RU2016118623A3 - - Google Patents
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- RU2016118623A3 RU2016118623A3 RU2016118623A RU2016118623A RU2016118623A3 RU 2016118623 A3 RU2016118623 A3 RU 2016118623A3 RU 2016118623 A RU2016118623 A RU 2016118623A RU 2016118623 A RU2016118623 A RU 2016118623A RU 2016118623 A3 RU2016118623 A3 RU 2016118623A3
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- RU
- Russia
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18322—Position of the structure
- H01S5/18327—Structure being part of a DBR
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13188872.9 | 2013-10-16 | ||
EP13188872 | 2013-10-16 | ||
PCT/EP2014/071938 WO2015055600A1 (en) | 2013-10-16 | 2014-10-14 | Compact laser device |
Publications (3)
Publication Number | Publication Date |
---|---|
RU2016118623A RU2016118623A (ru) | 2017-11-20 |
RU2016118623A3 true RU2016118623A3 (ru) | 2018-05-15 |
RU2672155C2 RU2672155C2 (ru) | 2018-11-12 |
Family
ID=49356317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU2016118623A RU2672155C2 (ru) | 2013-10-16 | 2014-10-14 | Компактный лазерный прибор |
Country Status (6)
Country | Link |
---|---|
US (2) | US10116119B2 (ru) |
EP (1) | EP3058592B1 (ru) |
JP (1) | JP6550381B2 (ru) |
CN (1) | CN105637634A (ru) |
RU (1) | RU2672155C2 (ru) |
WO (1) | WO2015055600A1 (ru) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015055600A1 (en) * | 2013-10-16 | 2015-04-23 | Koninklijke Philips N.V. | Compact laser device |
US10181701B2 (en) | 2015-04-10 | 2019-01-15 | Koninklijke Philips N.V. | Safe laser device for optical sensing applications |
EP3217428B1 (de) * | 2016-03-07 | 2022-09-07 | Infineon Technologies AG | Mehrfachsubstrat sowie verfahren zu dessen herstellung |
JP2017204640A (ja) | 2016-05-11 | 2017-11-16 | 晶元光電股▲ふん▼有限公司Epistar Corporation | 発光デバイス及びその製造方法 |
EP3392290B8 (de) * | 2017-04-18 | 2020-11-11 | Ems-Chemie Ag | Polyamidformmasse und daraus hergestellter formkörper |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5587452A (en) * | 1978-12-26 | 1980-07-02 | Fujitsu Ltd | Manufacture of semiconductor device |
US6272160B1 (en) * | 1998-02-03 | 2001-08-07 | Applied Micro Circuits Corporation | High-speed CMOS driver for vertical-cavity surface-emitting lasers |
US6465744B2 (en) * | 1998-03-27 | 2002-10-15 | Tessera, Inc. | Graded metallic leads for connection to microelectronic elements |
DE19954093A1 (de) * | 1999-11-10 | 2001-05-23 | Infineon Technologies Ag | Anordnung für Hochleistungslaser |
US6465774B1 (en) * | 2000-06-30 | 2002-10-15 | Honeywell International Inc. | Method and system for versatile optical sensor package |
US6888871B1 (en) * | 2000-07-12 | 2005-05-03 | Princeton Optronics, Inc. | VCSEL and VCSEL array having integrated microlenses for use in a semiconductor laser pumped solid state laser system |
US6415977B1 (en) | 2000-08-30 | 2002-07-09 | Micron Technology, Inc. | Method and apparatus for marking and identifying a defective die site |
US7085300B2 (en) * | 2001-12-28 | 2006-08-01 | Finisar Corporation | Integral vertical cavity surface emitting laser and power monitor |
US7164702B1 (en) | 2003-08-29 | 2007-01-16 | The United States Of America As Represented By The Secretary Of The Army | Optical transmitters and interconnects using surface-emitting lasers and micro-optical elements |
