PT2753418T - Método para revestir um substrato com uma camada de polímero - Google Patents

Método para revestir um substrato com uma camada de polímero

Info

Publication number
PT2753418T
PT2753418T PT127667087T PT12766708T PT2753418T PT 2753418 T PT2753418 T PT 2753418T PT 127667087 T PT127667087 T PT 127667087T PT 12766708 T PT12766708 T PT 12766708T PT 2753418 T PT2753418 T PT 2753418T
Authority
PT
Portugal
Prior art keywords
polymer coatings
surface polymer
coatings
polymer
Prior art date
Application number
PT127667087T
Other languages
English (en)
Original Assignee
Europlasma Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Europlasma Nv filed Critical Europlasma Nv
Publication of PT2753418T publication Critical patent/PT2753418T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/52—Polymerisation initiated by wave energy or particle radiation by electric discharge, e.g. voltolisation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32403—Treating multiple sides of workpieces, e.g. 3D workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B05D5/083—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Plasma Technology (AREA)
PT127667087T 2011-09-07 2012-09-07 Método para revestir um substrato com uma camada de polímero PT2753418T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1115465.5A GB2489761B (en) 2011-09-07 2011-09-07 Surface coatings

Publications (1)

Publication Number Publication Date
PT2753418T true PT2753418T (pt) 2020-03-24

Family

ID=44908215

Family Applications (1)

Application Number Title Priority Date Filing Date
PT127667087T PT2753418T (pt) 2011-09-07 2012-09-07 Método para revestir um substrato com uma camada de polímero

Country Status (12)

Country Link
US (2) US20140322525A1 (pt)
EP (1) EP2753418B1 (pt)
JP (1) JP6175438B2 (pt)
KR (1) KR101666285B1 (pt)
CN (1) CN103930192B (pt)
DK (1) DK2753418T3 (pt)
ES (1) ES2776999T3 (pt)
GB (1) GB2489761B (pt)
HK (1) HK1177324A1 (pt)
PL (1) PL2753418T3 (pt)
PT (1) PT2753418T (pt)
WO (1) WO2013034920A2 (pt)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2510213A (en) * 2012-08-13 2014-07-30 Europlasma Nv Forming a protective polymer coating on a component
GB201316113D0 (en) * 2013-09-10 2013-10-23 Europlasma Nv Apparatus and method for applying surface coatings
EP2906739B1 (en) * 2012-10-09 2016-11-30 Europlasma nv Apparatus and method for applying surface coatings
BE1021288B1 (nl) * 2013-10-07 2015-10-20 Europlasma Nv Verbeterde manieren om plasma te genereren op continue vermogens wijze voor lage druk plasma processen
GB2521137A (en) * 2013-12-10 2015-06-17 Europlasma Nv Surface Coatings
GB201403558D0 (en) 2014-02-28 2014-04-16 P2I Ltd Coating
JP6114710B2 (ja) * 2014-03-27 2017-04-12 富士フイルム株式会社 太陽電池
CN105744783A (zh) * 2014-12-09 2016-07-06 友威科技股份有限公司 多电极蚀刻装置
GB2556246B8 (en) * 2015-06-09 2020-08-19 P2I Ltd Method for forming a coating on an electronic or electrical device
KR20180018675A (ko) 2015-06-09 2018-02-21 피2아이 리미티드 코팅
BE1023805B1 (fr) * 2016-06-30 2017-07-26 Green Frix Dispositif pour le traitement electrique d'un corps gras d'origine vegetale
KR101931692B1 (ko) 2017-10-11 2018-12-21 주식회사 유진테크 배치식 플라즈마 기판처리장치
US20230011958A1 (en) * 2019-12-04 2023-01-12 Jiangsu Favored Nanotechnology Co., Ltd. Coating equipment
KR102433553B1 (ko) * 2020-07-30 2022-08-18 연세대학교 산학협력단 폴리머 증착기 및 폴리머 증착 방법
CN116648537A (zh) * 2020-12-18 2023-08-25 施福克私人有限公司 基材处理系统

