SE0104335D0 - An electronic assembly and a method for manufacturing the same - Google Patents

An electronic assembly and a method for manufacturing the same

Info

Publication number
SE0104335D0
SE0104335D0 SE0104335A SE0104335A SE0104335D0 SE 0104335 D0 SE0104335 D0 SE 0104335D0 SE 0104335 A SE0104335 A SE 0104335A SE 0104335 A SE0104335 A SE 0104335A SE 0104335 D0 SE0104335 D0 SE 0104335D0
Authority
SE
Sweden
Prior art keywords
manufacturing
electronic assembly
same
carrier
assembly
Prior art date
Application number
SE0104335A
Other languages
English (en)
Swedish (sv)
Inventor
Fredrik Wahledow
Jan Oehrn
Per Ferm
Jan Fallgren
Karsten Ovesen
Lars Gustafsson
Markus Persson
Per Lundstroem
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE0104335A priority Critical patent/SE0104335D0/xx
Publication of SE0104335D0 publication Critical patent/SE0104335D0/xx
Priority to TW091108427A priority patent/TW540264B/zh
Priority to EP02793728A priority patent/EP1459610A1/en
Priority to PCT/SE2002/002429 priority patent/WO2003053115A1/en
Priority to AU2002359207A priority patent/AU2002359207A1/en
Priority to CNA028258517A priority patent/CN1608397A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/027—Soldered or welded connections comprising means for positioning or holding the parts to be soldered or welded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
SE0104335A 2001-12-19 2001-12-19 An electronic assembly and a method for manufacturing the same SE0104335D0 (sv)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SE0104335A SE0104335D0 (sv) 2001-12-19 2001-12-19 An electronic assembly and a method for manufacturing the same
TW091108427A TW540264B (en) 2001-12-19 2002-04-24 An electronic assembly and a method for manufacturing the same
EP02793728A EP1459610A1 (en) 2001-12-19 2002-12-19 An electronic assembly and a method for manufacturing the same
PCT/SE2002/002429 WO2003053115A1 (en) 2001-12-19 2002-12-19 An electronic assembly and a method for manufacturing the same
AU2002359207A AU2002359207A1 (en) 2001-12-19 2002-12-19 An electronic assembly and a method for manufacturing the same
CNA028258517A CN1608397A (zh) 2001-12-19 2002-12-19 电子组件及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0104335A SE0104335D0 (sv) 2001-12-19 2001-12-19 An electronic assembly and a method for manufacturing the same

Publications (1)

Publication Number Publication Date
SE0104335D0 true SE0104335D0 (sv) 2001-12-19

Family

ID=20286434

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0104335A SE0104335D0 (sv) 2001-12-19 2001-12-19 An electronic assembly and a method for manufacturing the same

Country Status (6)

Country Link
EP (1) EP1459610A1 (zh)
CN (1) CN1608397A (zh)
AU (1) AU2002359207A1 (zh)
SE (1) SE0104335D0 (zh)
TW (1) TW540264B (zh)
WO (1) WO2003053115A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008018886A1 (de) * 2008-04-14 2009-10-15 Marquardt Gmbh Bauelement und Verfahren zu dessen Herstellung
DE102012211536A1 (de) * 2012-07-03 2014-01-09 Mahle International Gmbh Stellvorrichtung, Platine und Herstellungsverfahren
DE102022207863A1 (de) 2022-07-29 2024-02-01 Robert Bosch Gesellschaft mit beschränkter Haftung Trägerplattenanordnung mit elektronischen Bauteilen und Verfahren zur Herstellung einer Trägerplattenanordnung mit elektronischen Bauteilen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5128746A (en) * 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties
US5155904A (en) * 1991-04-03 1992-10-20 Compaq Computer Corporation Reflow and wave soldering techniques for bottom side components
JPH0738251A (ja) * 1993-07-21 1995-02-07 Sony Corp 電子部品の実装方法
US5639010A (en) * 1995-08-31 1997-06-17 Ford Motor Company Simultaneous process for surface mount adhesive cure and solder paste reflow for surface mount technology devices
US6202917B1 (en) * 1998-08-19 2001-03-20 Hughes Electronics Corporation Co-processing of adhesive curing and solder reflow in an electronic assembly operation

Also Published As

Publication number Publication date
CN1608397A (zh) 2005-04-20
WO2003053115A1 (en) 2003-06-26
EP1459610A1 (en) 2004-09-22
TW540264B (en) 2003-07-01
AU2002359207A1 (en) 2003-06-30

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