PL3898061T3 - Monitorowanie przetwarzania materiału przy użyciu gęstości sygnału obrazowania określonej na podstawie wbudowanego obrazowania koherentnego (ICI) - Google Patents
Monitorowanie przetwarzania materiału przy użyciu gęstości sygnału obrazowania określonej na podstawie wbudowanego obrazowania koherentnego (ICI)Info
- Publication number
- PL3898061T3 PL3898061T3 PL19900782.4T PL19900782T PL3898061T3 PL 3898061 T3 PL3898061 T3 PL 3898061T3 PL 19900782 T PL19900782 T PL 19900782T PL 3898061 T3 PL3898061 T3 PL 3898061T3
- Authority
- PL
- Poland
- Prior art keywords
- imaging
- ici
- material processing
- signal density
- density determined
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title 2
- 230000001427 coherent effect Effects 0.000 title 1
- 238000012544 monitoring process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/0037—Measuring of dimensions of welds
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02001—Interferometers characterised by controlling or generating intrinsic radiation properties
- G01B9/0201—Interferometers characterised by controlling or generating intrinsic radiation properties using temporal phase variation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02001—Interferometers characterised by controlling or generating intrinsic radiation properties
- G01B9/02012—Interferometers characterised by controlling or generating intrinsic radiation properties using temporal intensity variation
- G01B9/02014—Interferometers characterised by controlling or generating intrinsic radiation properties using temporal intensity variation by using pulsed light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
-
- G—PHYSICS
- G07—CHECKING-DEVICES
- G07C—TIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
- G07C3/00—Registering or indicating the condition or the working of machines or other apparatus, other than vehicles
- G07C3/14—Quality control systems
- G07C3/146—Quality control systems during manufacturing process
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Quality & Reliability (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862782071P | 2018-12-19 | 2018-12-19 | |
| PCT/US2019/067542 WO2020132282A1 (en) | 2018-12-19 | 2019-12-19 | Monitoring material processing using imaging signal density determined from inline coherent imaging (ici) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3898061T3 true PL3898061T3 (pl) | 2024-08-19 |
Family
ID=71099060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL19900782.4T PL3898061T3 (pl) | 2018-12-19 | 2019-12-19 | Monitorowanie przetwarzania materiału przy użyciu gęstości sygnału obrazowania określonej na podstawie wbudowanego obrazowania koherentnego (ICI) |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US11458566B2 (pl) |
| EP (1) | EP3898061B1 (pl) |
| JP (2) | JP7520844B2 (pl) |
| KR (1) | KR102530514B1 (pl) |
| CN (1) | CN113226623B (pl) |
| BR (1) | BR112021012097A2 (pl) |
| CA (1) | CA3123038A1 (pl) |
| ES (1) | ES2982500T3 (pl) |
| MX (1) | MX2021007519A (pl) |
| PL (1) | PL3898061T3 (pl) |
| WO (1) | WO2020132282A1 (pl) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6770032B2 (ja) * | 2018-08-24 | 2020-10-14 | ファナック株式会社 | レーザ加工システム、及びレーザ加工方法 |
| CN115397603B (zh) | 2020-04-16 | 2025-08-19 | Ipg光子公司 | 校准系统和用于校准相干成像测量系统的方法 |
