PT1214175E - Correia de polimento nao suportada para polimento mecanico-quimico - Google Patents

Correia de polimento nao suportada para polimento mecanico-quimico

Info

Publication number
PT1214175E
PT1214175E PT00959821T PT00959821T PT1214175E PT 1214175 E PT1214175 E PT 1214175E PT 00959821 T PT00959821 T PT 00959821T PT 00959821 T PT00959821 T PT 00959821T PT 1214175 E PT1214175 E PT 1214175E
Authority
PT
Portugal
Prior art keywords
belt
supported
mechanical
chemical polishing
polymer belt
Prior art date
Application number
PT00959821T
Other languages
English (en)
Inventor
Xu Cangshan
Brian S Lombardo
Original Assignee
Peripheral Products Inc
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peripheral Products Inc, Lam Res Corp filed Critical Peripheral Products Inc
Publication of PT1214175E publication Critical patent/PT1214175E/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
PT00959821T 1999-08-31 2000-08-31 Correia de polimento nao suportada para polimento mecanico-quimico PT1214175E (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/386,741 US6406363B1 (en) 1999-08-31 1999-08-31 Unsupported chemical mechanical polishing belt

Publications (1)

Publication Number Publication Date
PT1214175E true PT1214175E (pt) 2005-05-31

Family

ID=23526859

Family Applications (1)

Application Number Title Priority Date Filing Date
PT00959821T PT1214175E (pt) 1999-08-31 2000-08-31 Correia de polimento nao suportada para polimento mecanico-quimico

Country Status (10)

Country Link
US (2) US6406363B1 (pt)
EP (1) EP1214175B1 (pt)
JP (1) JP2003508905A (pt)
KR (1) KR20020068032A (pt)
AT (1) ATE286448T1 (pt)
AU (1) AU7108000A (pt)
DE (1) DE60017271D1 (pt)
PT (1) PT1214175E (pt)
TW (1) TW466157B (pt)
WO (1) WO2001015867A1 (pt)

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US6406363B1 (en) * 1999-08-31 2002-06-18 Lam Research Corporation Unsupported chemical mechanical polishing belt
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US6991526B2 (en) * 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US6884153B2 (en) * 2000-02-17 2005-04-26 Applied Materials, Inc. Apparatus for electrochemical processing
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US6896776B2 (en) * 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
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US6722946B2 (en) * 2002-01-17 2004-04-20 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
US6857947B2 (en) 2002-01-17 2005-02-22 Asm Nutool, Inc Advanced chemical mechanical polishing system with smart endpoint detection
US6837983B2 (en) * 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
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US20040171339A1 (en) * 2002-10-28 2004-09-02 Cabot Microelectronics Corporation Microporous polishing pads
US20040072445A1 (en) * 2002-07-11 2004-04-15 Applied Materials, Inc. Effective method to improve surface finish in electrochemically assisted CMP
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US7112270B2 (en) * 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
US20050061674A1 (en) * 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
US7121937B2 (en) 2003-03-17 2006-10-17 3M Innovative Properties Company Abrasive brush elements and segments
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US20050121141A1 (en) * 2003-11-13 2005-06-09 Manens Antoine P. Real time process control for a polishing process
US7186164B2 (en) * 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
US7316605B1 (en) * 2006-07-03 2008-01-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US7422982B2 (en) * 2006-07-07 2008-09-09 Applied Materials, Inc. Method and apparatus for electroprocessing a substrate with edge profile control
JP4947583B2 (ja) * 2007-03-30 2012-06-06 東洋ゴム工業株式会社 研磨パッドの製造方法
US20100112919A1 (en) * 2008-11-03 2010-05-06 Applied Materials, Inc. Monolithic linear polishing sheet
US10722997B2 (en) 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
WO2013151946A1 (en) * 2012-04-02 2013-10-10 Thomas West Inc. Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
US10099339B2 (en) * 2016-06-02 2018-10-16 Semiconductor Manufacturing International (Shanghai) Corporation Chemical mechanical polishing (CMP) apparatus and method
TWI757410B (zh) * 2017-01-20 2022-03-11 美商應用材料股份有限公司 用於cmp應用的薄的塑膠拋光用具
JP7317532B2 (ja) * 2019-03-19 2023-07-31 キオクシア株式会社 研磨装置及び研磨方法

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Also Published As

Publication number Publication date
KR20020068032A (ko) 2002-08-24
EP1214175B1 (en) 2005-01-05
AU7108000A (en) 2001-03-26
JP2003508905A (ja) 2003-03-04
WO2001015867A1 (en) 2001-03-08
EP1214175A1 (en) 2002-06-19
ATE286448T1 (de) 2005-01-15
DE60017271D1 (de) 2005-02-10
US6656030B2 (en) 2003-12-02
US20020068513A1 (en) 2002-06-06
US6406363B1 (en) 2002-06-18
TW466157B (en) 2001-12-01

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