RU2676178C1 - Излучающий ультрафиолетовый свет нитридный полупроводниковый элемент - Google Patents
Излучающий ультрафиолетовый свет нитридный полупроводниковый элемент Download PDFInfo
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- RU2676178C1 RU2676178C1 RU2018105571A RU2018105571A RU2676178C1 RU 2676178 C1 RU2676178 C1 RU 2676178C1 RU 2018105571 A RU2018105571 A RU 2018105571A RU 2018105571 A RU2018105571 A RU 2018105571A RU 2676178 C1 RU2676178 C1 RU 2676178C1
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- Prior art keywords
- layer
- active layer
- light emitting
- nitride semiconductor
- aln
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- 150000004767 nitrides Chemical class 0.000 title claims abstract description 50
- 239000004065 semiconductor Substances 0.000 claims abstract description 55
- 229910002704 AlGaN Inorganic materials 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 12
- 239000010980 sapphire Substances 0.000 claims abstract description 12
- 230000005855 radiation Effects 0.000 claims description 49
- 238000009826 distribution Methods 0.000 claims description 15
- 230000007423 decrease Effects 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 329
- 230000000694 effects Effects 0.000 abstract description 6
- 239000012792 core layer Substances 0.000 abstract 1
- 238000004870 electrical engineering Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 230000003746 surface roughness Effects 0.000 description 42
- 239000011247 coating layer Substances 0.000 description 31
- 238000005204 segregation Methods 0.000 description 27
- 238000000034 method Methods 0.000 description 18
- 238000000089 atomic force micrograph Methods 0.000 description 14
- 239000013078 crystal Substances 0.000 description 13
- 238000001228 spectrum Methods 0.000 description 12
- 230000004888 barrier function Effects 0.000 description 11
- 238000000295 emission spectrum Methods 0.000 description 8
- 230000000903 blocking effect Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 210000001161 mammalian embryo Anatomy 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/002—Devices characterised by their operation having heterojunctions or graded gap
- H01L33/0025—Devices characterised by their operation having heterojunctions or graded gap comprising only AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
- H01L33/18—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/070656 WO2017013729A1 (ja) | 2015-07-21 | 2015-07-21 | 窒化物半導体紫外線発光素子 |
Publications (1)
Publication Number | Publication Date |
---|---|
RU2676178C1 true RU2676178C1 (ru) | 2018-12-26 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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RU2018105571A RU2676178C1 (ru) | 2015-07-21 | 2015-07-21 | Излучающий ультрафиолетовый свет нитридный полупроводниковый элемент |
Country Status (8)
Country | Link |
---|---|
US (1) | US10297715B2 (ja) |
EP (1) | EP3293774B1 (ja) |
JP (1) | JP6194138B2 (ja) |
KR (1) | KR101995152B1 (ja) |
CN (1) | CN107636847B (ja) |
RU (1) | RU2676178C1 (ja) |
TW (2) | TWI617051B (ja) |
WO (1) | WO2017013729A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2719339C1 (ru) * | 2017-02-15 | 2020-04-17 | Соко Кагаку Ко., Лтд. | Способ изготовления нитридного полупроводникового излучающего ультрафиолетовое излучение элемента и нитридный полупроводниковый излучающий ультрафиолетовое излучение элемент |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6867180B2 (ja) * | 2017-02-01 | 2021-04-28 | 日機装株式会社 | 半導体発光素子の製造方法 |
DE102017113383B4 (de) * | 2017-06-19 | 2023-03-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips |
JP6998146B2 (ja) * | 2017-08-03 | 2022-01-18 | 旭化成株式会社 | 紫外線発光素子及び紫外線照射モジュール |
JP6649324B2 (ja) * | 2017-08-09 | 2020-02-19 | 創光科学株式会社 | 窒化物半導体紫外線発光素子及び窒化物半導体紫外線発光素子の製造方法 |
US11152543B2 (en) * | 2017-11-22 | 2021-10-19 | Soko Kagaku Co., Ltd. | Nitride semiconductor light-emitting element |
EP3754732B1 (en) * | 2018-02-14 | 2023-04-12 | Soko Kagaku Co., Ltd. | Nitride semiconductor ultraviolet light-emitting element |
JP6698925B1 (ja) | 2019-08-06 | 2020-05-27 | 日機装株式会社 | 窒化物半導体発光素子 |
JP7141425B2 (ja) * | 2020-04-28 | 2022-09-22 | 日機装株式会社 | 窒化物半導体発光素子 |
CN115699341A (zh) * | 2020-06-24 | 2023-02-03 | 创光科学株式会社 | 氮化物半导体紫外线发光元件 |
US20230197889A1 (en) * | 2020-06-24 | 2023-06-22 | Nikkiso Co., Ltd. | Nitride semiconductor ultraviolet light-emitting element and production method therefor |
JP7462047B2 (ja) | 2020-07-07 | 2024-04-04 | 日機装株式会社 | 窒化物半導体紫外線発光素子及びその製造方法 |
