SE0202505D0 - Method for aligning a substrate on a stage - Google Patents

Method for aligning a substrate on a stage

Info

Publication number
SE0202505D0
SE0202505D0 SE0202505A SE0202505A SE0202505D0 SE 0202505 D0 SE0202505 D0 SE 0202505D0 SE 0202505 A SE0202505 A SE 0202505A SE 0202505 A SE0202505 A SE 0202505A SE 0202505 D0 SE0202505 D0 SE 0202505D0
Authority
SE
Sweden
Prior art keywords
aligning
workpiece
stage
substrate
pickup device
Prior art date
Application number
SE0202505A
Other languages
English (en)
Inventor
Simon Raadahl
Original Assignee
Micronic Laser Systems Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=20288787&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SE0202505(D0) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Micronic Laser Systems Ab filed Critical Micronic Laser Systems Ab
Priority to SE0202505A priority Critical patent/SE0202505D0/sv
Publication of SE0202505D0 publication Critical patent/SE0202505D0/sv
Priority to EP03792919A priority patent/EP1540425A1/en
Priority to AU2003248586A priority patent/AU2003248586A1/en
Priority to JP2004530706A priority patent/JP2005536885A/ja
Priority to CNA038197677A priority patent/CN1675591A/zh
Priority to PCT/SE2003/001260 priority patent/WO2004019135A1/en
Priority to US11/061,646 priority patent/US7109510B2/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
SE0202505A 2002-08-23 2002-08-23 Method for aligning a substrate on a stage SE0202505D0 (sv)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SE0202505A SE0202505D0 (sv) 2002-08-23 2002-08-23 Method for aligning a substrate on a stage
EP03792919A EP1540425A1 (en) 2002-08-23 2003-08-11 Method for aligning a substrate on a stage
AU2003248586A AU2003248586A1 (en) 2002-08-23 2003-08-11 Method for aligning a substrate on a stage
JP2004530706A JP2005536885A (ja) 2002-08-23 2003-08-11 ステージ上で基板を整列するための方法
CNA038197677A CN1675591A (zh) 2002-08-23 2003-08-11 将衬底在工作台上对齐的方法
PCT/SE2003/001260 WO2004019135A1 (en) 2002-08-23 2003-08-11 Method for aligning a substrate on a stage
US11/061,646 US7109510B2 (en) 2002-08-23 2005-02-22 Method and apparatus for aligning a substrate on a stage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0202505A SE0202505D0 (sv) 2002-08-23 2002-08-23 Method for aligning a substrate on a stage

Publications (1)

Publication Number Publication Date
SE0202505D0 true SE0202505D0 (sv) 2002-08-23

Family

ID=20288787

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0202505A SE0202505D0 (sv) 2002-08-23 2002-08-23 Method for aligning a substrate on a stage

Country Status (7)

Country Link
US (1) US7109510B2 (sv)
EP (1) EP1540425A1 (sv)
JP (1) JP2005536885A (sv)
CN (1) CN1675591A (sv)
AU (1) AU2003248586A1 (sv)
SE (1) SE0202505D0 (sv)
WO (1) WO2004019135A1 (sv)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101261266B1 (ko) * 2010-11-03 2013-05-09 유병소 레이저 가공 장치 및 이를 이용한 레이저 가공 방법
US9622021B2 (en) * 2014-07-06 2017-04-11 Dynamount, Llc Systems and methods for a robotic mount
CN105278266B (zh) * 2014-07-07 2018-03-02 上海微电子装备（集团）股份有限公司 一种玻璃基板的偏差检测和修正方法
CN108010875B (zh) * 2016-10-31 2020-04-14 中芯国际集成电路制造(上海)有限公司 基板校准装置以及检测系统
CN108000522B (zh) * 2017-12-21 2021-02-02 金翰阳科技（大连）股份有限公司 一种基于单机器人对工件偏移后误差检测补偿方法
KR102197470B1 (ko) * 2018-11-28 2020-12-31 세메스 주식회사 기판 처리 장치
US11534859B2 (en) 2018-11-28 2022-12-27 Semes Co., Ltd. Substrate treatment apparatus
US11626305B2 (en) * 2019-06-25 2023-04-11 Applied Materials, Inc. Sensor-based correction of robot-held object
US11813757B2 (en) * 2020-10-13 2023-11-14 Applied Materials, Inc. Centerfinding for a process kit or process kit carrier at a manufacturing system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US17939A (en) * 1857-08-04 Stuart perry
US6624433B2 (en) * 1994-02-22 2003-09-23 Nikon Corporation Method and apparatus for positioning substrate and the like
US5783834A (en) * 1997-02-20 1998-07-21 Modular Process Technology Method and process for automatic training of precise spatial locations to a robot
DE19817714C5 (de) * 1998-04-21 2011-06-30 Vistec Semiconductor Systems GmbH, 35781 Verfahren zur Messung der Lage von Strukturen auf einer Maskenoberfläche
US6342705B1 (en) * 1999-09-10 2002-01-29 Chapman Instruments System for locating and measuring an index mark on an edge of a wafer
JP2001217174A (ja) * 2000-02-01 2001-08-10 Nikon Corp 位置検出方法、位置検出装置、露光方法、及び露光装置
US6806484B2 (en) * 2001-08-22 2004-10-19 Agilent Technologies, Inc. Sub-micron accuracy edge detector

Also Published As

Publication number Publication date
US20050156122A1 (en) 2005-07-21
AU2003248586A1 (en) 2004-03-11
EP1540425A1 (en) 2005-06-15
CN1675591A (zh) 2005-09-28
JP2005536885A (ja) 2005-12-02
WO2004019135A1 (en) 2004-03-04
US7109510B2 (en) 2006-09-19

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