. P-n junction structure
US7534979B2 (en) 2004-05-14 2009-05-19 Mitsubishi Denki Kabushiki Kaisha Pressure-contact type rectifier with contact friction reducer
WO2006063539A1 (de) * 2004-12-17 2006-06-22 Siemens Aktiengesellschaft Halbleiterschaltmodul
DE102008055137A1 (de) * 2008-12-23 2010-07-01 Robert Bosch Gmbh Elektrisches oder elektronisches Verbundbauteil sowie Verfahren zum Herstellen eines elektrischen oder elektronischen Verbundbauteils
JP6845444B1 (ja) * 2019-10-15 2021-03-17 千住金属工業株式会社 接合材、接合材の製造方法及び接合体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL264799A (enExample) * 1960-06-21
US3293508A (en) * 1964-04-21 1966-12-20 Int Rectifier Corp Compression connected semiconductor device
US3413532A (en) * 1965-02-08 1968-11-26 Westinghouse Electric Corp Compression bonded semiconductor device

Also Published As

Publication number Publication date
NO119600B (enExample) 1970-06-08
ES328163A1 (es) 1967-04-01
BE682817A (enExample) 1966-12-20
CH449780A (de) 1968-01-15
DE1514483A1 (de) 1970-03-26
GB1132748A (en) 1968-11-06
DK135650B (da) 1977-05-31
FR1484261A (fr) 1967-06-09
DK135650C (enExample) 1977-10-31
NL6608661A (enExample) 1966-12-23
AT263941B (de) 1968-08-12
US3858096A (en) 1974-12-31
DE1514483B2 (de) 1971-05-06

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