RU2169962C2 - Module with semiconductor integrated circuits and its manufacturing process - Google Patents

Abstract

FIELD: electronic engineering. SUBSTANCE: module 4 has first and second semiconductor integrated circuits 40, 6 and insulating strip layer 5. First semiconductor integrating circuit 40 has wiring surface that carries first contact pads. Insulating strip layer 5 has first and second opposing adhesive surfaces 51. First adhesive surface is adhered to contact-pad surface on first integrated surface 40. Insulating strip layer 5 is provided with holes at locating points of first contact pads which are meant to open the latter. Each hole is bounded by wall; the latter and respective contact pad form cavity to receive the contact. Electricity-conducting contacts 54 are inserted in respective cavities. Second semiconductor integrated circuit 6 has its wiring surface 61 joined with second adhesive surface 51 of insulating strip layer 5. Wiring surface 61 carries contact pads 60 connected to electricity-conducting contacts 54 to provide for electrical connection to first contact pads. Proposed process for manufacturing module 4 given in description of invention provides for locating great number of memory integrated circuits without increasing size of printed-circuit board. EFFECT: provision for reducing length of signal transmission channel to minimize delay time. 21 cl, 11 dwg

Description

 The present invention relates to a module with semiconductor microcircuits and a method for manufacturing it, and more particularly, to a module with semiconductor microcircuits, which has a relatively short signal transmission path between semiconductor microcircuits and which takes up relatively little space on the board.

 Due to the growing tendency to use faster chips for processors, the allowable delay time of the access signal to the peripheral memory chip is getting shorter and shorter. Therefore, the designer needs to find a way to shorten the signal path between the processor chip and the peripheral memory chip. On the other hand, due to the growing need to increase memory capacity, the number of memory chips on the printed circuit board is increasing. However, the PCB area is limited. Thus, the main concern of the designers was to solve the problem of placing a large number of memory chips, while ensuring minimal negative impact on the board.

 A known module with semiconductor chips (patent JP 2-58793), containing the first semiconductor chip having a mounting surface with many located on it the first contact pads; a dielectric tape layer made with many holes in the locations of the first contact pads, and intended to expose the first contact pads; a plurality of electrically conductive contacts and a mounting surface with a plurality of second contact pads disposed thereon, which are connected to the electrically conductive contacts to provide electrical connection to the first contact pads.

 Also known is a method of manufacturing a module with semiconductor chips (patent JP 2-58793), including the implementation of a dielectric tape layer with many holes provided at the locations of the first contact pads made on the mounting surface of the first semiconductor chip and designed to expose the first contact pads, the connection of the second contact pads, made on another mounting surface, with conductive contacts with the provision of electrical connection with the first pads.

 As can be seen from the above, a module with semiconductor chips and the method of its production do not solve the problem of placing a large number of chips while saving space, because each chip must be placed on a circuit board.

 The main objective of the present invention is to provide such a module with semiconductor microcircuits and such a method of manufacturing this module with semiconductor microcircuits, in the application of which the signal transmission path can be shortened so as to provide a minimum delay time.

 Another objective of the present invention is to provide such a module with semiconductor microcircuits and such a method of manufacturing this module with semiconductor microcircuits, in the application of which a large number of memory microcircuits can be placed on a printed circuit board without a significant increase in the size of the printed circuit board.

 In accordance with one aspect of the present invention, a semiconductor chip module comprises: a first semiconductor chip having a mounting surface with a plurality of first contact pads disposed thereon; a dielectric tape layer made with many holes in the locations of the first contact pads, and intended to expose the first contact pads; a plurality of electrically conductive contacts and a mounting surface with a plurality of second contact pads disposed thereon, which are connected to the electrically conductive contacts to provide electrical connection to the first contact pads, according to the invention, the mounting surface with a plurality of second contact pads disposed thereon is a mounting surface of a second semiconductor chip; the dielectric tape layer has opposite first and second adhesive surfaces; the first adhesive surface is adhered to the mounting surface of the first semiconductor chip, wherein each of the holes is bounded by a wall, which together with the corresponding one of the first contact pads forms a receiving space for the contact; many electrically conductive contacts are located respectively in the receiving spaces for the contacts; the mounting surface of the second semiconductor chip is coupled to the second adhesive surface.

