PT2647043T - Processo para o tratamento de wafers e microchapas - Google Patents

Processo para o tratamento de wafers e microchapas

Info

Publication number
PT2647043T
PT2647043T PT117885384T PT11788538T PT2647043T PT 2647043 T PT2647043 T PT 2647043T PT 117885384 T PT117885384 T PT 117885384T PT 11788538 T PT11788538 T PT 11788538T PT 2647043 T PT2647043 T PT 2647043T
Authority
PT
Portugal
Prior art keywords
dies
treating wafers
wafers
treating
Prior art date
Application number
PT117885384T
Other languages
English (en)
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Publication of PT2647043T publication Critical patent/PT2647043T/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
PT117885384T 2010-11-30 2011-11-30 Processo para o tratamento de wafers e microchapas PT2647043T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102010062166A DE102010062166A1 (de) 2010-11-30 2010-11-30 Verfahren zum Behandeln von Wafern und Mikroplättchen

Publications (1)

Publication Number Publication Date
PT2647043T true PT2647043T (pt) 2021-05-12

Family

ID=45047843

Family Applications (1)

Application Number Title Priority Date Filing Date
PT117885384T PT2647043T (pt) 2010-11-30 2011-11-30 Processo para o tratamento de wafers e microchapas

Country Status (7)

Country Link
EP (1) EP2647043B1 (pt)
JP (1) JP5959529B2 (pt)
KR (1) KR101801337B1 (pt)
CN (1) CN103238211B (pt)
DE (1) DE102010062166A1 (pt)
PT (1) PT2647043T (pt)
WO (1) WO2012072706A1 (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6093638B2 (ja) * 2013-04-26 2017-03-08 株式会社ディスコ 洗浄装置
CN105219963B (zh) * 2014-06-10 2017-06-30 沈阳芯源微电子设备有限公司 一种废液废固分离回收系统
JP6611565B2 (ja) * 2015-11-02 2019-11-27 東京エレクトロン株式会社 洗浄装置、剥離システム、洗浄方法、剥離方法、プログラム、および情報記憶媒体
JP6573531B2 (ja) * 2015-11-02 2019-09-11 東京エレクトロン株式会社 洗浄装置、剥離システム、洗浄方法、剥離方法、プログラム、および情報記憶媒体
CN108857862B (zh) * 2018-06-12 2020-05-12 山东科芯电子有限公司 一种半导体硅晶圆研磨处理系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4086870A (en) * 1977-06-30 1978-05-02 International Business Machines Corporation Novel resist spinning head
JPS63152123A (ja) * 1986-12-17 1988-06-24 Tokyo Electron Ltd 浸漬式の液処理装置
JP2724870B2 (ja) * 1988-04-08 1998-03-09 東京エレクトロン株式会社 処理装置
JP2719618B2 (ja) * 1989-03-25 1998-02-25 東京エレクトロン株式会社 基板の洗浄装置
JP2833519B2 (ja) * 1994-09-27 1998-12-09 日本電気株式会社 絶縁膜上の半導体膜の薄膜化方法および薄膜化装置
JPH10172938A (ja) * 1996-12-06 1998-06-26 Sony Corp ウェーハスクラブ処理装置
JP3910830B2 (ja) * 2001-11-14 2007-04-25 信越半導体株式会社 シリコンウェーハの酸化膜の除去方法及びその装置
JP4621038B2 (ja) * 2005-02-18 2011-01-26 Ｏｋｉセミコンダクタ株式会社 半導体ウエハの洗浄方法及び半導体ウエハの洗浄装置
JP2008021929A (ja) * 2006-07-14 2008-01-31 Tokyo Ohka Kogyo Co Ltd サポートプレート、搬送装置、剥離装置及び剥離方法
JP4971078B2 (ja) * 2007-08-30 2012-07-11 東京応化工業株式会社 表面処理装置
US20090173358A1 (en) * 2008-01-09 2009-07-09 Micron Technology, Inc. Megasonic cleaning with controlled boundary layer thickness and associated systems and methods
JP5300464B2 (ja) * 2008-12-26 2013-09-25 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
KR101801337B1 (ko) 2017-11-24
CN103238211B (zh) 2016-01-20
EP2647043B1 (de) 2021-04-14
CN103238211A (zh) 2013-08-07
WO2012072706A1 (de) 2012-06-07
EP2647043A1 (de) 2013-10-09
JP5959529B2 (ja) 2016-08-02
DE102010062166A1 (de) 2012-05-31
JP2014501043A (ja) 2014-01-16
KR20130132867A (ko) 2013-12-05

Similar Documents

Publication Publication Date Title
HK1213690A1 (zh) 半導體器件及其製造方法
GB2491526B (en) Method and apparatus for manufacturing an implant
TWI562379B (en) Semiconductor device and method for manufacturing semiconductor device
HK1201145A1 (en) Methods and devices for treating hypertension
EP2800143A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SEMICONDUCTOR DEVICE
EP2672517A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
EP2701201A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
EP2599106A4 (en) METHOD AND SYSTEM FOR PROVIDING PROCESS TOOL CORRECTIONS
EP2631942A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
PL2547611T3 (pl) Urządzenie i sposób wytwarzania puszek
EP2631950A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
PL2526141T3 (pl) Sposób obróbki powierzchniowej
EP2618380A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
EP2725610A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
ZA201207115B (en) Apparatus and method for manufacturing products
EP2712445A4 (en) METHOD AND APPARATUS FOR ZONE REDUCTION AND / OR MEMORY POWER SUPPLY
EP2720254A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2533275A4 (en) METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
EP2736437A4 (en) METHOD AND COMPOSITION FOR HYPERTHERMAL TREATMENT OF CELLS
EP2551891A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
EP2555246A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
IL220594A0 (en) Treatment method
EP2613892A4 (en) METHOD OF TREATING METAL SURFACES
EP2541604A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
EP2797117A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR