PT77445A - Method and apparatus for lead frame and semiconductor device encapsulation - Google Patents

Method and apparatus for lead frame and semiconductor device encapsulation

Info

Publication number
PT77445A
PT77445A PT77445A PT7744583A PT77445A PT 77445 A PT77445 A PT 77445A PT 77445 A PT77445 A PT 77445A PT 7744583 A PT7744583 A PT 7744583A PT 77445 A PT77445 A PT 77445A
Authority
PT
Portugal
Prior art keywords
semiconductor device
lead frame
device encapsulation
encapsulation
lead
Prior art date
Application number
PT77445A
Other languages
English (en)
Other versions
PT77445B (en
Inventor
John W Orcutt
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of PT77445A publication Critical patent/PT77445A/pt
Publication of PT77445B publication Critical patent/PT77445B/pt

Links

Classifications

    • H10W70/453—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H10W74/016—
    • H10W72/0198—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
PT77445A 1982-10-04 1983-10-03 Method and apparatus for lead frame and semiconductor device encapsulation PT77445B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/432,594 US4504435A (en) 1982-10-04 1982-10-04 Method for semiconductor device packaging

Publications (2)

Publication Number Publication Date
PT77445A true PT77445A (en) 1983-11-01
PT77445B PT77445B (en) 1986-02-14

Family

ID=23716804

Family Applications (1)

Application Number Title Priority Date Filing Date
PT77445A PT77445B (en) 1982-10-04 1983-10-03 Method and apparatus for lead frame and semiconductor device encapsulation

Country Status (5)

Country Link
US (1) US4504435A (pt)
EP (1) EP0110518B1 (pt)
JP (1) JPS5989424A (pt)
DE (2) DE3379298D1 (pt)
PT (1) PT77445B (pt)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4641418A (en) * 1982-08-30 1987-02-10 International Rectifier Corporation Molding process for semiconductor devices and lead frame structure therefor
EP0305589B1 (en) * 1982-10-04 1997-12-17 Texas Instruments Incorporated Method and apparatus for the encapsulation of a semiconductor device mounted on a lead-frame
DE3320700A1 (de) * 1983-06-08 1984-12-13 Siemens AG, 1000 Berlin und 8000 München Verfahren zum kunststoffumhuellen von elektrischen bauelementen
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS6134749U (ja) * 1984-08-03 1986-03-03 富士通オ−トメ−シヨン株式会社 半導体装置用リ−ドフレ−ム連結体
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
DE3526303A1 (de) * 1985-07-23 1987-01-29 Siemens Ag Einrichtung zum vergiessen von elektrischen bauteilen
FR2598258B1 (fr) * 1986-04-30 1988-10-07 Aix Les Bains Composants Procede d'encapsulation de circuits integres.
US4741507A (en) * 1986-06-02 1988-05-03 Motorola Inc. Self-cleaning mold
EP0253664B1 (en) * 1986-07-16 1992-10-14 Canon Kabushiki Kaisha Semiconductor photo-sensor and method for manufacturing the same
JP2724491B2 (ja) * 1989-02-01 1998-03-09 株式会社日立製作所 成形装置
JP2588283B2 (ja) * 1989-09-29 1997-03-05 株式会社東芝 樹脂封止型半導体装置
US5907184A (en) * 1998-03-25 1999-05-25 Micron Technology, Inc. Integrated circuit package electrical enhancement
US6173490B1 (en) * 1997-08-20 2001-01-16 National Semiconductor Corporation Method for forming a panel of packaged integrated circuits
US6130473A (en) 1998-04-02 2000-10-10 National Semiconductor Corporation Lead frame chip scale package
DE19921867C2 (de) * 1999-05-11 2001-08-30 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauelements mit mindestens einem verkapselten Chip auf einem Substrat
US6257857B1 (en) * 2000-01-31 2001-07-10 Advanced Semiconductor Engineering, Inc. Molding apparatus for flexible substrate based package
JP2003077946A (ja) * 2001-08-31 2003-03-14 Hitachi Ltd 半導体装置の製造方法
US6666997B2 (en) * 2001-10-02 2003-12-23 Micron Technology, Inc. Method for removing cleaning compound flash from mold vents
US7264456B2 (en) * 2001-10-10 2007-09-04 Micron Technology, Inc. Leadframe and method for reducing mold compound adhesion problems
US20030116879A1 (en) * 2001-12-21 2003-06-26 Seaquist Closures Foreign, Inc. Compression molding process and article made by the process
US7838985B2 (en) 2007-07-12 2010-11-23 Vishay General Semiconductor Llc Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers
US7915728B2 (en) * 2007-07-12 2011-03-29 Vishay General Semiconductor Llc Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4043027A (en) * 1963-12-16 1977-08-23 Texas Instruments Incorporated Process for encapsulating electronic components in plastic
US3795492A (en) * 1970-10-09 1974-03-05 Motorola Inc Lanced and relieved lead strips
US3950140A (en) * 1973-06-11 1976-04-13 Motorola, Inc. Combination strip frame for semiconductive device and gate for molding
US4003544A (en) * 1973-06-11 1977-01-18 Motorola, Inc. Gateless injection mold for encapsulating semiconductor devices
JPS5243366A (en) * 1975-10-01 1977-04-05 Hitachi Ltd Mold for resin molding
JPS5333260A (en) * 1976-09-10 1978-03-29 Sony Corp Device for molding plastic
US4332537A (en) * 1978-07-17 1982-06-01 Dusan Slepcevic Encapsulation mold with removable cavity plates
JPS5480079A (en) * 1978-08-07 1979-06-26 Dai Ichi Seiko Co Ltd Method of forming semiconductor seal
JPS5643854A (en) * 1979-09-18 1981-04-22 Nec Corp Control system of received carrier detecting circuit
JPS5660210A (en) * 1979-10-23 1981-05-25 Mitsubishi Electric Corp Metal mold for resin sealing type semiconductor device
JPS5694635A (en) * 1979-12-27 1981-07-31 Toshiba Corp Metal-mold device for sealing by resin
JPS5775434A (en) * 1980-10-28 1982-05-12 Nec Corp Resin sealing metal mold for semiconductor device
JPS57187945A (en) * 1981-05-13 1982-11-18 Nec Home Electronics Ltd Manufacture of semiconductor device

Also Published As

Publication number Publication date
DE3382817T2 (de) 1998-05-28
DE3382817D1 (de) 1998-01-29
DE3379298D1 (en) 1989-04-06
US4504435A (en) 1985-03-12
JPS5989424A (ja) 1984-05-23
EP0110518A3 (en) 1985-08-21
EP0110518A2 (en) 1984-06-13
EP0110518B1 (en) 1989-03-01
PT77445B (en) 1986-02-14

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Legal Events

Date Code Title Description
NF3A Restitutio in integrum

Effective date: 19941212