 It is desirable that the second adhesive surface be coated with thermoset adhesive, the curing temperature of which is lower than the melting temperature of the electrically conductive contacts.

 Preferably, the semiconductor chip module further comprises a contact frame on which a second semiconductor chip is mounted.

 Also, the module with semiconductor microcircuits further comprises a plastic case in which the first and second semiconductor microcircuits and a contact frame are packed.

 In addition, the module with semiconductor microcircuits further comprises a printed circuit board on which the second semiconductor microcircuit is mounted, wherein the printed circuit board is arranged with third contact pads located thereon, which are electrically connected to the second semiconductor microcircuit, and may further comprise a plastic case in which first and second semiconductor chips.

 Preferably, the first semiconductor chip is a memory chip, and the second semiconductor chip is a processor chip.

 It is also desirable that each of the electrically conductive contacts is a tin ball or is formed from an electrically conductive paste or an electrically conductive material that has been subjected to chemical electrolytic deposition prior to joining with the second contact pads.

 In accordance with another aspect of the present invention, a method of manufacturing a module with semiconductor chips includes making a dielectric tape layer with a plurality of holes provided at locations of the first contact pads made on the mounting surface of the first semiconductor chip and intended to expose the first contact pads, connecting the second contact pads pads made on another mounting surface with conductive contacts providing electrical electrically connecting to the first contact pads, according to the invention, before connecting the second contact pads made on another mounting surface, which is the mounting surface of the second semiconductor chip, providing electrical connection to the first contact pads, the first adhesive surface of the dielectric tape layer is bonded to the mounting surface of the first a semiconductor chip, with each of the holes being bounded by a wall that locally with the first contact pad corresponding to it forms a receiving space for contact; placing a plurality of electrically conductive contacts, respectively, in the receiving spaces for the contacts; the adhesion of the mounting surface of the second semiconductor chip with the second adhesive surface of the dielectric tape layer, opposite to the first adhesive surface.

 It is desirable that the second adhesive surface be coated with thermoset adhesive, the curing temperature of which is lower than the melting temperature of the conductive contacts, and the adhesion of the second semiconductor chip with the dielectric tape layer and the second contact pads are connected to the conductive contacts simultaneously by thermosetting so that the mounting surface of the second the semiconductor chip was already bonded to the second adhesive surface before melting conductive contacts.

 In addition, the adhesion of the dielectric tape layer with the first semiconductor chip is carried out by thermosetting the adhesive used for applying to the first adhesive surface.

 The method further comprises the step of mounting a second semiconductor chip on a contact frame.

 In addition, they carry out the operation of molding the plastic case and packaging the first and second semiconductor microcircuits of the contact frame, as well as the operations of mounting the second semiconductor microcircuit on a printed circuit board and connecting the second semiconductor microcircuit with conductors with third contact pads made on the printed circuit board.

 In addition, the method further comprises the step of forming a plastic case, packaging the first and second semiconductor chips.

 And preferably, the first semiconductor chip is a memory chip, and the second semiconductor chip is a processor chip.

 It is also desirable that each of the conductive contacts is a tin ball.

 And also, preferably, each of the electrically conductive contacts is formed of an electrically conductive paste or of an electrically conductive material, which is subjected to chemical and electrolytic deposition before joining with the second contacts.

