RU2000131604A - METHOD OF GALVANIC COPPER OF SUBSTRATES - Google Patents

METHOD OF GALVANIC COPPER OF SUBSTRATES

Info

Publication number
RU2000131604A
RU2000131604A RU2000131604/02A RU2000131604A RU2000131604A RU 2000131604 A RU2000131604 A RU 2000131604A RU 2000131604/02 A RU2000131604/02 A RU 2000131604/02A RU 2000131604 A RU2000131604 A RU 2000131604A RU 2000131604 A RU2000131604 A RU 2000131604A
Authority
RU
Russia
Prior art keywords
copper
carbonate
substrates
solution
value
Prior art date
Application number
RU2000131604/02A
Other languages
Russian (ru)
Other versions
RU2222643C2 (en
Inventor
Юрген ХУПЕ
Вальтер КРОНЕНБЕРГ
Ойген БРАЙТКРОЙЦ
Ульрих ШМЕРГЕЛЬ
Original Assignee
Бласберг Оберфлехентехник Гмбх
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Бласберг Оберфлехентехник Гмбх filed Critical Бласберг Оберфлехентехник Гмбх
Publication of RU2000131604A publication Critical patent/RU2000131604A/en
Application granted granted Critical
Publication of RU2222643C2 publication Critical patent/RU2222643C2/en

Links

Claims (4)

1. Способ гальванического меднения подложек при использовании нерастворимых анодов в кислых ванных меднения, а также отдельного введения использованных ионов меди, отличающийся тем, что при отказе от диафрагм и вспомогательных электролитов основное количество ионов меди вводят непосредственно в виде карбоната меди и/или основного карбоната меди в отдельном резервуаре, которое направляют к рабочему электролиту в обход, причем высвободившийся газообразный CO2 отделяют в отдельном резервуаре.1. The method of galvanic copper plating of substrates when using insoluble anodes in acid baths of copper plating, as well as the separate introduction of used copper ions, characterized in that when refusing diaphragms and auxiliary electrolytes, the majority of copper ions are introduced directly in the form of copper carbonate and / or basic copper carbonate in a separate tank, which is directed to the working electrolyte bypass, and the released gaseous CO 2 is separated in a separate tank. 2. Способ по п. 1, отличающийся тем, что ванны меднения в качестве органических компонентов содержат полимеры, которые получены путем полимеризации бифункциональных производных пропана с одним или несколькими ненасыщенными спиртами с 3-10 атомами углерода и с одной или несколькими двойными или тройными связями. 2. The method according to p. 1, characterized in that the copper plating baths as organic components contain polymers that are obtained by polymerization of bifunctional propane derivatives with one or more unsaturated alcohols with 3-10 carbon atoms and with one or more double or triple bonds. 3. Способ по п. 1 или 2, отличающийся тем, что карбонат меди получают путем осаждения из растворов солей меди с помощью карбоната натрия. 3. The method according to p. 1 or 2, characterized in that the copper carbonate is obtained by precipitation from solutions of copper salts with sodium carbonate. 4. Способ по п. 3, отличающийся тем, что раствор соли меди перед осаждением с помощью раствора едкого натра нейтрализуют до значения рН, которое меньше значения рН для осаждения гидроокиси меди. 4. The method according to p. 3, characterized in that the solution of copper salt before precipitation using a solution of sodium hydroxide is neutralized to a pH value that is less than the pH value for the deposition of copper hydroxide.
RU2000131604/02A 1998-05-16 1999-05-14 Method for copper electroplating of substrates RU2222643C2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19822076 1998-05-16
DE19822076.6 1998-05-16

Publications (2)

Publication Number Publication Date
RU2000131604A true RU2000131604A (en) 2002-12-27
RU2222643C2 RU2222643C2 (en) 2004-01-27

Family

ID=7868038

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2000131604/02A RU2222643C2 (en) 1998-05-16 1999-05-14 Method for copper electroplating of substrates

Country Status (22)

Country Link
US (1) US6576111B1 (en)
EP (1) EP1080252B1 (en)
JP (1) JP2002515549A (en)
KR (1) KR100545664B1 (en)
CN (1) CN1170965C (en)
AT (1) ATE221930T1 (en)
AU (1) AU4261799A (en)
CA (1) CA2331750A1 (en)
DE (1) DE59902276D1 (en)
DK (1) DK1080252T3 (en)
HU (1) HUP0102016A3 (en)
IL (1) IL139418A0 (en)
IS (1) IS5703A (en)
NO (1) NO20005777D0 (en)
PL (1) PL344529A1 (en)
RO (1) RO119838B1 (en)
RU (1) RU2222643C2 (en)
SK (1) SK16912000A3 (en)
TR (1) TR200003368T2 (en)
WO (1) WO1999060188A2 (en)
YU (1) YU70900A (en)
ZA (1) ZA200006624B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3725083B2 (en) * 2002-02-21 2005-12-07 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング Method for enabling effective preservation of metal ion source in plating equipment
US7776741B2 (en) 2008-08-18 2010-08-17 Novellus Systems, Inc. Process for through silicon via filing
US9109295B2 (en) * 2009-10-12 2015-08-18 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating
US10472730B2 (en) 2009-10-12 2019-11-12 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating
CN107636209B (en) * 2015-06-26 2021-07-02 住友金属矿山股份有限公司 Conductive substrate
US10692735B2 (en) 2017-07-28 2020-06-23 Lam Research Corporation Electro-oxidative metal removal in through mask interconnect fabrication

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3483078D1 (en) * 1983-09-28 1990-10-04 Blasberg Oberflaechentech ACID GALVANIC COPPER BATH AND METHOD FOR THE PRODUCTION THEREOF.
JPS62112996A (en) * 1985-11-11 1987-05-23 Mitsubishi Metal Corp Heat-transmitting body
DE4001960A1 (en) * 1990-01-24 1991-07-25 Roland Schnetteler Zinc-nickel alloy electroplating of steel strip - with minimal carbon di:oxide entrainment on nickel carbonate addn. to electrolyte
JPH04320088A (en) * 1991-04-18 1992-11-10 Cmk Corp Manufacture of printed wiring board

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