RU2020105517ARU2020105517ARU2020105517ARU2020105517ARU 2020105517 ARU2020105517 ARU 2020105517ARU 2020105517 ARU2020105517 ARU 2020105517ARU 2020105517 ARU2020105517 ARU 2020105517ARU 2020105517 ARU2020105517 ARU 2020105517A
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Electric Connection Of Electric Components To Printed Circuits
(AREA)
Claims (2)
Низкотемпературный припой на основе олова, содержащий висмут и никель, отличающийся тем, что он дополнительно содержит серебро, медь и редкоземельный элемент при следующем соотношении компонентов, мас.%:Low-temperature tin-based solder containing bismuth and nickel, characterized in that it additionally contains silver, copper and a rare earth element in the following ratio of components, wt%:BiBi55-6055-60AgAg0,32-0,420.32-0.42CuCu0,42-0,50.42-0.5NiNi0,1-0,30.1-0.3РЗМREM0,01-0,10.01-0.1SnSnОстальноеRest
RU2020105517A2020-02-062020-02-06
Tin Based Low Temperature Solder
RU2020105517A
(en)