Other features and advantages of the present invention will become apparent from the following detailed description of preferred embodiments thereof, which is carried out with reference to the drawings, in which:
FIG. 1 to 5 are schematic views illustrating individual operations of a first preferred embodiment of a module with semiconductor chips in accordance with the present invention;
FIG. 6 is a perspective view of a second preferred embodiment of a semiconductor chip module in accordance with the present invention;
FIG. 7 is a schematic view of a third preferred embodiment of a semiconductor chip module in accordance with the present invention;
FIG. 8 is a perspective view of a fourth preferred embodiment of a semiconductor chip module in accordance with the present invention;
FIG. 9 is a schematic view of a fifth preferred embodiment of a module with semiconductor chips in accordance with the present invention in one of its intermediate manufacturing steps;
FIG. 10 and 11 are schematic views illustrating certain operations of a sixth preferred embodiment of a semiconductor chip module in accordance with the present invention.

 Before proceeding to a more detailed presentation of the present invention, it should be noted that the same elements in the drawings are denoted by the same positions.

 As can be seen from FIG. 1-5, a first preferred embodiment of a semiconductor chip module 4 in accordance with the present invention comprises a first semiconductor chip 40, a dielectric tape layer 5, and a second semiconductor chip 6.

 The first semiconductor chip 40 has a mounting surface 42 for pads with a plurality of first pads 41 disposed thereon. In this embodiment, the first semiconductor chip 40 is a memory chip. The dielectric tape layer 5 has opposite first and second adhesive surfaces 50, 51. It is intended to use a thermosetting adhesive 55 to be applied to the first adhesive surface 50, whereby the surface 50 can be bonded - glued to the mounting surface 42 under the contact pads on the first semiconductor chip 40 in the time it takes to cure. The use of conventional laser cutting technology for making a plurality of holes 52 in the dielectric tape layer 5 at the locations of the first contact pads 41 is provided in order to expose the latter.

 Each of the holes 52 is bounded by a wall 53, which, respectively, with the corresponding hole 52 of one of the first contact pads 41 form a receiving space for contact. It is envisaged to place a plurality of electrically conductive contacts 54 respectively in the receiving spaces for the contacts. In this embodiment, a tin ball is inserted into each receiving space under the contact, which serves as the electrical conductive contact 54.

 The second semiconductor chip 6 has a mounting surface 61 for mounting the chip, made with many located on the second contact pads 60, which must be combined with the conductive contacts 54 and connected with them. In this embodiment, the second semiconductor chip 6 is a processor chip, such as a video processor, a graphics processor, or an integrated circuit controller for special applications. A thermosetting operation is performed to connect the electrically conductive contacts 54 to the second contact pads 60 and also to adhere, in this case, glue the surface 61 for mounting the microcircuit to the second adhesive surface 51 on the dielectric tape layer 5. It is preferable that the second surface 51 is coated with a thermoset adhesive 55, the curing temperature of which is lower than the melting temperature of the conductive contacts 54. Thus, the mounting surface 61 for mounting the chip will already be coupled with the second adhesive surface 51 even before the conductive contacts 54 melt, so that the receiving spaces for the contacts are sealed, as a result of which the conductive contact melt 54 is prevented from flowing out of the corresponding receiving space under this contact, thereby avoiding the formation of undesired connections with adjacent electrically conductive contacts 54.

 Then, the second semiconductor chip 6 is mounted in the contact frame 7 in the usual way. After that, using well-known technological methods, the plastic case 8 is molded into which the first and second semiconductor microcircuits 40, 6 and the contact frame 7 are packed, which is the final step in the manufacture of module 4 with semiconductor microcircuits.

 As can be seen from FIG. 6, which shows a second preferred embodiment of a semiconductor chip module in accordance with the present invention, two or more of the first semiconductor chips 40 can be mounted on a second semiconductor chip 6 using a method similar to that used in the manufacture of the first preferred embodiment.

 As can be seen from FIG. 7, a third preferred embodiment of a semiconductor chip module in accordance with the present invention is shown as being substantially similar to the first embodiment. However, in this embodiment of the invention, instead of being mounted on the contact frame, the second semiconductor chip 6 is mounted on the printed circuit board 9, while the second semiconductor chip 6 is electrically connected to the third pads 90 located on the printed circuit board 9. Then, when using Known technological methods carry out the molding of a plastic housing 8, which packs the first and second semiconductor chips 40, 6.