CN113054063B (zh) * | 2021-02-04 | 2023-03-14 | 中国科学院宁波材料技术与工程研究所 | 紫外发光二极管、紫外led外延层结构及其制备方法 |
Citations (4)
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JP2007101146A (ja) * | 2005-10-07 | 2007-04-19 | Matsushita Electric Ind Co Ltd | ダクトファン |
RU2412505C2 (ru) * | 2005-08-24 | 2011-02-20 | ФИЛИПС ЛЬЮМИЛДЗ ЛАЙТИНГ КОМПАНИ, ЭлЭлСи | Iii-нитридное светоизлучающее устройство со светоизлучающей областью с двойной гетероструктурой |
WO2013021464A1 (ja) * | 2011-08-09 | 2013-02-14 | 創光科学株式会社 | 窒化物半導体紫外線発光素子 |
US20140103289A1 (en) * | 2010-04-30 | 2014-04-17 | Yitao Liao | High efficiency ultraviolet light emitting diode with band structure potential fluctuations |
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TW418549B (en) | 1998-06-26 | 2001-01-11 | Sharp Kk | Crystal growth method for nitride semiconductor, nitride semiconductor light emitting device, and method for producing the same |
JP2002016000A (ja) | 2000-06-27 | 2002-01-18 | Sanyo Electric Co Ltd | 窒化物系半導体素子および窒化物系半導体基板 |
JP2003347226A (ja) | 2002-05-30 | 2003-12-05 | Sumitomo Chem Co Ltd | 3−5族化合物半導体の製造方法及び化合物半導体素子 |
SE527445C2 (sv) * | 2003-03-25 | 2006-03-07 | Telia Ab | Lägesanpassat skyddsintervall för OFDM-kommunikation |
JP2004335635A (ja) * | 2003-05-06 | 2004-11-25 | National Institute Of Advanced Industrial & Technology | 微傾斜基板を用いた窒化物半導体薄膜素子及びその素子の製造方法 |
JP2006060164A (ja) * | 2004-08-24 | 2006-03-02 | National Institute Of Advanced Industrial & Technology | 窒化物半導体デバイスおよび窒化物半導体結晶成長方法 |
JP4304497B2 (ja) | 2004-08-26 | 2009-07-29 | パナソニック電工株式会社 | 半導体素子 |
JP4538476B2 (ja) | 2007-08-27 | 2010-09-08 | 独立行政法人理化学研究所 | 半導体構造の形成方法 |
JP2010016092A (ja) | 2008-07-02 | 2010-01-21 | Sharp Corp | 窒化物系半導体発光素子 |
JP2010135733A (ja) | 2008-11-07 | 2010-06-17 | Panasonic Corp | 窒化物半導体レーザ装置及びその製造方法 |
KR101697486B1 (ko) | 2009-11-10 | 2017-01-18 | 가부시키가이샤 도쿠야마 | 적층체의 제조방법 |
JP2011204804A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | 化合物半導体装置及びその製造方法 |
JP5948698B2 (ja) | 2012-04-13 | 2016-07-06 | パナソニックIpマネジメント株式会社 | 紫外発光素子およびその製造方法 |
CN103236477B (zh) * | 2013-04-19 | 2015-08-12 | 安徽三安光电有限公司 | 一种led外延结构及其制备方法 |
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2015
- 2015-07-21 EP EP15898889.9A patent/EP3293774B1/en active Active
- 2015-07-21 CN CN201580080488.6A patent/CN107636847B/zh active Active
- 2015-07-21 WO PCT/JP2015/070656 patent/WO2017013729A1/ja active Application Filing
- 2015-07-21 JP JP2017529199A patent/JP6194138B2/ja active Active
- 2015-07-21 RU RU2018105571A patent/RU2676178C1/ru active
- 2015-07-21 US US15/573,824 patent/US10297715B2/en active Active
- 2015-07-21 KR KR1020177036943A patent/KR101995152B1/ko active IP Right Grant
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2016
- 2016-04-07 TW TW105110924A patent/TWI617051B/zh active
- 2016-04-07 TW TW106145367A patent/TWI703741B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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RU2412505C2 (ru) * | 2005-08-24 | 2011-02-20 | ФИЛИПС ЛЬЮМИЛДЗ ЛАЙТИНГ КОМПАНИ, ЭлЭлСи | Iii-нитридное светоизлучающее устройство со светоизлучающей областью с двойной гетероструктурой |
JP2007101146A (ja) * | 2005-10-07 | 2007-04-19 | Matsushita Electric Ind Co Ltd | ダクトファン |
US20140103289A1 (en) * | 2010-04-30 | 2014-04-17 | Yitao Liao | High efficiency ultraviolet light emitting diode with band structure potential fluctuations |
WO2013021464A1 (ja) * | 2011-08-09 | 2013-02-14 | 創光科学株式会社 | 窒化物半導体紫外線発光素子 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2719339C1 (ru) * | 2017-02-15 | 2020-04-17 | Соко Кагаку Ко., Лтд. | Способ изготовления нитридного полупроводникового излучающего ультрафиолетовое излучение элемента и нитридный полупроводниковый излучающий ультрафиолетовое излучение элемент |
US10643849B2 (en) | 2017-02-15 | 2020-05-05 | Soko Kagaku Co., Ltd. | Manufacturing method of nitride semiconductor ultraviolet light emitting element, and nitride semiconductor ultraviolet light emitting element |
Also Published As
Publication number | Publication date |
---|---|
TWI617051B (zh) | 2018-03-01 |
JPWO2017013729A1 (ja) | 2017-10-12 |
TW201813128A (zh) | 2018-04-01 |
EP3293774B1 (en) | 2020-03-18 |
CN107636847A (zh) | 2018-01-26 |
KR101995152B1 (ko) | 2019-07-02 |
US10297715B2 (en) | 2019-05-21 |
TW201705529A (zh) | 2017-02-01 |
US20180261725A1 (en) | 2018-09-13 |
WO2017013729A1 (ja) | 2017-01-26 |
JP6194138B2 (ja) | 2017-09-06 |
TWI703741B (zh) | 2020-09-01 |
EP3293774A4 (en) | 2018-08-08 |
KR20180011242A (ko) | 2018-01-31 |
CN107636847B (zh) | 2020-07-28 |
EP3293774A1 (en) | 2018-03-14 |
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