SE0200749L - Metod och krets för impedansanpassning - Google Patents
Metod och krets för impedansanpassningInfo
- Publication number
- SE0200749L SE0200749L SE0200749A SE0200749A SE0200749L SE 0200749 L SE0200749 L SE 0200749L SE 0200749 A SE0200749 A SE 0200749A SE 0200749 A SE0200749 A SE 0200749A SE 0200749 L SE0200749 L SE 0200749L
- Authority
- SE
- Sweden
- Prior art keywords
- impedance matching
- substance
- circuit
- component carrier
- electronic component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Amplifiers (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0200749A SE0200749L (sv) | 2002-03-13 | 2002-03-13 | Metod och krets för impedansanpassning |
AU2003217107A AU2003217107A1 (en) | 2002-03-13 | 2003-03-03 | Impedance matching |
PCT/SE2003/000356 WO2003077316A1 (en) | 2002-03-13 | 2003-03-03 | Impedance matching |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0200749A SE0200749L (sv) | 2002-03-13 | 2002-03-13 | Metod och krets för impedansanpassning |
Publications (3)
Publication Number | Publication Date |
---|---|
SE0200749D0 SE0200749D0 (sv) | 2002-03-13 |
SE520309C2 SE520309C2 (sv) | 2003-06-24 |
SE0200749L true SE0200749L (sv) | 2003-06-24 |
Family
ID=20287242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0200749A SE0200749L (sv) | 2002-03-13 | 2002-03-13 | Metod och krets för impedansanpassning |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2003217107A1 (sv) |
SE (1) | SE0200749L (sv) |
WO (1) | WO2003077316A1 (sv) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04256203A (ja) * | 1991-02-07 | 1992-09-10 | Mitsubishi Electric Corp | マイクロ波帯ic用パッケージ |
WO1996039012A1 (en) * | 1995-06-01 | 1996-12-05 | The Whitaker Corporation | Electrical connection |
JP3119191B2 (ja) * | 1997-02-27 | 2000-12-18 | 株式会社村田製作所 | 平面誘電体集積回路 |
JP3067675B2 (ja) * | 1997-02-27 | 2000-07-17 | 株式会社村田製作所 | 平面誘電体集積回路 |
-
2002
- 2002-03-13 SE SE0200749A patent/SE0200749L/sv not_active IP Right Cessation
-
2003
- 2003-03-03 AU AU2003217107A patent/AU2003217107A1/en not_active Abandoned
- 2003-03-03 WO PCT/SE2003/000356 patent/WO2003077316A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
SE520309C2 (sv) | 2003-06-24 |
SE0200749D0 (sv) | 2002-03-13 |
WO2003077316A1 (en) | 2003-09-18 |
AU2003217107A1 (en) | 2003-09-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |