RU2010126546A - Магнитный экранирующий уплотнитель и способ заполнения зазора в системе защиты от электромагнитной несовместимости - Google Patents

Магнитный экранирующий уплотнитель и способ заполнения зазора в системе защиты от электромагнитной несовместимости Download PDF

Info

Publication number
RU2010126546A
RU2010126546A RU2010126546/07A RU2010126546A RU2010126546A RU 2010126546 A RU2010126546 A RU 2010126546A RU 2010126546/07 A RU2010126546/07 A RU 2010126546/07A RU 2010126546 A RU2010126546 A RU 2010126546A RU 2010126546 A RU2010126546 A RU 2010126546A
Authority
RU
Russia
Prior art keywords
magnetic
seal according
shielding seal
magnetic shielding
conductive
Prior art date
Application number
RU2010126546/07A
Other languages
English (en)
Russian (ru)
Inventor
Вэй Де ЛИУ (CN)
Вэй Де ЛИУ
Original Assignee
3М Инновейтив Пропертиз Компани (US)
3М Инновейтив Пропертиз Компани
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3М Инновейтив Пропертиз Компани (US), 3М Инновейтив Пропертиз Компани filed Critical 3М Инновейтив Пропертиз Компани (US)
Publication of RU2010126546A publication Critical patent/RU2010126546A/ru

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/13—Amorphous metallic alloys, e.g. glassy metals
    • H01F10/138—Amorphous metallic alloys, e.g. glassy metals containing nanocrystallites, e.g. obtained by annealing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/13—Amorphous metallic alloys, e.g. glassy metals
    • H01F10/131—Amorphous metallic alloys, e.g. glassy metals containing iron or nickel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/13—Amorphous metallic alloys, e.g. glassy metals
    • H01F10/132—Amorphous metallic alloys, e.g. glassy metals containing cobalt

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
RU2010126546/07A 2007-12-29 2008-12-12 Магнитный экранирующий уплотнитель и способ заполнения зазора в системе защиты от электромагнитной несовместимости RU2010126546A (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNA2007103081496A CN101472455A (zh) 2007-12-29 2007-12-29 电磁屏蔽衬垫和用于填充电磁屏蔽系统中的间隙的方法
CN200710308149.6 2007-12-29

Publications (1)

Publication Number Publication Date
RU2010126546A true RU2010126546A (ru) 2012-02-10

Family

ID=40824988

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2010126546/07A RU2010126546A (ru) 2007-12-29 2008-12-12 Магнитный экранирующий уплотнитель и способ заполнения зазора в системе защиты от электромагнитной несовместимости

Country Status (9)