JP2005158945A (ja) * | 2003-11-25 | 2005-06-16 | Fanuc Ltd | 半導体レーザ装置 |
JP4584066B2 (ja) * | 2004-12-10 | 2010-11-17 | 韓國電子通信研究院 | 光感知器を備えた面発光レーザ素子及びこれを用いた光導波路素子 |
JP4839662B2 (ja) * | 2005-04-08 | 2011-12-21 | 富士ゼロックス株式会社 | 面発光半導体レーザアレイおよびそれを用いた光伝送システム |
JP5055717B2 (ja) | 2005-06-20 | 2012-10-24 | 富士ゼロックス株式会社 | 面発光型半導体レーザ |
US7233025B2 (en) * | 2005-11-10 | 2007-06-19 | Microsoft Corporation | Electronic packaging for optical emitters and sensors |
JP5034662B2 (ja) | 2006-06-20 | 2012-09-26 | ソニー株式会社 | 面発光型半導体レーザおよびその製造方法 |
EP2054980B1 (en) * | 2006-08-23 | 2013-01-09 | Ricoh Company, Ltd. | Surface-emitting laser array, optical scanning device, and image forming device |
JP4858032B2 (ja) * | 2006-09-15 | 2012-01-18 | 日亜化学工業株式会社 | 発光装置 |
US8102893B2 (en) * | 2007-06-14 | 2012-01-24 | Necsel Intellectual Property | Multiple emitter VECSEL |
KR101360294B1 (ko) * | 2008-05-21 | 2014-02-11 | 광주과학기술원 | 반사형 광학 센서장치 |
JP5261754B2 (ja) * | 2008-11-27 | 2013-08-14 | 株式会社リコー | 面発光レーザ素子、面発光レーザアレイ、光走査装置及び画像形成装置 |
US8995493B2 (en) * | 2009-02-17 | 2015-03-31 | Trilumina Corp. | Microlenses for multibeam arrays of optoelectronic devices for high frequency operation |
US7949024B2 (en) | 2009-02-17 | 2011-05-24 | Trilumina Corporation | Multibeam arrays of optoelectronic devices for high frequency operation |
JP5658691B2 (ja) | 2009-02-25 | 2015-01-28 | コーニンクレッカ フィリップス エヌ ヴェ | フォトン冷却依存レーザー電圧を使用するレーザーダイオードのための出力パワーの安定化 |
JP6026884B2 (ja) * | 2009-08-10 | 2016-11-16 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 能動的なキャリヤの閉じ込めを伴う垂直共振器型面発光レーザ |
US9620934B2 (en) * | 2010-08-31 | 2017-04-11 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Flip-chip assembly comprising an array of vertical cavity surface emitting lasers (VCSELs) |
JP5874227B2 (ja) | 2011-07-22 | 2016-03-02 | 富士ゼロックス株式会社 | 面発光型半導体レーザアレイ、面発光型半導体レーザ装置、光伝送装置および情報処理装置 |
US9088134B2 (en) * | 2011-07-27 | 2015-07-21 | Vixar Inc. | Method and apparatus including improved vertical-cavity surface-emitting lasers |
WO2013136205A2 (en) | 2012-03-14 | 2013-09-19 | Koninklijke Philips N.V. | Vcsel module and manufacture thereof. |
JP5477728B2 (ja) * | 2013-05-13 | 2014-04-23 | 株式会社リコー | 面発光レーザアレイ |
WO2015055600A1 (en) * | 2013-10-16 | 2015-04-23 | Koninklijke Philips N.V. | Compact laser device |
-
2014
- 2014-10-14 WO PCT/EP2014/071938 patent/WO2015055600A1/en active Application Filing
- 2014-10-14 RU RU2016118623A patent/RU2672155C2/ru not_active IP Right Cessation
- 2014-10-14 EP EP14783863.5A patent/EP3058592B1/en active Active
- 2014-10-14 JP JP2016522763A patent/JP6550381B2/ja active Active
- 2014-10-14 CN CN201480056961.2A patent/CN105637634A/zh active Pending
- 2014-10-14 US US15/028,546 patent/US10116119B2/en active Active
-
2018
- 2018-10-18 US US16/164,209 patent/US10707646B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN105637634A (zh) | 2016-06-01 |
US10116119B2 (en) | 2018-10-30 |
US10707646B2 (en) | 2020-07-07 |
RU2016118623A (ru) | 2017-11-20 |
RU2672155C2 (ru) | 2018-11-12 |
EP3058592A1 (en) | 2016-08-24 |
US20160254640A1 (en) | 2016-09-01 |
EP3058592B1 (en) | 2021-12-29 |
US20190052048A1 (en) | 2019-02-14 |
JP6550381B2 (ja) | 2019-07-24 |
JP2016533639A (ja) | 2016-10-27 |
WO2015055600A1 (en) | 2015-04-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | The patent is invalid due to non-payment of fees |
Effective date: 20201015 |