RU99120781A - MODULE FOR A CHIP CARD AND METHOD FOR ITS MANUFACTURE, AND ALSO A CHIP CARD, INCLUDING SUCH A MODULE - Google Patents

MODULE FOR A CHIP CARD AND METHOD FOR ITS MANUFACTURE, AND ALSO A CHIP CARD, INCLUDING SUCH A MODULE

Info

Publication number
RU99120781A
RU99120781A RU99120781/09A RU99120781A RU99120781A RU 99120781 A RU99120781 A RU 99120781A RU 99120781/09 A RU99120781/09 A RU 99120781/09A RU 99120781 A RU99120781 A RU 99120781A RU 99120781 A RU99120781 A RU 99120781A
Authority
RU
Russia
Prior art keywords
module according
semiconductor chip
module
chip card
connecting frame
Prior art date
Application number
RU99120781/09A
Other languages
Russian (ru)
Other versions
RU2217795C2 (en
Inventor
Детлев УДО
Франк ПЮШНЕР
Петер Штампка
Михель Хубер
Йозеф Хайтцер
Йозеф Мундигл
Original Assignee
Сименс Акциенгезелльшафт
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19708617A external-priority patent/DE19708617C2/en
Application filed by Сименс Акциенгезелльшафт filed Critical Сименс Акциенгезелльшафт
Publication of RU99120781A publication Critical patent/RU99120781A/en
Application granted granted Critical
Publication of RU2217795C2 publication Critical patent/RU2217795C2/en

Links

Claims (10)

1. Модуль (1) для чип-карты, включающий в себя полупроводниковый чип, находящийся в электропроводящем контакте с металлической присоединительной рамкой (2), в которой выполнены контактные площадки (3), отличающийся тем, что полупроводниковый чип, по меньшей мере, на одной стороне снабжен электроизолирующим защитным слоем, на обращенной от полупроводникового чипа поверхности (4) которого выполнены выводы (5), находящиеся в электропроводящем соединении с местами контактирования полупроводникового чипа, при этом полупроводниковый чип с выводами (5) предварительно надет на присоединительную рамку (2) и находится в электропроводящем контакте через выводы (3) с контактными площадками (3).1. The module (1) for the chip card, which includes a semiconductor chip in electrically conductive contact with a metal connecting frame (2), in which the contact pads (3) are made, characterized in that the semiconductor chip is at least one side is provided with an electrically insulating protective layer, on the surface (4) facing away from the semiconductor chip of which the terminals (5) are made, which are in an electrically conductive connection with the contact points of the semiconductor chip, while the semiconductor chip with the terminals (5) pre-fitted onto a connecting frame (2) and is in electrically conductive contact via the outlets (3) with contact pads (3). 2. Модуль по п.1, отличающийся тем, что выводы (5) припаяны к контактным площадкам (3). 2. The module according to claim 1, characterized in that the conclusions (5) are soldered to the pads (3). 3. Модуль по п.2, отличающийся тем, что выводы (5) закреплены на контактных площадках (3) посредством пайки нагретым воздухом. 3. The module according to claim 2, characterized in that the conclusions (5) are fixed to the contact pads (3) by soldering with heated air. 4. Модуль по п.3, отличающийся тем, что паяное соединение (6) состоит из оловянно-свинцового припоя. 4. The module according to claim 3, characterized in that the solder joint (6) consists of tin-lead solder. 5. Модуль по п. 1, отличающийся тем, что выводы (5) приклеены к контактным площадкам (3) электропроводящим клеем. 5. The module according to claim 1, characterized in that the terminals (5) are glued to the contact pads (3) with an electrically conductive adhesive. 6. Модуль по одному из пп.1-5, отличающийся тем, что присоединительная рамка (2) состоит из меди или медного сплава. 6. The module according to one of claims 1 to 5, characterized in that the connecting frame (2) consists of copper or a copper alloy. 7. Модуль по п.6, отличающийся тем, что присоединительная рамка (2) состоит из сплава меди и олова, в частности из СuSn6.7. The module according to claim 6, characterized in that the connecting frame (2) consists of an alloy of copper and tin, in particular of CuSn 6 . 8. Модуль по одному из пп.1-7, отличающийся тем, что полупроводниковый чип снабжен на верхней и нижней сторонах электроизолирующими защитными слоями. 8. The module according to one of claims 1 to 7, characterized in that the semiconductor chip is provided on the upper and lower sides with electrically insulating protective layers. 9. Модуль по одному из пп.1-7, отличающийся тем, что полупроводниковый чип окружен со всех сторон электроизолирующим корпусом (7). 9. The module according to one of claims 1 to 7, characterized in that the semiconductor chip is surrounded on all sides by an electrically insulating housing (7). 10. Чип-карта (10), отличающаяся тем, что она включает в себя модуль (1) по одному из пп.1-9. 10. A chip card (10), characterized in that it includes a module (1) according to one of claims 1 to 9.
RU99120781/09A 1997-03-03 1998-02-06 Chip card module and method for its manufacture, and also chip card incorporating such module RU2217795C2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19708617A DE19708617C2 (en) 1997-03-03 1997-03-03 Chip card module and method for its production as well as this comprehensive chip card
DE19708617.9 1997-03-03

Publications (2)

Publication Number Publication Date
RU99120781A true RU99120781A (en) 2001-08-27
RU2217795C2 RU2217795C2 (en) 2003-11-27

Family

ID=7822094

Family Applications (1)

Application Number Title Priority Date Filing Date
RU99120781/09A RU2217795C2 (en) 1997-03-03 1998-02-06 Chip card module and method for its manufacture, and also chip card incorporating such module

Country Status (12)

Country Link
US (1) US6191951B1 (en)
EP (1) EP0965103B1 (en)
JP (1) JP2001513928A (en)
KR (1) KR20000075916A (en)
CN (1) CN1191617C (en)
AT (1) ATE222387T1 (en)
BR (1) BR9808171A (en)
DE (2) DE19708617C2 (en)
ES (1) ES2182279T3 (en)
RU (1) RU2217795C2 (en)
UA (1) UA58538C2 (en)
WO (1) WO1998039733A1 (en)

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