PL3900500T3 - Układ do chłodzenia urządzeń półprzewodnikowych mocy przetwornicy - Google Patents

Układ do chłodzenia urządzeń półprzewodnikowych mocy przetwornicy

Info

Publication number
PL3900500T3
PL3900500T3 PL19817263.7T PL19817263T PL3900500T3 PL 3900500 T3 PL3900500 T3 PL 3900500T3 PL 19817263 T PL19817263 T PL 19817263T PL 3900500 T3 PL3900500 T3 PL 3900500T3
Authority
PL
Poland
Prior art keywords
converter
arrangement
semiconductor devices
power semiconductor
cooling power
Prior art date
Application number
PL19817263.7T
Other languages
English (en)
Inventor
Ben Diedrichs
Tommy RANDOW
Original Assignee
Alstom Holdings
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alstom Holdings filed Critical Alstom Holdings
Publication of PL3900500T3 publication Critical patent/PL3900500T3/pl

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20181Filters; Louvers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL19817263.7T 2018-12-18 2019-12-06 Układ do chłodzenia urządzeń półprzewodnikowych mocy przetwornicy PL3900500T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE1851601 2018-12-18
PCT/EP2019/083977 WO2020126547A1 (en) 2018-12-18 2019-12-06 An arrangement for cooling power semiconductor devices of a converter

Publications (1)

Publication Number Publication Date
PL3900500T3 true PL3900500T3 (pl) 2024-07-22

Family

ID=68835230

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19817263.7T PL3900500T3 (pl) 2018-12-18 2019-12-06 Układ do chłodzenia urządzeń półprzewodnikowych mocy przetwornicy

Country Status (6)

Country Link
US (1) US11937412B2 (pl)
EP (1) EP3900500B1 (pl)
CN (2) CN113228838B (pl)
ES (1) ES2978338T3 (pl)
PL (1) PL3900500T3 (pl)
WO (1) WO2020126547A1 (pl)

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CN112351660B (zh) * 2020-11-20 2023-04-14 中国电子科技集团公司第二十九研究所 一种低气动阻力蒙皮换热装置及其设计方法
CN113665694B (zh) * 2021-08-24 2023-12-15 安徽沪宁智能科技有限公司 一种集成散热系统的爬楼机器人
CN114136530B (zh) * 2021-11-23 2023-10-13 中国铁道科学研究院集团有限公司 确定变流器进出口空气压力差的方法及装置
DE102022114113A1 (de) * 2022-06-03 2023-12-14 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Pulswechselrichter mit einer Kühleinrichtung sowie Kraftfahrzeug mit einem Pulswechselrichter

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JPH09246767A (ja) * 1996-03-05 1997-09-19 Hitachi Ltd 電気車用電力変換装置
US7142423B2 (en) * 2004-10-26 2006-11-28 Comarco Wireless Technologies, Inc. Power adapter with fan assembly
CN2792115Y (zh) * 2005-05-06 2006-06-28 纽福克斯光电科技(上海)有限公司 超小型超薄转换器
US8813832B2 (en) * 2009-03-24 2014-08-26 Sumitomo Precision Products Co., Ltd. Heat sink
JP5622761B2 (ja) * 2012-02-22 2014-11-12 京セラドキュメントソリューションズ株式会社 電子機器の吸気機構及びそれを備えた画像形成装置
US20170108277A1 (en) * 2014-05-28 2017-04-20 Rbc Green Energy Ii, Llc Air-Cooled Heat Exchange System
JP6284828B2 (ja) * 2014-05-30 2018-02-28 株式会社三社電機製作所 電気機器
CN104202954A (zh) * 2014-09-28 2014-12-10 阳光电源股份有限公司 一种逆变器散热装置及逆变器
JP6385816B2 (ja) * 2014-12-25 2018-09-05 株式会社日立製作所 電力変換装置及びこれを備えた鉄道車両
US10477724B2 (en) * 2015-03-09 2019-11-12 Datalogic IP Tech, S.r.l. Efficient heat exchange systems and methods
US9915267B2 (en) * 2015-06-08 2018-03-13 Air Distribution Technologies Ip, Llc Fan inlet recirculation guide vanes
TWI588407B (zh) * 2015-07-07 2017-06-21 Chun-Hsien Kuo Headlight color temperature control module
US9969241B2 (en) * 2015-12-16 2018-05-15 Atieva, Inc. Vehicle heat exchanger air flow control system
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US10015913B2 (en) * 2016-02-15 2018-07-03 Fuji Electric Co., Ltd. Power converter and cooler
JP6048607B1 (ja) * 2016-04-15 2016-12-21 富士電機株式会社 鉄道車両用電力変換装置
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Also Published As

Publication number Publication date
CN113228838B (zh) 2024-05-24
WO2020126547A1 (en) 2020-06-25
EP3900500B1 (en) 2024-02-28
US20220071065A1 (en) 2022-03-03
CN113228838A (zh) 2021-08-06
ES2978338T3 (es) 2024-09-10
CN211238228U (zh) 2020-08-11
EP3900500A1 (en) 2021-10-27
US11937412B2 (en) 2024-03-19

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