 As can be seen from FIG. 8, which shows a fourth preferred embodiment of a semiconductor chip module according to the present invention, the third preferred embodiment can be modified so that two or more of the first semiconductor microcircuits 40 are mounted on the second semiconductor microcircuit 6.

 As can be seen from FIG. 9, in a fifth preferred embodiment of the semiconductor chip module according to the present invention, instead of using tin balls as the conductive contacts, an electrically conductive paste, for example, such as an electrically conductive silver paste, is used to form each contact 54 '.

 As can be seen from FIG. 10 and 11, in a sixth preferred embodiment of the semiconductor chip module according to the present invention, each contact 54 ″ is formed by placing an electrically conductive metal material 56, such as, for example, a gold or aluminum ball, in each receiving space under the contact. After that, the chemical process of electrolytic deposition was carried out, completing the formation of each contact 54 '' before connecting to the second contact pads on a second semiconductor chip (not shown).

 It should be noted that the signal path between the first and second semiconductor microcircuits 40 and 6 becomes significantly shorter in the module 4 with semiconductor microcircuits made in accordance with this invention. In addition, since the first semiconductor chip 40 does not take up space on the printed circuit board, the area of the printed circuit board can be used more efficiently when module 4 with semiconductor chips is installed thereon. Thus, the goals set during the creation of the present invention are achieved.

 The present invention has been described in connection with those variants of its implementation that are considered the most practical and preferred, however, this does not mean that this invention is limited only by the variants of its implementation disclosed here, it is understood that it also covers its various changes, which do not go beyond the essence and volume in their broadest interpretation so as to encompass all such modifications and corresponding changes.

Claims (21)