| TWI738558B (zh) * | 2020-11-03 | 2021-09-01 | 上儀股份有限公司 | 減少焊接噴濺的雷射系統及其方法 |
| GB2605410B (en) * | 2021-03-31 | 2025-03-12 | Jaguar Land Rover Ltd | Methods for Welding Components of Battery Modules |
| GB2605415A (en) * | 2021-03-31 | 2022-10-05 | Jaguar Land Rover Ltd | Methods for Welding Components of Battery Modules |
| GB2605409A (en) * | 2021-03-31 | 2022-10-05 | Jaguar Land Rover Ltd | Laser welding penetration monitoring |
| DE102021117524A1 (de) | 2021-07-07 | 2023-01-12 | Trumpf Laser Gmbh | Verfahren zur Überwachung eines Laserschweißprozesses, Überwachungsvorrichtung und Laserschweißvorrichtung |
| DE102021128707A1 (de) | 2021-11-04 | 2023-05-04 | Precitec Gmbh & Co. Kg | Verfahren zum Kalibrieren eines oder mehrerer optischer Sensoren eines Laserbearbeitungskopfes, Laserbearbeitungskopf und Laserbearbeitungssystem |
| CN114414565B (zh) * | 2021-11-30 | 2024-07-16 | 西安交通大学 | 一种多能量复合激光焊接熔池观测装置及实验方法 |
| DE102022100230A1 (de) * | 2022-01-05 | 2023-07-06 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Fügen von zwei Komponenten einer Batterie mittels Scannerschweißens |
| CN117871539B (zh) * | 2024-03-12 | 2024-05-17 | 光越科技(深圳)有限公司 | 基于光学相干层析成像的激光焊接质量检测系统和方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5446547A (en) | 1991-06-12 | 1995-08-29 | Wyko Corporation | Combination of motorized and piezoelectric translation for long-range vertical scanning interferometry |
| US5387969A (en) | 1993-06-22 | 1995-02-07 | Optima Industries, Inc. | Machine tool position measurement employing multiple laser distance measurements |
| US6454761B1 (en) | 1995-01-30 | 2002-09-24 | Philip D. Freedman | Laser surgery device and method |
| DE19607376C2 (de) * | 1996-02-27 | 1998-02-19 | Thyssen Laser Technik Gmbh | Verfahren zum Laserstrahlschneiden von Werkstücken |
| AU6815300A (en) | 1999-09-10 | 2001-04-17 | Haag-Streit Ag | Method and device for the photoablation of the cornea with laser beam |
| JP3603843B2 (ja) | 2001-02-23 | 2004-12-22 | 日産自動車株式会社 | レーザー溶接部の品質モニタリング方法およびその装置 |
| DE10155203A1 (de) | 2001-11-09 | 2003-06-18 | Bosch Gmbh Robert | Laserbearbeitungsvorrichtung |
| IL149016A0 (en) | 2002-04-07 | 2004-03-28 | Green Vision Systems Ltd Green | Method and device for real time high speed high resolution spectral imaging |
| ITTO20020376A1 (it) * | 2002-05-07 | 2003-11-07 | Fiat Ricerche | Sistema e procedimento per il monitoraggio di saldature laser,ad esempio saldature di semilavorati costituiti da elementi in lamiera metalli |
| US6670574B1 (en) * | 2002-07-31 | 2003-12-30 | Unitek Miyachi Corporation | Laser weld monitor |
| US6940039B2 (en) | 2003-12-22 | 2005-09-06 | Lincoln Global, Inc. | Quality control module for tandem arc welding |
| AR064644A1 (es) | 2006-12-21 | 2009-04-15 | Univ Arizona | Pruebas por interferometria de lentes y sistemas y dispositivos para las mismas y metodo |
| DE102007016444B4 (de) | 2007-04-05 | 2024-08-22 | Precitec Optronik Gmbh | Bearbeitungseinrichtung |
| DE102007032743A1 (de) | 2007-07-13 | 2009-01-15 | Robert Bosch Gmbh | Messvorrichtung, Messverfahren, Laserstrahlbearbeitungsvorrichtung, Laserstrahlbearbeitungsverfahren |
| HUE065575T2 (hu) * | 2010-09-25 | 2024-06-28 | Ipg Photonics Canada Inc | Koherens képalkotó és visszacsatolásos vezérlõ eljárás anyagok módosításához |
