SE0002764L - Förfarande för att åstadkomma ett elektriskt ledande mönster på ett substrat - Google Patents

Förfarande för att åstadkomma ett elektriskt ledande mönster på ett substrat

Info

Publication number
SE0002764L
SE0002764L SE0002764A SE0002764A SE0002764L SE 0002764 L SE0002764 L SE 0002764L SE 0002764 A SE0002764 A SE 0002764A SE 0002764 A SE0002764 A SE 0002764A SE 0002764 L SE0002764 L SE 0002764L
Authority
SE
Sweden
Prior art keywords
conductive
substrate
providing
electrically conductive
conductive pattern
Prior art date
Application number
SE0002764A
Other languages
English (en)
Swedish (sv)
Other versions
SE0002764D0 (sv
Inventor
Peter L Gill
Joseph W Ramsey
Original Assignee
Peter L Gill
Joseph W Ramsey
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peter L Gill, Joseph W Ramsey filed Critical Peter L Gill
Publication of SE0002764D0 publication Critical patent/SE0002764D0/xx
Publication of SE0002764L publication Critical patent/SE0002764L/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
SE0002764A 1999-08-02 2000-07-26 Förfarande för att åstadkomma ett elektriskt ledande mönster på ett substrat SE0002764L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/365,618 US6308406B1 (en) 1998-08-12 1999-08-02 Method for forming an electrical conductive circuit on a substrate

Publications (2)

Publication Number Publication Date
SE0002764D0 SE0002764D0 (sv) 2000-07-26
SE0002764L true SE0002764L (sv) 2001-02-03

Family

ID=23439611

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0002764A SE0002764L (sv) 1999-08-02 2000-07-26 Förfarande för att åstadkomma ett elektriskt ledande mönster på ett substrat

Country Status (6)

Country Link
US (1) US6308406B1 (xx)
AU (1) AU4505100A (xx)
CA (1) CA2314049A1 (xx)
DE (1) DE10035638A1 (xx)
GB (1) GB2355596A (xx)
SE (1) SE0002764L (xx)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000332369A (ja) * 1999-05-25 2000-11-30 Mitsui Mining & Smelting Co Ltd プリント回路板及びその製造方法
US6640435B2 (en) * 2001-02-20 2003-11-04 Power Integrations, Inc. Methods for trimming electrical parameters in an electrical circuit
WO2002080637A1 (en) 2001-04-02 2002-10-10 Nashua Corporation Circuit elements having an embedded conductive trace and methods of manufacture
US6951798B2 (en) * 2001-06-08 2005-10-04 Wisconsin Alumni Research Foundation Method of bonding a stack of layers by electromagnetic induction heating
EP1383364A3 (en) * 2002-05-23 2006-01-04 Nashua Corporation Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture
EP1661053A4 (en) * 2003-08-08 2012-06-13 Shmuel Shapira SYSTEM AND METHOD FOR CIRCUIT FORMATION
US7220920B1 (en) 2004-01-23 2007-05-22 Hutchinson Technology Incorporated Flexible electrical circuit with slotted coverlay
US7621043B2 (en) * 2005-11-02 2009-11-24 Checkpoint Systems, Inc. Device for making an in-mold circuit
NL1030664C2 (nl) * 2005-12-13 2007-06-14 Meco Equip Eng Werkwijze voor het verbinden van sporen aan tegenover elkaar gelegen zijden van een drager.
JP5161617B2 (ja) * 2008-03-03 2013-03-13 日本メクトロン株式会社 フレキシブル回路基板、及びその製造方法
EP2642838A4 (en) 2010-11-19 2016-08-31 Toppan Printing Co Ltd PATTERN LAMINATED METAL SHEET, METHOD FOR PUNCHING METAL SHEET, CIRCUIT BOARD, METHOD FOR PRODUCING SAME, AND SOLAR CELL MODULE
EP2720519B1 (en) * 2011-06-06 2017-11-29 Toppan Printing Co., Ltd. Metal foil patterned-laminate and a solar cell module

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3445921A (en) * 1966-12-15 1969-05-27 Superior Electric Co Method of making a printed circuit board master
US3911716A (en) * 1971-05-21 1975-10-14 Jerobee Ind Inc Circuit board, method of making the circuit board and improved die for making said board
JPH01129396A (ja) * 1987-11-14 1989-05-22 Tokai Kinzoku Kk 共振タグおよびその製造法
JP3209772B2 (ja) * 1991-07-08 2001-09-17 株式会社フジクラ リジッドフレックス配線板の製造方法
US5950305A (en) * 1992-02-14 1999-09-14 Research Organization For Circuit Knowledge Environmentally desirable method of manufacturing printed circuits
JP2665134B2 (ja) * 1993-09-03 1997-10-22 日本黒鉛工業株式会社 フレキシブル回路基板及びその製造方法
JPH07221435A (ja) * 1994-02-07 1995-08-18 Sumitomo Wiring Syst Ltd フレキシブルプリント基板
TNSN97123A1 (fr) * 1996-07-18 1999-12-31 Droz Francois Procede de fabrication de transpondeurs et transpondeur fabrique selon ce procede
DE69617753T2 (de) * 1996-07-18 2002-08-08 Nagraid S A Verfahren zur herstellung von gedruckten schaltungen sowie nach diesem verfahren hergestellte gedruckte schaltung
US6032357A (en) * 1998-06-16 2000-03-07 Lear Automotive Dearborn, Inc. Method of fabricating a printed circuit
US6087940A (en) * 1998-07-28 2000-07-11 Novavision, Inc. Article surveillance device and method for forming

Also Published As

Publication number Publication date
DE10035638A1 (de) 2001-02-15
GB2355596A (en) 2001-04-25
CA2314049A1 (en) 2001-02-02
AU4505100A (en) 2001-02-08
SE0002764D0 (sv) 2000-07-26
GB0017613D0 (en) 2000-09-06
US6308406B1 (en) 2001-10-30

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Legal Events

Date Code Title Description
NAV Patent application has lapsed