CN100566911C - No-lead soft soldering - Google Patents
No-lead soft soldering Download PDFInfo
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- CN100566911C CN100566911C CNB2006100112642A CN200610011264A CN100566911C CN 100566911 C CN100566911 C CN 100566911C CN B2006100112642 A CNB2006100112642 A CN B2006100112642A CN 200610011264 A CN200610011264 A CN 200610011264A CN 100566911 C CN100566911 C CN 100566911C
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- soft soldering
- lead soft
- lead
- snag
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Abstract
The present invention relates to a kind of no-lead soft soldering, it is characterized in that it is made up of following by weight percentage: Ag 0.1～3.9%, La 0.01～1.0% and Sn surplus, in above-mentioned no-lead soft soldering, also add 0.01～1.5% Cu, in above-mentioned two kinds no-lead soft soldering, also add 0.001～0.05% P and 0.001～0.05% Ga, no-lead soft soldering of the present invention is SnAgLa., SnAgLaCu, SnAg LaPGa and SnAg La CuPGa, it is good to have wetability, oxidation resistance is strong, the solder joint surface-brightening, grain refinement improves anti-folding and draws performance, reduce or eliminate the advantage and the effect of solder joint bridging.
Description
Technical field
The present invention relates to a kind of no-lead soft soldering, belong to welding material.
Background technology
Enhancing along with people's environmental consciousness, environmental regulation improve day by day and strict, though tin-lead solder has excellent wetability, weldability, advantages such as good mechanical performance and low price, but lead and compound are the harmful poisonous goods and materials of harm humans health and contaminated environment, therefore need no-lead soft soldering to replace traditional tin-lead solder in the electronics industry, particularly along with the lightweight of electronic product, miniaturization, microminiaturized lifting is strict more to the quality requirement of electronic product, existing lead-free solder majority is SnAg, SnCu, SnAgCu, SnCuNi, also there is minority to add mishmetal, its weak point is the fusing point height that has, the crystallization that has is thicker, the wetability that has is poor, the easy oxidation that has, the easy segregation phenomena that produces in fusion process that has.
Summary of the invention
Purpose of the present invention is just in order to overcome shortcoming that above-mentioned prior art exists with not enough and provide a kind of and have that wetability is good, oxidation resistance is strong, the no-lead soft soldering of solder joint surface-brightening, thus satisfy the unleaded requirement of electronic product.
The objective of the invention is to realize by following technical proposal:
No-lead soft soldering is characterized in that it is made up of following weight percentages:
Ag 0.1～3.9%, La 0.01～1.0% and Sn surplus.
Wherein preferred Ag consumption is that 0.1～3.5%La consumption is 0.01～0.1%, in above-mentioned no-lead soft soldering, also add 0.01～1.5% Cu, wherein preferred Cu consumption is 0.5～1.5%, also add 0.001～0.05% P and 0.001～0.05% Ga in above-mentioned two kinds no-lead soft soldering, series leadless solder of the present invention is SnAgLa, SnAgLaCu, SnAg LaPGa and SnAg LaCu PGa.
Product of the present invention is to add the La component on the basis of traditional SnAg no-lead soft soldering, can the refinement alloy grain, thereby improve the mechanical property of scolder and the characteristic of creep resistant fatigue, and can improve anti-folding and draw performance, add Cu again and can strengthen the tensile strength of scolder, add P and Ga on this basis again, both also are used in the scolder pot of fusion and can purify liquid level, eliminate the solder joint bridging, the generation of scolder pot surface metal oxide simultaneously, thereby reduced cost, therefore the performance of series of products of the present invention all is greatly improved.
Formulation of series products of the present invention is smelted by traditional method, the purity of each raw material of selecting for use: Sn is 99.5%, Cu 〉=99.5%, La 〉=99.9%, Ni 〉=99.5%, P and Ga 〉=99.5%, with Sn is major ingredient, the intermediate alloy of Ag, Cu, La, P and Ga and Sn adds, and can be made into solder stick, soldering tin bar, solder ball and soldering paste product, thereby can satisfy components and parts immersed solder, PCB assembling, MST microelectronics surface encapsulation and surface-pasted welding needs.
Product of the present invention and SnCu main performance compare, and its result is as follows:
1, solderability sees Table 1
Table 1 solderability comparative result
| Product | SnAg | SnAgLa | SnAgLaCu | SnAgLaPGa | SnAgLaCuPGa. |
| Wetting power (mN) | 0.596 | 0.622 | 0.613 | 0.622 | 0.613 |
2, fusing point sees Table 2
Table 2 fusing point comparative result
| Product | SnAg | SnAgLa | SnAgLaCu | SnAgLaPGa | SnAgLaCuPGa |
| Fusing point (℃) | 225 | 222 | 224 | 222 | 224 |
3, the rate of spread sees Table 3
Table 3 rate of spread comparative result
| Product | SnAg | SnAgLa | SnAgLaCu | SnAgLaPGa | SnAgLaCuPGa |
| The rate of spread (%) | 75.13 | 77.27 | 76.30 | 77.27 | 76.30 |
4, oxidation resistance sees Table 4
Table 4 oxidation resistance comparative result
| Product | SnAg | SnAgLa | SnAgLaCu | SnAgLaPGa | SnAgLaCuPGa. |
| Oxidation resistance (250 ℃) | 10 seconds liquid levels of static maintenance down are oxidized | 10 seconds liquid levels of static maintenance down are oxidized | 10 seconds liquid levels of static maintenance down are oxidized | 4 hours liquid levels of static maintenance down still are silvery white | 4 hours liquid levels of static maintenance down still are silvery white |
All be significantly improved in the rate of spread and oxidation resistance from above-mentioned comparative result product of the present invention as can be seen, and fusing point is also very close, illustrates that the performance of this product is fine.
Because take that technique scheme makes that compared with the prior art the technology of the present invention has that wetability is good, oxidation resistance is strong, solder joint surface-brightening, grain refinement and reduce or eliminate the advantage and the effect of solder joint bridging.
The specific embodiment
Embodiment
Claims (1)
1, no-lead soft soldering is characterized in that it is made up of following weight percentages:
Ag 1.8～3.3％、La 0.02～0.06％ Cu 0.1～1.3％
P 0.005～0.03% Ga 0.005～0.03% and Sn surplus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100112642A CN100566911C (en) | 2006-01-24 | 2006-01-24 | No-lead soft soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100112642A CN100566911C (en) | 2006-01-24 | 2006-01-24 | No-lead soft soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1919523A CN1919523A (en) | 2007-02-28 |
| CN100566911C true CN100566911C (en) | 2009-12-09 |
Family
ID=37777433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100112642A Expired - Fee Related CN100566911C (en) | 2006-01-24 | 2006-01-24 | No-lead soft soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100566911C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107097015A (en) * | 2017-06-07 | 2017-08-29 | 廊坊邦壮电子材料有限公司 | A kind of silver alloy solder and its preparation technology |
-
2006
- 2006-01-24 CN CNB2006100112642A patent/CN100566911C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1919523A (en) | 2007-02-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091209 Termination date: 20160124 |
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| EXPY | Termination of patent right or utility model |