PL3797181T3 - Taśma miedziana do wytwarzania styków elektrycznych i sposób wytwarzania taśmy miedzianej i złączy wtykowych - Google Patents
Taśma miedziana do wytwarzania styków elektrycznych i sposób wytwarzania taśmy miedzianej i złączy wtykowychInfo
- Publication number
- PL3797181T3 PL3797181T3 PL19726624.0T PL19726624T PL3797181T3 PL 3797181 T3 PL3797181 T3 PL 3797181T3 PL 19726624 T PL19726624 T PL 19726624T PL 3797181 T3 PL3797181 T3 PL 3797181T3
- Authority
- PL
- Poland
- Prior art keywords
- copper strip
- producing
- plug
- connector
- electrical contacts
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 2
- 229910052802 copper Inorganic materials 0.000 title 2
- 239000010949 copper Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
- C23C2/261—After-treatment in a gas atmosphere, e.g. inert or reducing atmosphere
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Thermal Sciences (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018208116.6A DE102018208116A1 (de) | 2018-05-23 | 2018-05-23 | Kupferband zur Herstellung von elektrischen Kontakten und Verfahren zur Herstellung eines Kupferbandes und Steckverbinder |
PCT/EP2019/063091 WO2019224197A1 (de) | 2018-05-23 | 2019-05-21 | Kupferband zur herstellung von elektrischen kontakten und verfahren zur herstellung eines kupferbandes und steckverbinder |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3797181T3 true PL3797181T3 (pl) | 2023-03-20 |
Family
ID=66655327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL19726624.0T PL3797181T3 (pl) | 2018-05-23 | 2019-05-21 | Taśma miedziana do wytwarzania styków elektrycznych i sposób wytwarzania taśmy miedzianej i złączy wtykowych |
Country Status (9)
Country | Link |
---|---|
US (1) | US20210218171A1 (pl) |
EP (1) | EP3797181B1 (pl) |
JP (1) | JP2021524543A (pl) |
KR (1) | KR20210011951A (pl) |
CN (1) | CN112135918A (pl) |
DE (1) | DE102018208116A1 (pl) |
ES (1) | ES2935178T3 (pl) |
PL (1) | PL3797181T3 (pl) |
WO (1) | WO2019224197A1 (pl) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102020006059A1 (de) | 2020-10-05 | 2022-04-07 | Wieland-Werke Aktiengesellschaft | Elektrisch leitendes Material mit Beschichtung |
CN114347586B (zh) * | 2022-01-25 | 2024-05-03 | 宁波博威合金材料股份有限公司 | 一种铜-铜复合带材、制备方法以及应用 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB546179A (en) * | 1941-01-10 | 1942-07-01 | Victor Alexander Lowinger | Improvements in and relating to processes for the coating of metals |
DE4005836C2 (de) * | 1990-02-23 | 1999-10-28 | Stolberger Metallwerke Gmbh | Elektrisches Steckverbinderpaar |
DE4443461C1 (de) * | 1994-12-07 | 1996-07-04 | Wieland Werke Ag | Band- bzw. drahtförmiges Verbundmaterial und seine Verwendung |
DE19752329A1 (de) * | 1997-11-26 | 1999-05-27 | Stolberger Metallwerke Gmbh | Verfahren zur Herstellung eines metallischen Verbundbands |
JPH11350190A (ja) * | 1998-06-03 | 1999-12-21 | Furukawa Electric Co Ltd:The | 電気・電子部品用材料とその製造方法、その材料を用いた電気・電子部品 |
DE10025107A1 (de) | 2000-05-20 | 2001-11-22 | Stolberger Metallwerke Gmbh | Elektrisch leifähiges Metallband und Steckverbinder |
DE10025106A1 (de) | 2000-05-20 | 2001-11-22 | Stolberger Metallwerke Gmbh | Elektrisch leitfähiges Metallband und Steckverbinder hieraus |
US6924044B2 (en) * | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
DE10139953A1 (de) | 2001-08-21 | 2003-03-27 | Stolberger Metallwerke Gmbh | Werkstoff für ein Metallband |
JP4441726B2 (ja) * | 2003-01-24 | 2010-03-31 | 石原薬品株式会社 | スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法 |
JP4740814B2 (ja) * | 2006-09-29 | 2011-08-03 | Jx日鉱日石金属株式会社 | 耐ウィスカー性に優れた銅合金リフローSnめっき材 |
EP2097254B1 (en) * | 2006-12-19 | 2011-10-05 | Mahle International GmbH | Sliding bearing |
US20080308300A1 (en) * | 2007-06-18 | 2008-12-18 | Conti Mark A | Method of manufacturing electrically conductive strips |
JP5313773B2 (ja) * | 2009-06-04 | 2013-10-09 | 三菱伸銅株式会社 | めっき付き銅条材及びその製造方法 |
CN101905387B (zh) * | 2010-02-04 | 2012-02-15 | 哈尔滨工业大学 | 纳米Ag增强低温无铅复合焊膏的制备方法 |
CN102085604A (zh) * | 2011-03-04 | 2011-06-08 | 上海交通大学 | Sn-Ag-Cu-Bi-Cr低银无铅焊料 |
-
2018
- 2018-05-23 DE DE102018208116.6A patent/DE102018208116A1/de not_active Ceased
-
2019
- 2019-05-21 JP JP2020564679A patent/JP2021524543A/ja not_active Withdrawn
- 2019-05-21 CN CN201980033674.2A patent/CN112135918A/zh not_active Withdrawn
- 2019-05-21 WO PCT/EP2019/063091 patent/WO2019224197A1/de unknown
- 2019-05-21 ES ES19726624T patent/ES2935178T3/es active Active
- 2019-05-21 PL PL19726624.0T patent/PL3797181T3/pl unknown
- 2019-05-21 KR KR1020207035991A patent/KR20210011951A/ko not_active Application Discontinuation
- 2019-05-21 US US17/055,016 patent/US20210218171A1/en not_active Abandoned
- 2019-05-21 EP EP19726624.0A patent/EP3797181B1/de active Active
Also Published As
Publication number | Publication date |
---|---|
CN112135918A (zh) | 2020-12-25 |
EP3797181B1 (de) | 2022-11-16 |
ES2935178T3 (es) | 2023-03-02 |
JP2021524543A (ja) | 2021-09-13 |
US20210218171A1 (en) | 2021-07-15 |
DE102018208116A1 (de) | 2019-11-28 |
EP3797181A1 (de) | 2021-03-31 |
KR20210011951A (ko) | 2021-02-02 |
WO2019224197A1 (de) | 2019-11-28 |
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