SE0301144D0 - Method for producing a device - Google Patents

Method for producing a device

Info

Publication number
SE0301144D0
SE0301144D0 SE0301144A SE0301144A SE0301144D0 SE 0301144 D0 SE0301144 D0 SE 0301144D0 SE 0301144 A SE0301144 A SE 0301144A SE 0301144 A SE0301144 A SE 0301144A SE 0301144 D0 SE0301144 D0 SE 0301144D0
Authority
SE
Sweden
Prior art keywords
substrate
membrane layer
layer
membrane
sides
Prior art date
Application number
SE0301144A
Other languages
English (en)
Other versions
SE526192C2 (sv
SE0301144L (sv
Inventor
Edwin Jager
Magnus Krogh
Original Assignee
Micromuscle Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micromuscle Ab filed Critical Micromuscle Ab
Priority to SE0301144A priority Critical patent/SE526192C2/sv
Publication of SE0301144D0 publication Critical patent/SE0301144D0/sv
Priority to PCT/SE2004/000561 priority patent/WO2004092050A1/en
Priority to JP2006508015A priority patent/JP2006523540A/ja
Priority to DE602004006742T priority patent/DE602004006742T2/de
Priority to AT04726696T priority patent/ATE363454T1/de
Priority to ES04726696T priority patent/ES2287719T3/es
Priority to EP04726696A priority patent/EP1620356B1/en
Priority to US10/553,447 priority patent/US7322100B2/en
Publication of SE0301144L publication Critical patent/SE0301144L/sv
Publication of SE526192C2 publication Critical patent/SE526192C2/sv

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/008—Manufacture of substrate-free structures separating the processed structure from a mother substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/724—Devices having flexible or movable element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Glass Compositions (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Disintegrating Or Milling (AREA)
  • Catalysts (AREA)
SE0301144A 2003-04-17 2003-04-17 Metod för att framställa en anordning SE526192C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE0301144A SE526192C2 (sv) 2003-04-17 2003-04-17 Metod för att framställa en anordning
PCT/SE2004/000561 WO2004092050A1 (en) 2003-04-17 2004-04-08 Method for producing a micromachined layered device
JP2006508015A JP2006523540A (ja) 2003-04-17 2004-04-08 ミクロ機械加工された層状デバイスを作製するための方法
DE602004006742T DE602004006742T2 (de) 2003-04-17 2004-04-08 Verfahren zur herstellung einer durch mikromaterialbearbeitung hergestellten geschichteten vorrichtung
AT04726696T ATE363454T1 (de) 2003-04-17 2004-04-08 Verfahren zur herstellung einer durch mikromaterialbearbeitung hergestellten geschichteten vorrichtung
ES04726696T ES2287719T3 (es) 2003-04-17 2004-04-08 Procedimiento para la produccion de un dispositivo por capas micromecanizado.
EP04726696A EP1620356B1 (en) 2003-04-17 2004-04-08 Method for producing a micromachined layered device
US10/553,447 US7322100B2 (en) 2003-04-17 2004-04-08 Method for producing a micromachined layered device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0301144A SE526192C2 (sv) 2003-04-17 2003-04-17 Metod för att framställa en anordning

Publications (3)

Publication Number Publication Date
SE0301144D0 true SE0301144D0 (sv) 2003-04-17
SE0301144L SE0301144L (sv) 2004-10-18
SE526192C2 SE526192C2 (sv) 2005-07-26

Family

ID=20291064

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0301144A SE526192C2 (sv) 2003-04-17 2003-04-17 Metod för att framställa en anordning

Country Status (8)

Country Link
US (1) US7322100B2 (sv)
EP (1) EP1620356B1 (sv)
JP (1) JP2006523540A (sv)
AT (1) ATE363454T1 (sv)
DE (1) DE602004006742T2 (sv)
ES (1) ES2287719T3 (sv)
SE (1) SE526192C2 (sv)
WO (1) WO2004092050A1 (sv)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004037128A1 (de) * 2004-07-30 2006-03-23 Robert Bosch Gmbh Laserbearbeitung von mikromechanischen Strukturen
DE102006017549A1 (de) * 2006-04-13 2007-10-18 Imi Intelligent Medical Implants Ag Verfahren zur Herstellung von Implantatstrukturen zur Kontaktierung oder Elektrostimulation von lebenden Gewebezellen oder Nerven
US9242073B2 (en) 2006-08-18 2016-01-26 Boston Scientific Scimed, Inc. Electrically actuated annelid
DE102012224284A1 (de) * 2012-12-21 2014-06-26 Heraeus Precious Metals Gmbh & Co. Kg Dünne Metallmembran mit Träger
US11615979B2 (en) * 2019-12-18 2023-03-28 Disco Corporation Method of processing wafer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0749460A (ja) * 1993-08-06 1995-02-21 Nippondenso Co Ltd 可変焦点ミラーおよびその製造方法
SE513975C2 (sv) * 1994-08-19 2000-12-04 Telia Ab Repeterare och metod för DECT-system
SE9500849D0 (sv) * 1995-03-10 1995-03-10 Pharmacia Ab Methods for the manufacturing of micromachined structures and micromachined structures manufactured using such methods
JPH09293913A (ja) * 1996-04-25 1997-11-11 Casio Comput Co Ltd 機能性高分子素子
JPH11121900A (ja) 1997-10-15 1999-04-30 Sumitomo Electric Ind Ltd 回路基板の製造方法
JPH11288863A (ja) * 1998-04-01 1999-10-19 Mitsubishi Electric Corp Ｘ線マスクおよびその製造方法
WO2000059824A1 (de) * 1999-03-31 2000-10-12 Siemens Aktiengesellschaft Verfahren zur herstellung von freitragenden mikrostrukturen, von dünnen flachteilen oder von membranen und verwendung nach diesem verfahren hergestellter mikrostrukturen als widerstandsgitter in einer einrichtung zur messung schwacher gasströmungen
JP2004507880A (ja) 2000-04-17 2004-03-11 ザ　ペン　ステイト　リサーチ　ファンデーション 堆積された薄膜、並びに分離及び犠牲層への適用におけるその使用

Also Published As

Publication number Publication date
DE602004006742D1 (de) 2007-07-12
ATE363454T1 (de) 2007-06-15
WO2004092050A1 (en) 2004-10-28
EP1620356B1 (en) 2007-05-30
US20070050969A1 (en) 2007-03-08
SE526192C2 (sv) 2005-07-26
US7322100B2 (en) 2008-01-29
EP1620356A1 (en) 2006-02-01
ES2287719T3 (es) 2007-12-16
SE0301144L (sv) 2004-10-18
DE602004006742T2 (de) 2008-01-31
JP2006523540A (ja) 2006-10-19

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