| US10124410B2 (en) | 2010-09-25 | 2018-11-13 | Ipg Photonics Corporation | Methods and systems for coherent imaging and feedback control for modification of materials |
| JP5252026B2 (ja) * | 2011-05-10 | 2013-07-31 | パナソニック株式会社 | レーザ溶接装置及びレーザ溶接方法 |
| KR20140096262A (ko) * | 2011-08-21 | 2014-08-05 | 데이비드 레비츠 | 스마트폰에 장착된 광 간섭 단층 촬영 시스템 |
| DE14764437T1 (de) | 2013-03-13 | 2019-09-12 | Ipg Photonics (Canada) Inc. | Verfahren und systeme zur kennzeichnung von laserbearbeitungseigenschaften durch messung von schlüssellochdynamiken mittels interferometrie |
| DE102013015656B4 (de) * | 2013-09-23 | 2016-02-18 | Precitec Optronik Gmbh | Verfahren zum Messen der Eindringtiefe eines Laserstrahls in ein Werkstück, Verfahren zum Bearbeiten eines Werkstücks sowie Laserbearbeitungsvorrichtung |
| JP6535480B2 (ja) * | 2015-02-24 | 2019-06-26 | 株式会社アマダホールディングス | レーザ加工状態判別方法及び装置 |
| EP3571003B1 (en) | 2017-01-18 | 2024-07-03 | IPG Photonics Corporation | Methods and systems for coherent imaging and feedback control for modification of materials |
| JP2018153842A (ja) * | 2017-03-17 | 2018-10-04 | トヨタ自動車株式会社 | 計測装置およびレーザ溶接装置 |
| DE102017126867A1 (de) * | 2017-11-15 | 2019-05-16 | Precitec Gmbh & Co. Kg | Laserbearbeitungssystem und Verfahren zur Laserbearbeitung |
| JP7320703B2 (ja) * | 2018-02-16 | 2023-08-04 | パナソニックＩｐマネジメント株式会社 | レーザ溶接装置及びレーザ溶接方法 |
| MX2021000687A (es) | 2018-07-19 | 2021-03-25 | Ipg Photonics Corp | Sistemas y metodos de monitoreo y/o control de procesamiento por oscilacion que utiliza formacion de imagen coherente en linea (ici). |
-
2019
- 2019-12-19 PL PL19900782.4T patent/PL3898061T3/pl unknown
- 2019-12-19 CN CN201980085121.1A patent/CN113226623B/zh active Active
- 2019-12-19 JP JP2021535813A patent/JP7520844B2/ja active Active
- 2019-12-19 CA CA3123038A patent/CA3123038A1/en active Pending
- 2019-12-19 US US16/721,306 patent/US11458566B2/en active Active
- 2019-12-19 MX MX2021007519A patent/MX2021007519A/es unknown
- 2019-12-19 KR KR1020217022066A patent/KR102530514B1/ko active Active
- 2019-12-19 WO PCT/US2019/067542 patent/WO2020132282A1/en not_active Ceased
- 2019-12-19 ES ES19900782T patent/ES2982500T3/es active Active
- 2019-12-19 BR BR112021012097-1A patent/BR112021012097A2/pt unknown
- 2019-12-19 EP EP19900782.4A patent/EP3898061B1/en active Active
-
2022
- 2022-09-30 US US17/937,058 patent/US12053835B2/en active Active
-
2024
- 2024-07-08 JP JP2024109466A patent/JP2024144433A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CA3123038A1 (en) | 2020-06-25 |
| CN113226623A (zh) | 2021-08-06 |
| EP3898061B1 (en) | 2024-03-06 |
| KR20210094101A (ko) | 2021-07-28 |
| CN113226623B (zh) | 2023-05-23 |
| EP3898061A1 (en) | 2021-10-27 |
| MX2021007519A (es) | 2021-08-05 |
| US11458566B2 (en) | 2022-10-04 |
| EP3898061A4 (en) | 2022-09-28 |
| WO2020132282A1 (en) | 2020-06-25 |
| US20230016054A1 (en) | 2023-01-19 |
| US12053835B2 (en) | 2024-08-06 |
| ES2982500T3 (es) | 2024-10-16 |
| US20200198050A1 (en) | 2020-06-25 |
| KR102530514B1 (ko) | 2023-05-08 |
| BR112021012097A2 (pt) | 2021-09-08 |
| JP7520844B2 (ja) | 2024-07-23 |
| JP2024144433A (ja) | 2024-10-11 |
| EP3898061C0 (en) | 2024-03-06 |
| JP2022515164A (ja) | 2022-02-17 |
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