Country Link
US (1) US20100276193A1 (enExample)
EP (1) EP2236018B1 (enExample)
JP (1) JP2011508452A (enExample)
KR (1) KR20100094564A (enExample)
CN (1) CN101472455A (enExample)
BR (1) BRPI0821429A2 (enExample)
CA (1) CA2710948A1 (enExample)
RU (1) RU2010126546A (enExample)
WO (1) WO2009085660A2 (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008028259A1 (de) * 2008-06-13 2009-12-17 Bmdsys Gmbh Verfahren zur Verbindung hochpermeabler Teile einer magnetischen Abschirmung
CN102893378A (zh) 2009-11-09 2013-01-23 3M创新有限公司 用于半导体的蚀刻工艺
CN102598223B (zh) 2009-11-09 2015-03-25 3M创新有限公司 用于半导体的各向异性蚀刻的工艺
DK2375784T3 (da) 2010-03-26 2014-09-29 Siemens Medical Instr Pte Ltd Høreapparat med amorf højttalerafskærmning
US8583187B2 (en) 2010-10-06 2013-11-12 Apple Inc. Shielding structures for wireless electronic devices with displays
US9099771B2 (en) 2011-01-11 2015-08-04 Apple Inc. Resonating element for reducing radio-frequency interference in an electronic device
JP5582539B2 (ja) * 2011-02-25 2014-09-03 清二 加川 近傍界ノイズ抑制シート
CN103535123B (zh) * 2011-05-23 2017-05-24 3M创新有限公司 电磁屏蔽衬垫及其制备方法
CN202721947U (zh) * 2011-11-03 2013-02-06 卢子鬯 电子仪器用之无卤素阻燃电磁干扰防护垫片
RU2488244C1 (ru) * 2012-06-05 2013-07-20 Федеральное государственное унитарное предприятие "Московское опытно-конструкторское бюро "Марс" (ФГУП МОКБ "Марс") Способ повышения теплоотдачи и радиационной защиты электронных блоков
KR101399024B1 (ko) * 2012-12-14 2014-05-27 주식회사 아모센스 자기장 차폐시트 및 그 제조방법과 이를 이용한 휴대 단말기
US9043875B2 (en) 2013-03-01 2015-05-26 Microsoft Technology Licensing, Llc Contactless authentication of optical disk drives
US9812774B2 (en) 2013-03-05 2017-11-07 Amosense Co., Ltd. Composite sheet for shielding magnetic field and electromagnetic wave, and antenna module comprising same
WO2014137151A1 (ko) * 2013-03-05 2014-09-12 주식회사 아모센스 자기장 및 전자파 차폐용 복합시트 및 이를 구비하는 안테나 모듈
CN103687460A (zh) * 2013-04-23 2014-03-26 隆扬电子(昆山)有限公司 导电泡棉
US10228721B2 (en) 2014-05-26 2019-03-12 Apple Inc. Portable computing system
US10133314B2 (en) 2014-05-26 2018-11-20 Apple Inc. Portable computing system
CN104175615B (zh) * 2014-08-21 2016-08-17 四川大学 一种轻质高导电高电磁屏蔽的复合材料及其制备方法
CN207586791U (zh) 2014-09-30 2018-07-06 苹果公司 便携式计算系统
US9955570B2 (en) 2015-01-09 2018-04-24 Apple Inc. Features of a flexible connector in a portable computing device
US10162390B2 (en) * 2015-01-16 2018-12-25 Apple Inc. Hybrid acoustic EMI foam for use in a personal computer
KR20160097795A (ko) * 2015-02-10 2016-08-18 삼성전기주식회사 엔에프씨 안테나 및 그를 포함하는 단말기
JP6611505B2 (ja) * 2015-07-30 2019-11-27 キヤノン株式会社 電気機器、及び導電性部材の配置方法
CN107027254B (zh) * 2016-02-02 2020-12-25 3M创新有限公司 可压缩衬垫、其制备方法和包含其的电子产品
CN105592679B (zh) * 2016-03-09 2018-07-13 深圳市华星光电技术有限公司 Pcb固定结构及液晶显示装置
CN107959099A (zh) * 2016-10-18 2018-04-24 上海光线新材料科技有限公司 具有emi 功能的覆盖膜
CN106758547A (zh) * 2016-11-10 2017-05-31 无锡市明盛强力风机有限公司 一种电磁屏蔽涂布纸
CN106436468A (zh) * 2016-11-10 2017-02-22 无锡市明盛强力风机有限公司 一种电磁屏蔽涂布纸
CN106677276B (zh) * 2016-12-31 2022-06-28 上海小木偶智能科技有限公司 电磁屏蔽建筑结构的给排水系统电磁防护装置及方法
US10212863B1 (en) * 2018-01-19 2019-02-19 Laird Technologies Inc. Slotted fabric over foam electromagnetic interference gaskets
JP7254102B2 (ja) * 2019-01-15 2023-04-07 株式会社日立ハイテク 電磁界遮蔽板、その製造方法、電磁界遮蔽構造、および半導体製造環境
KR20200114709A (ko) * 2019-03-29 2020-10-07 엘지전자 주식회사 기판 구조체 및 그 제어 방법
CN110346622A (zh) * 2019-07-17 2019-10-18 山东电亮亮信息科技有限公司 一种抗干扰用电力终端仪表电磁屏蔽外壳及其制作方法
US11017820B1 (en) 2020-02-21 2021-05-25 Seagate Technology Llc Electromagnetic shielding for electronic devices
CN115568197A (zh) * 2022-09-27 2023-01-03 北京航空航天大学 一种基于铁基纳米晶材料的生物磁屏蔽箱
CN117425325B (zh) * 2023-11-21 2024-07-19 广州方邦电子股份有限公司 一种电磁屏蔽膜及其应用

