PT100575A - Processo para o tratamento superficial de artigos moldados de poliamida com solucoes aquosas acidas e artigos moldados assim obtidos - Google Patents

Processo para o tratamento superficial de artigos moldados de poliamida com solucoes aquosas acidas e artigos moldados assim obtidos Download PDF

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Publication number
PT100575A
PT100575A PT100575A PT10057592A PT100575A PT 100575 A PT100575 A PT 100575A PT 100575 A PT100575 A PT 100575A PT 10057592 A PT10057592 A PT 10057592A PT 100575 A PT100575 A PT 100575A
Authority
PT
Portugal
Prior art keywords
carbon atoms
alkyl group
molded articles
polyamide
hydrogen
Prior art date
Application number
PT100575A
Other languages
English (en)
Inventor
Hartmut Zeiner
Walter Betz
Graham Edmund Mc Kee
Original Assignee
Basf Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Ag filed Critical Basf Ag
Publication of PT100575A publication Critical patent/PT100575A/pt

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)

Claims (3)

  1. t
    REIVINDICAÇÕES: la. Processo para o tratamento superficial de artigos moldados de poliamida com soluções aquosas ácidas caracterizado pelo facto de se utilizarem misturas formadas por solução aquosa de ácido clorídrico contendo pelo menos 20% em peso de ácicto clorídrico e por monoéteres ou diéteres de um composto de hidroxi alifático polifuncional numa proporção de mistura compreendida entre 90 : 10 e 10 : 90 em volume, respectivamente. 2a. Processo de acordo com a reivindicação 1, caracterizado pelo facto de se realizar o citado tratamento a temperaturas compreendidas entre 10° e 80°C. 3a. Processo de acordo com as reivindicações 1 ou 2, caracterizado pelo facto de se realizar o referido tratamento durante um intervalo de tempo compreendido entre 0,5 e 25 minutos. /Λ ,22 ií/u 4a. Processo de acordo com qualquer das reivindicações 1 a 3, caracterizado pelo facto de se empregar um monoéter ou um diéter de um composto de hidroxi alifático polifuncional de fórmula geral (I) Η H
    (C) (C) 0 (I) x y na qual R^ significa hidrogénio ou um grupo alquilo com 1 a 10 átomos de carbono;
  2. 2 R significa hidrogénio ou um grupo alquilo com 1 a 10 átomos de carbono ou um grupo hidroxilo;
  3. 3 R significa hidrogénio ou um grupo alquilo com 1 a 10 átomos de carbono; R4 significa hidrogénio ou um grupo alquilo com 1 a 10 átomos de carbono ou um grupo de fórmula: -(CH0) -OR ? * jL Π 5 R significa hidrogénio ou um grupo alquilo com 1 a 10 átomos de carbono; x significa um número inteiro entre 1 e 10; y significa 0 ou 1; e n significa um número inteiro entre 2 e 4.
    5a. Artigos moldados, caracterizados pelo facto de serem produzidos pelo processo de acordo com as reivindicações 1 a 4. 6a. Artigos moldados de poliamida, caracterizados pelo facto de numa camada superficial tendo uma espessura máxima de 100 micrómetros, se modificar pelo menos 5% em moles dos grupos de amina originalmente existentes, por reacção com HC1. 7a. Utilização dos artigos moldados de poliamida de acordo com as reivindicações 5 ou 6, para o envernizamento impressão, metalização, colagem e floculação. Lisboa, O Agente Oficial da Propriedade Industrial
    AMÉRICO DA SILVA CAtiVALHO Agente Oficial de Propriedade Indústria! Rim Merques' de Fronteira, N.° Ϊ27 - 2.® 1000 LISBOA
PT100575A 1991-06-22 1992-06-05 Processo para o tratamento superficial de artigos moldados de poliamida com solucoes aquosas acidas e artigos moldados assim obtidos PT100575A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4120723A DE4120723A1 (de) 1991-06-22 1991-06-22 Verfahren zur oberflaechenbehandlung von polyamid-formkoerpern und danach erhaltene formkoerper

Publications (1)

Publication Number Publication Date
PT100575A true PT100575A (pt) 1993-07-30

Family

ID=6434569

Family Applications (1)

Application Number Title Priority Date Filing Date
PT100575A PT100575A (pt) 1991-06-22 1992-06-05 Processo para o tratamento superficial de artigos moldados de poliamida com solucoes aquosas acidas e artigos moldados assim obtidos

Country Status (6)

Country Link
US (1) US5442042A (pt)
EP (1) EP0592471B1 (pt)
JP (1) JPH06508163A (pt)
DE (2) DE4120723A1 (pt)
PT (1) PT100575A (pt)
WO (1) WO1993000392A1 (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037401A (en) * 1996-02-26 2000-03-14 Dsm N.V. Flame retardant polyamide composition
US6077913A (en) * 1998-03-26 2000-06-20 Beholz Technology, L.L.C. Process for producing paintable polymeric articles
US6100343A (en) * 1998-11-03 2000-08-08 Beholz Technology, L.L.C. Process for producing paintable polymeric articles
US7901603B1 (en) 2004-06-21 2011-03-08 Lars Guenter Beholz Process for producing adhesive polymeric articles from expanded foam materials
CN101517124B (zh) * 2006-09-26 2012-05-02 帝斯曼知识产权资产管理有限公司 一种金属化构件的方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3556882A (en) * 1967-07-13 1971-01-19 Celanese Corp Method of rendering thermoplastics receptive to coatings
IT1095574B (it) * 1978-04-12 1985-08-10 Snam Progetti Procedimento per la preparazione di materiali biocompatibili di natura poliammidica e manufatti cosi'ottenuti
JPS57123231A (en) * 1981-01-22 1982-07-31 Toyobo Co Ltd Metal-plated polyamide molded product and preparation of same
DE3137587A1 (de) * 1981-09-22 1983-04-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zur vorbehandlung von formteilen aus polyamiden fuer das aufbringen haftfester, chemisch abgeschiedener metallbeschichtungen
DE3919367A1 (de) * 1989-06-14 1990-12-20 Basf Ag Verfahren zur oberflaechenbehandlung von polyamid-formkoerpern und danach erhaltene formkoerper
US5192477A (en) * 1989-06-14 1993-03-09 Basf Aktiengesellschaft Surface treatment of polyamide moldings

Also Published As

Publication number Publication date
EP0592471A1 (de) 1994-04-20
JPH06508163A (ja) 1994-09-14
EP0592471B1 (de) 1995-12-27
WO1993000392A1 (de) 1993-01-07
DE59204859D1 (de) 1996-02-08
US5442042A (en) 1995-08-15
DE4120723A1 (de) 1992-12-24

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BB1A Laying open of patent application

Effective date: 19930329

FC3A Refusal

Effective date: 19990408