SE0102994L - Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet - Google Patents

Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet

Info

Publication number
SE0102994L
SE0102994L SE0102994A SE0102994A SE0102994L SE 0102994 L SE0102994 L SE 0102994L SE 0102994 A SE0102994 A SE 0102994A SE 0102994 A SE0102994 A SE 0102994A SE 0102994 L SE0102994 L SE 0102994L
Authority
SE
Sweden
Prior art keywords
card
electrolyte
state
copper
cathode
Prior art date
Application number
SE0102994A
Other languages
Unknown language ( )
English (en)
Other versions
SE519898C2 (sv
SE0102994D0 (sv
Inventor
Goeran Frennesson
Gust Bierings
Bjarni Bjarnason
Jenny Sjoeberg
Original Assignee
Obducat Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Obducat Ab filed Critical Obducat Ab
Priority to SE0102994A priority Critical patent/SE519898C2/sv
Publication of SE0102994D0 publication Critical patent/SE0102994D0/sv
Priority to JP2003528080A priority patent/JP4216718B2/ja
Priority to AT02798066T priority patent/ATE397843T1/de
Priority to AU2002334517A priority patent/AU2002334517A1/en
Priority to EP02798066A priority patent/EP1425948B1/en
Priority to DE60226984T priority patent/DE60226984D1/de
Priority to CNA028176588A priority patent/CN1554215A/zh
Priority to US10/487,745 priority patent/US7767074B2/en
Priority to PCT/SE2002/001602 priority patent/WO2003024172A2/en
Publication of SE0102994L publication Critical patent/SE0102994L/sv
Publication of SE519898C2 publication Critical patent/SE519898C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Catalysts (AREA)
SE0102994A 2001-09-10 2001-09-10 Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet SE519898C2 (sv)

Priority Applications (9)

Application Number Priority Date Filing Date Title
SE0102994A SE519898C2 (sv) 2001-09-10 2001-09-10 Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet
PCT/SE2002/001602 WO2003024172A2 (en) 2001-09-10 2002-09-09 A method of etching copper on cards
EP02798066A EP1425948B1 (en) 2001-09-10 2002-09-09 A method of etching copper on cards
AT02798066T ATE397843T1 (de) 2001-09-10 2002-09-09 Verfahren zum ätzen von kupfer auf karten
AU2002334517A AU2002334517A1 (en) 2001-09-10 2002-09-09 A method of etching copper on cards
JP2003528080A JP4216718B2 (ja) 2001-09-10 2002-09-09 基板への銅エッチング方法、デバイスおよびこれに用いる電解液
DE60226984T DE60226984D1 (de) 2001-09-10 2002-09-09 Verfahren zum ätzen von kupfer auf karten
CNA028176588A CN1554215A (zh) 2001-09-10 2002-09-09 腐蚀卡上的铜的方法
US10/487,745 US7767074B2 (en) 2001-09-10 2002-09-09 Method of etching copper on cards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0102994A SE519898C2 (sv) 2001-09-10 2001-09-10 Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet

Publications (3)

Publication Number Publication Date
SE0102994D0 SE0102994D0 (sv) 2001-09-10
SE0102994L true SE0102994L (sv) 2003-03-11
SE519898C2 SE519898C2 (sv) 2003-04-22

Family

ID=20285274

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0102994A SE519898C2 (sv) 2001-09-10 2001-09-10 Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet

Country Status (9)

Country Link
US (1) US7767074B2 (sv)
EP (1) EP1425948B1 (sv)
JP (1) JP4216718B2 (sv)
CN (1) CN1554215A (sv)
AT (1) ATE397843T1 (sv)
AU (1) AU2002334517A1 (sv)
DE (1) DE60226984D1 (sv)
SE (1) SE519898C2 (sv)
WO (1) WO2003024172A2 (sv)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005011298A1 (de) * 2005-03-04 2006-09-07 Gebr. Schmid Gmbh & Co. Vorrichtung und Verfahren zum Ätzen von Substraten
FR2937054B1 (fr) 2008-10-13 2010-12-10 Commissariat Energie Atomique Procede et dispositif de decontamination d'une surface metallique.
EP2508267B1 (de) * 2011-04-04 2014-06-11 J. Wagner AG Umkehrbare Beschichtungsmaterialdüse für eine Spritzpistole zum Beschichten eines Werkstücks mit Beschichtungsmaterial
KR102179814B1 (ko) * 2013-11-08 2020-11-17 엘지전자 주식회사 가전기기용 외장 패널 및 그 제조방법
TWI703241B (zh) * 2017-09-28 2020-09-01 南韓商奧森里德股份有限公司 電解研磨用電極框架及包括其的電解研磨裝置
IT201700110569A1 (it) * 2017-10-03 2019-04-03 Univ Degli Studi Di Palermo Apparato e metodo per il recupero di rame a partire da scarti di dispositivi elettrici ed elettronici

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1362159A (en) * 1917-04-04 1920-12-14 Jackson S Weeks Composition for electrolytes for electrical etching
NL268373A (sv) * 1960-08-23
JPS5313177B2 (sv) * 1973-06-20 1978-05-08
DE2850542C2 (de) * 1978-11-22 1982-07-01 Kernforschungsanlage Jülich GmbH, 5170 Jülich Verfahren zum Ätzen von Oberflächen aus Kupfer oder Kupferlegierungen
DE3020012C2 (de) * 1980-05-24 1983-03-03 Daimler-Benz Ag, 7000 Stuttgart Verfahren zum Freilegen der Siliciumkristalle an der Oberfläche eines Körpers aus einer Aluminiumlegierung mit hohem Siliciumgehalt
US4973380A (en) * 1983-10-06 1990-11-27 Olin Corporation Process for etching copper base materials
US5035778A (en) * 1989-05-12 1991-07-30 International Business Machines Corporation Regeneration of spent ferric chloride etchants
US5302240A (en) * 1991-01-22 1994-04-12 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device
US5196053A (en) * 1991-11-27 1993-03-23 Mcgean-Rohco, Inc. Complexing agent for displacement tin plating
US5284554A (en) 1992-01-09 1994-02-08 International Business Machines Corporation Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces
WO1998010121A1 (en) * 1996-09-06 1998-03-12 Obducat Ab Method for anisotropic etching of structures in conducting materials
DE69821044T2 (de) * 1997-04-25 2004-06-17 Fuji Photo Film Co., Ltd., Minami-Ashigara Verfahren zur Herstellung eines Aluminiumträgers für lithographische Druckplatten
EP0889680A3 (en) 1997-07-01 2000-07-05 Deutsche Thomson-Brandt Gmbh Method of removing and/or applying conductive material
JP4431203B2 (ja) 1998-08-10 2010-03-10 義和 小林 塩化第二鉄エッチング液の管理装置
US6638686B2 (en) * 1999-12-09 2003-10-28 Fuji Photo Film Co., Ltd. Planographic printing plate

Also Published As

Publication number Publication date
US7767074B2 (en) 2010-08-03
EP1425948B1 (en) 2008-06-04
AU2002334517A1 (en) 2003-03-24
JP2005502785A (ja) 2005-01-27
EP1425948A2 (en) 2004-06-09
CN1554215A (zh) 2004-12-08
ATE397843T1 (de) 2008-06-15
DE60226984D1 (de) 2008-07-17
SE519898C2 (sv) 2003-04-22
US20050082257A1 (en) 2005-04-21
JP4216718B2 (ja) 2009-01-28
WO2003024172A3 (en) 2003-06-05
WO2003024172A2 (en) 2003-03-20
SE0102994D0 (sv) 2001-09-10
WO2003024172A8 (en) 2004-05-06

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