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969572A (en) * 1975-03-05 1976-07-13 Ncr Corporation Electromagnetic interference shielding gasket for light-weight equipment enclosures
US4496627A (en) * 1981-11-25 1985-01-29 Fujimori Kogyo Co., Ltd. Electrical conductive foam beads and molded electrical conductive foamed articles obtained therefrom
US5160806A (en) * 1989-11-29 1992-11-03 Nec Corporation Electromagnetic shielding member and electromagnetic shielding case
CA2150143A1 (en) * 1992-11-25 1994-06-09 Peter E. Mertinooke Emi-shielding gasket
US6569789B1 (en) * 1996-08-05 2003-05-27 Seiren Co., Ltd. Conductive material and its manufacture thereof
JP3520210B2 (ja) * 1998-10-30 2004-04-19 北川工業株式会社 電磁波シールド用ガスケット
US6309742B1 (en) * 2000-01-28 2001-10-30 Gore Enterprise Holdings, Inc. EMI/RFI shielding gasket
US6538920B2 (en) * 2001-04-02 2003-03-25 Manish Sharma Cladded read conductor for a pinned-on-the-fly soft reference layer
DE60137917D1 (de) * 2001-06-25 2009-04-23 Gore Enterprise Holdings Inc Dichtung zur elektromagnetischen Abschirmung
NL1019088C2 (nl) * 2001-10-02 2003-04-08 Stork Screens Bv Tegen straling beschermende pakking, alsmede werkwijze voor het vervaardigen daarvan.
WO2003030610A1 (en) * 2001-10-02 2003-04-10 Parker Hannifin Corporation Emi shielding gasket construction
KR100517527B1 (ko) * 2003-04-14 2005-09-27 주식회사 에이엠아이 씨 전자파 적합성 및 열 방사용 박형 시트
CN1810068A (zh) * 2003-06-19 2006-07-26 波零公司 印刷电路板的emi吸收屏蔽
US20050106422A1 (en) * 2003-11-19 2005-05-19 Seagate Technology Llc Thin film with exchange coupling between magnetic grains of the thin film
EP1849340B1 (en) * 2005-02-16 2008-09-17 Parker-Hannifin Corporation Flame retardant emi shielding gasket

Also Published As

Publication number Publication date
CN101472455A (zh) 2009-07-01
BRPI0821429A2 (pt) 2015-06-16
EP2236018B1 (en) 2012-11-28
EP2236018A2 (en) 2010-10-06
CA2710948A1 (en) 2009-07-09
EP2236018A4 (en) 2011-09-21
JP2011508452A (ja) 2011-03-10
US20100276193A1 (en) 2010-11-04
KR20100094564A (ko) 2010-08-26
WO2009085660A3 (en) 2009-09-17
WO2009085660A2 (en) 2009-07-09

Similar Documents

Publication Publication Date Title
CA1224092A (en) Microporous metal-plated polytetrafluoroethylene articles and method of manufacture
JP5722775B2 (ja) 電磁波シールドシート
US6569789B1 (en) Conductive material and its manufacture thereof
KR102593913B1 (ko) 전해용 전극, 적층체, 권회체, 전해조, 전해조의 제조 방법, 전극의 갱신 방법, 적층체의 갱신 방법 및 권회체의 제조 방법
CN206168083U (zh) 过滤材料以及应用该过滤材料的过滤元件
CN103535123B (zh) 电磁屏蔽衬垫及其制备方法
JP5020405B1 (ja) 導電テープ及びその製造方法
JP2016530822A (ja) 磁界保護及びスクリーニング用多層生地構造体
JP2012144790A (ja) 補強された多孔質金属箔およびその製造方法
JP2003533000A (ja) 多層電極
CN112639169A (zh) 层积体、层积体的保存方法、层积体的输送方法、保护层积体及其卷绕体
KR101428461B1 (ko) 전자파 차단 및 항균 성능을 갖는 휴대폰 케이스
KR20230148403A (ko) 전해용 전극, 적층체, 권회체, 전해조, 전해조의 제조 방법, 전극의 갱신 방법, 적층체의 갱신 방법 및 권회체의 제조 방법
JP2006128373A (ja) 電磁波を伝導又は吸収する特性を有する構造体
WO2009025518A2 (en) Electrically conductive adhesive tape and method for preparing the same
JP2017069094A (ja) 導電性テープ、及び導電性テープの製造方法
JP2011006832A (ja) 導電性糸及び繊維製品と繊維状アンテナ
JPH01158799A (ja) 透明電磁波シールドシートの製造方法
CN218888947U (zh) 一种超薄减震导电泡棉
CN211706160U (zh) 多孔薄膜
EP1235473A1 (en) Gasket material for shielding electromagnetic waves and method for producing same
JPS6382000A (ja) 電磁波シ−ルド性壁装材料およびその形成方法
JP5479614B2 (ja) 電磁波吸収体
CN201752175U (zh) 一种导电布
CN218804406U (zh) 多层结构复合材料

Legal Events

Date Code Title Description
FA94 Acknowledgement of application withdrawn (non-payment of fees)

Effective date: 20120814