 1. A module (4) with semiconductor microcircuits, comprising a first semiconductor microcircuit (40) having a mounting surface (42) with a plurality of first contact pads located thereon (41), a dielectric tape layer (5) made with a plurality of holes (52) at the locations of the first contact pads (41), and intended to expose the first contact pads (41), a plurality of electrically conductive contacts (54, 54 ', 54 ") and a mounting surface (61) with a plurality of second contact pads located on it (60) which connect s with conductive contacts (54, 54 ', 54 ") providing electrical connection with the first contact pads (41), characterized in that the mounting surface (61) with a plurality of second contact pads located on it (60) is a mounting surface (61 ) of the second semiconductor chip (6), the dielectric tape layer (5) has opposite first and second adhesive surfaces (50, 51), the first adhesive surface (50) is adhered to the mounting surface (42) of the first semiconductor chip (40), each and holes (52) is limited by the wall (53), which together with the corresponding one of the first contact pads (41) forms a receiving space for the contact, many electrically conductive contacts (54, 54 ', 54 ") are placed respectively in the receiving spaces for the contacts, mounting the surface (61) of the second semiconductor chip (6) is adhered to the second adhesive surface (51).  2. A module (4) with semiconductor chips according to claim 1, characterized in that the second adhesive surface (51) is covered with thermoset adhesive (55), the curing temperature of which is lower than the melting temperature of the electrically conductive contacts (54, 54 ', 54 ") .  3. A module (4) with semiconductor chips according to claim 1, characterized in that it further comprises a contact frame (7), in which a second semiconductor chip (6) is mounted.  4. A module (4) with semiconductor microcircuits according to claim 3, characterized in that it further comprises a plastic case (8) in which the first and second semiconductor microcircuits (40, 6) and the contact frame (7) are packed.  5. A module (4) with semiconductor microcircuits according to claim 1, characterized in that it further comprises a printed circuit board (9) on which a second semiconductor microcircuit is mounted (6), the printed circuit board (9) having third contact pads located on it (90) which are electrically connected to the second semiconductor chip (6).  6. A module (4) with semiconductor chips according to claim 5, characterized in that it further comprises a plastic case (8) in which the first and second semiconductor chips are packed (40, 6).  7. A module (4) with a semiconductor chip according to claim 1, characterized in that the first semiconductor chip (40) is a memory chip, and the second semiconductor chip (6) is a processor chip.  8. A module (4) with semiconductor chips according to claim 1, characterized in that each of the conductive contacts (54) is a tin ball.  9. A module (4) with semiconductor chips according to claim 1, characterized in that each of the conductive contacts (54 ') is formed of an electrically conductive paste.  10. A module (4) with semiconductor chips according to claim 1, characterized in that each of the conductive contacts (54 '') is formed of an electrically conductive material (56), which is subjected to chemical electrolytic deposition before being connected to the second contact pads (60).  11. A method of manufacturing a module (4) with semiconductor chips, including the implementation of a dielectric tape layer (5) with many holes (52) provided in the locations of the first contact pads (41) made on the mounting surface (42) of the first semiconductor chip (40) and designed to expose the first contact pads (41), connecting the second contact pads (60), made on another mounting surface (61), with electrically conductive contacts (54, 54 ', 54' ') to ensure electrical connection with the first contact pads (41), characterized in that before connecting the second contact pads (60) made on another mounting surface (61), which is the mounting surface (61) of the second semiconductor chip (6), providing electrical connection with the first contact pads (41), carry out the adhesion of the first adhesive surface (50) of the dielectric tape layer (5) with the mounting surface (42) of the first semiconductor chip (40), with each of the holes (52) bounded by the wall (53), together with the first contact pad (41) corresponding to it, forms a receiving space for the contact, placing a plurality of electrically conductive contacts (54, 54 ', 54 "), respectively, in the receiving spaces for the contacts, coupling the mounting surface (61) of the second semiconductor chip (6) with the second adhesive surface (51) of the dielectric tape layer (5), opposite to the first adhesive surface (50).  12. The method according to claim 11, characterized in that the second adhesive surface (51) is coated with thermoset adhesive (55), the curing temperature of which is lower than the melting temperature of the electrically conductive contacts (54, 54 ', 54 "), and the adhesion of the second semiconductor chip (6) with a dielectric tape layer (5) and the connection of the second contact pads (60) with the conductive contacts (54, 54 ', 54 ") is carried out simultaneously by performing a heat curing operation so that the mounting surface (61) of the second semiconductor chip is already engaged with the second adhesive surface (51) to melt the electrically conductive contacts (54, 54 ', 54 ").  13. The method according to claim 11, characterized in that the coupling of the dielectric tape layer (5) with the first semiconductor chip (40) is carried out by thermosetting the glue (55) used for applying to the first adhesive surface (50).  14. The method according to claim 11, characterized in that it further comprises the step of mounting a second semiconductor chip (6) on a contact frame (7).  15. The method according to claim 11, characterized in that it further comprises the step of forming a plastic case (8) and packaging the first and second semiconductor chips (40, 6) and the contact frame (7).  16. The method according to claim 11, characterized in that it further comprises the steps of mounting a second semiconductor chip (6) on a printed circuit board (9) and connecting the second semiconductor chip (6) with conductors with third contact pads (90) made on the printed circuit board ( 9).  17. The method according to clause 16, characterized in that it further comprises the step of forming a plastic housing (8), packaging the first and second semiconductor chips (40, 6).  18. The method according to p. 11, characterized in that the first semiconductor chip (40) is a memory chip, and the second semiconductor chip (6) is a processor chip.  19. The method according to claim 11, characterized in that each of the conductive contacts (54) is a tin ball.  20. The method according to claim 11, characterized in that each of the conductive contacts (54 ') is formed from an electrically conductive paste.  21. The method according to claim 11, characterized in that each of the electrically conductive contacts (54 ") is formed from an electrically conductive material (56), which is subjected to chemical electrolytic deposition before connecting to the second contact pads (60).

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