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4282077A (en) * 1980-07-03 1981-08-04 General Dynamics, Pomona Division Uniform plasma etching system
DE3041551A1 (de) * 1980-11-04 1982-06-09 Siemens AG, 1000 Berlin und 8000 München Elektroden fuer plasma-aetzanlage
US4381965A (en) * 1982-01-06 1983-05-03 Drytek, Inc. Multi-planar electrode plasma etching
US4628006A (en) * 1984-01-20 1986-12-09 The United States Of America As Represented By The Secretary Of The Navy Passivation of hybrid microelectronic circuits
US4825806A (en) * 1984-02-17 1989-05-02 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Film forming apparatus
GB8622820D0 (en) * 1986-09-23 1986-10-29 Nordiko Ltd Electrode assembly & apparatus
JPS63311794A (ja) * 1987-06-12 1988-12-20 Sumitomo Electric Ind Ltd フレキシブル配線板の製造方法
JPH03207866A (ja) * 1990-01-08 1991-09-11 Nippon Steel Corp 複数電極式プラズマ発生装置
US5593550A (en) * 1994-05-06 1997-01-14 Medtronic, Inc. Plasma process for reducing friction within the lumen of polymeric tubing
PT988412E (pt) * 1997-06-14 2006-05-31 Secr Defence Revestimentos de superficies
JP3649898B2 (ja) * 1997-09-25 2005-05-18 三洋電機株式会社 プラズマｃｖｄ装置を用いた多層薄膜形成装置
JP3501668B2 (ja) * 1997-12-10 2004-03-02 キヤノン株式会社 プラズマｃｖｄ方法及びプラズマｃｖｄ装置
EP1130948B1 (en) * 1999-09-09 2011-01-26 Ishikawajima-Harima Heavy Industries Co., Ltd. Inner-electrode plasma processing apparatus and method of plasma processing
JP3516918B2 (ja) * 2000-01-19 2004-04-05 株式会社日立国際電気 半導体装置の製造方法及び半導体製造装置
DE60140803D1 (de) * 2000-05-17 2010-01-28 Ihi Corp Plasma-cvd-vorrichtung und verfahren
DE10114897A1 (de) * 2001-03-26 2002-10-24 Infineon Technologies Ag Elektronisches Bauteil
JP3711955B2 (ja) * 2002-04-01 2005-11-02 日産自動車株式会社 回転電機の制御装置
TW544071U (en) * 2002-04-02 2003-07-21 Nano Electronics And Micro Sys Electrode device for plasma treatment system
JP2004103423A (ja) * 2002-09-10 2004-04-02 Matsushita Electric Works Ltd プラズマ処理方法及びプラズマ処理装置
JP4120546B2 (ja) * 2002-10-04 2008-07-16 株式会社Ｉｈｉ 薄膜形成方法及び装置並びに太陽電池の製造方法及び装置並びに太陽電池
US20040152381A1 (en) * 2003-01-22 2004-08-05 The Procter & Gamble Company Fibrous products and methods of making and using them
US7824520B2 (en) * 2003-03-26 2010-11-02 Semiconductor Energy Laboratory Co., Ltd. Plasma treatment apparatus
WO2004108984A1 (ja) * 2003-06-06 2004-12-16 Konica Minolta Holdings, Inc. 薄膜形成方法および薄膜形成体
US20060162741A1 (en) * 2005-01-26 2006-07-27 Cerionx, Inc. Method and apparatus for cleaning and surface conditioning objects with plasma
JP2007514275A (ja) * 2003-10-28 2007-05-31 ノードソン　コーポレーション プラズマ処理装置及びプラズマ処理方法
US7695590B2 (en) * 2004-03-26 2010-04-13 Applied Materials, Inc. Chemical vapor deposition plasma reactor having plural ion shower grids
US7712434B2 (en) * 2004-04-30 2010-05-11 Lam Research Corporation Apparatus including showerhead electrode and heater for plasma processing
US7673970B2 (en) * 2004-06-30 2010-03-09 Lexmark International, Inc. Flexible circuit corrosion protection
WO2006022179A1 (ja) * 2004-08-24 2006-03-02 Kyushu University クラスタフリーのアモルファスシリコン膜とそれを製造する方法及び装置
WO2006048650A1 (en) * 2004-11-05 2006-05-11 Dow Corning Ireland Limited Plasma system
JP4584722B2 (ja) * 2005-01-13 2010-11-24 シャープ株式会社 プラズマ処理装置および同装置により製造された半導体素子
JPWO2006118161A1 (ja) * 2005-04-28 2008-12-18 株式会社日立国際電気 基板処理装置および電極部材
US7938931B2 (en) * 2006-05-24 2011-05-10 Lam Research Corporation Edge electrodes with variable power
US20080083732A1 (en) * 2006-10-10 2008-04-10 Sumitomo Electric Industries, Ltd. Wafer holder and exposure apparatus equipped with wafer holder
CN102892248B (zh) * 2006-12-28 2016-08-10 荷兰应用科学研究会(Tno) 表面介质阻挡放电等离子体单元和产生表面等离子体的方法
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
JP4838197B2 (ja) * 2007-06-05 2011-12-14 東京エレクトロン株式会社 プラズマ処理装置，電極温度調整装置，電極温度調整方法
US8438990B2 (en) * 2008-09-30 2013-05-14 Applied Materials, Inc. Multi-electrode PECVD source
WO2010105829A1 (en) * 2009-03-19 2010-09-23 Anthony Herbert Apparatus and method for deposition of functional coatings
JP2011100930A (ja) * 2009-11-09 2011-05-19 Noda Screen:Kk 回路基板用保護絶縁材
BE1019159A5 (nl) * 2010-01-22 2012-04-03 Europlasma Nv Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces.
EP2422887A1 (en) * 2010-08-27 2012-02-29 Oticon A/S A method of coating a surface with a water and oil repellant polymer layer

Also Published As

Publication number Publication date
KR20140096266A (ko) 2014-08-05
GB201115465D0 (en) 2011-10-26
WO2013034920A2 (en) 2013-03-14
KR101666285B1 (ko) 2016-10-13
EP2753418A2 (en) 2014-07-16
US20190393020A1 (en) 2019-12-26
DK2753418T3 (da) 2020-03-16
ES2776999T3 (es) 2020-08-03
CN103930192B (zh) 2016-11-09
US10923330B2 (en) 2021-02-16
CN103930192A (zh) 2014-07-16
PL2753418T3 (pl) 2020-09-21
US20140322525A1 (en) 2014-10-30
GB2489761A (en) 2012-10-10
GB2489761B (en) 2015-03-04
HK1177324A1 (en) 2013-08-16
JP6175438B2 (ja) 2017-08-02
WO2013034920A3 (en) 2013-05-30
EP2753418B1 (en) 2019-12-11
JP2014528143A (ja) 2014-10-23

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