PL3797181T3 - Taśma miedziana do wytwarzania styków elektrycznych i sposób wytwarzania taśmy miedzianej i złączy wtykowych - Google Patents

Taśma miedziana do wytwarzania styków elektrycznych i sposób wytwarzania taśmy miedzianej i złączy wtykowych

Info

Publication number
PL3797181T3
PL3797181T3 PL19726624.0T PL19726624T PL3797181T3 PL 3797181 T3 PL3797181 T3 PL 3797181T3 PL 19726624 T PL19726624 T PL 19726624T PL 3797181 T3 PL3797181 T3 PL 3797181T3
Authority
PL
Poland
Prior art keywords
copper strip
producing
plug
connector
electrical contacts
Prior art date
Application number
PL19726624.0T
Other languages
English (en)
Inventor
Benjamin Cappi
Helge Lehmann
Karl Zeiger
Original Assignee
Aurubis Stolberg Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aurubis Stolberg Gmbh & Co. Kg filed Critical Aurubis Stolberg Gmbh & Co. Kg
Publication of PL3797181T3 publication Critical patent/PL3797181T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/26—After-treatment
    • C23C2/261—After-treatment in a gas atmosphere, e.g. inert or reducing atmosphere
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Thermal Sciences (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Conductive Materials (AREA)
PL19726624.0T 2018-05-23 2019-05-21 Taśma miedziana do wytwarzania styków elektrycznych i sposób wytwarzania taśmy miedzianej i złączy wtykowych PL3797181T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018208116.6A DE102018208116A1 (de) 2018-05-23 2018-05-23 Kupferband zur Herstellung von elektrischen Kontakten und Verfahren zur Herstellung eines Kupferbandes und Steckverbinder
PCT/EP2019/063091 WO2019224197A1 (de) 2018-05-23 2019-05-21 Kupferband zur herstellung von elektrischen kontakten und verfahren zur herstellung eines kupferbandes und steckverbinder

Publications (1)

Publication Number Publication Date
PL3797181T3 true PL3797181T3 (pl) 2023-03-20

Family

ID=66655327

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19726624.0T PL3797181T3 (pl) 2018-05-23 2019-05-21 Taśma miedziana do wytwarzania styków elektrycznych i sposób wytwarzania taśmy miedzianej i złączy wtykowych

Country Status (9)

Country Link
US (1) US20210218171A1 (pl)
EP (1) EP3797181B1 (pl)
JP (1) JP2021524543A (pl)
KR (1) KR20210011951A (pl)
CN (1) CN112135918A (pl)
DE (1) DE102018208116A1 (pl)
ES (1) ES2935178T3 (pl)
PL (1) PL3797181T3 (pl)
WO (1) WO2019224197A1 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020006059A1 (de) 2020-10-05 2022-04-07 Wieland-Werke Aktiengesellschaft Elektrisch leitendes Material mit Beschichtung
CN114347586B (zh) * 2022-01-25 2024-05-03 宁波博威合金材料股份有限公司 一种铜-铜复合带材、制备方法以及应用

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB546179A (en) * 1941-01-10 1942-07-01 Victor Alexander Lowinger Improvements in and relating to processes for the coating of metals
DE4005836C2 (de) * 1990-02-23 1999-10-28 Stolberger Metallwerke Gmbh Elektrisches Steckverbinderpaar
DE4443461C1 (de) * 1994-12-07 1996-07-04 Wieland Werke Ag Band- bzw. drahtförmiges Verbundmaterial und seine Verwendung
DE19752329A1 (de) * 1997-11-26 1999-05-27 Stolberger Metallwerke Gmbh Verfahren zur Herstellung eines metallischen Verbundbands
JPH11350190A (ja) * 1998-06-03 1999-12-21 Furukawa Electric Co Ltd:The 電気・電子部品用材料とその製造方法、その材料を用いた電気・電子部品
DE10025107A1 (de) 2000-05-20 2001-11-22 Stolberger Metallwerke Gmbh Elektrisch leifähiges Metallband und Steckverbinder
DE10025106A1 (de) 2000-05-20 2001-11-22 Stolberger Metallwerke Gmbh Elektrisch leitfähiges Metallband und Steckverbinder hieraus
US6924044B2 (en) * 2001-08-14 2005-08-02 Snag, Llc Tin-silver coatings
DE10139953A1 (de) 2001-08-21 2003-03-27 Stolberger Metallwerke Gmbh Werkstoff für ein Metallband
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
JP4740814B2 (ja) * 2006-09-29 2011-08-03 Ｊｘ日鉱日石金属株式会社 耐ウィスカー性に優れた銅合金リフローＳｎめっき材
EP2097254B1 (en) * 2006-12-19 2011-10-05 Mahle International GmbH Sliding bearing
US20080308300A1 (en) * 2007-06-18 2008-12-18 Conti Mark A Method of manufacturing electrically conductive strips
JP5313773B2 (ja) * 2009-06-04 2013-10-09 三菱伸銅株式会社 めっき付き銅条材及びその製造方法
CN101905387B (zh) * 2010-02-04 2012-02-15 哈尔滨工业大学 纳米Ag增强低温无铅复合焊膏的制备方法
CN102085604A (zh) * 2011-03-04 2011-06-08 上海交通大学 Sn-Ag-Cu-Bi-Cr低银无铅焊料

Also Published As

Publication number Publication date
CN112135918A (zh) 2020-12-25
EP3797181B1 (de) 2022-11-16
ES2935178T3 (es) 2023-03-02
JP2021524543A (ja) 2021-09-13
US20210218171A1 (en) 2021-07-15
DE102018208116A1 (de) 2019-11-28
EP3797181A1 (de) 2021-03-31
KR20210011951A (ko) 2021-02-02
WO2019224197A1 (de) 2019-11-28

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