PL3567129T3 - Urządzenie przytrzymujące do przyjmowania wielu podłoży do ich obróbki, instalacja obróbkowa oraz sposób obróbki - Google Patents

Urządzenie przytrzymujące do przyjmowania wielu podłoży do ich obróbki, instalacja obróbkowa oraz sposób obróbki

Info

Publication number
PL3567129T3
PL3567129T3 PL19173443.3T PL19173443T PL3567129T3 PL 3567129 T3 PL3567129 T3 PL 3567129T3 PL 19173443 T PL19173443 T PL 19173443T PL 3567129 T3 PL3567129 T3 PL 3567129T3
Authority
PL
Poland
Prior art keywords
treatment
holding
substrates
same
holding device
Prior art date
Application number
PL19173443.3T
Other languages
English (en)
Inventor
Harald Liepack
Thomas Merz
Sebastian Wissel
Andreas Rack
Original Assignee
Solayer Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solayer Gmbh filed Critical Solayer Gmbh
Publication of PL3567129T3 publication Critical patent/PL3567129T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
PL19173443.3T 2018-05-09 2019-05-09 Urządzenie przytrzymujące do przyjmowania wielu podłoży do ich obróbki, instalacja obróbkowa oraz sposób obróbki PL3567129T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018111247 2018-05-09

Publications (1)

Publication Number Publication Date
PL3567129T3 true PL3567129T3 (pl) 2025-06-02

Family

ID=66476456

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19173443.3T PL3567129T3 (pl) 2018-05-09 2019-05-09 Urządzenie przytrzymujące do przyjmowania wielu podłoży do ich obróbki, instalacja obróbkowa oraz sposób obróbki

Country Status (11)

Country Link
US (1) US11332819B2 (pl)
EP (1) EP3567129B1 (pl)
JP (1) JP7442273B2 (pl)
KR (1) KR102719516B1 (pl)
CN (1) CN110473820B (pl)
DE (1) DE102019112088A1 (pl)
HR (1) HRP20250295T1 (pl)
HU (1) HUE070507T2 (pl)
PL (1) PL3567129T3 (pl)
RS (1) RS66601B1 (pl)
TW (1) TWI794475B (pl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210220813A1 (en) * 2020-01-16 2021-07-22 Johnson Matthey Public Limited Company Pallet for supporting a catalyst monolith during coating
TWI747611B (zh) * 2020-11-13 2021-11-21 天虹科技股份有限公司 晶片預清潔機台
TWI799120B (zh) * 2020-11-13 2023-04-11 天虹科技股份有限公司 晶片預清潔機台
TWI761270B (zh) * 2020-11-13 2022-04-11 天虹科技股份有限公司 晶片預清潔機台
WO2022128026A1 (de) * 2020-12-17 2022-06-23 Solayer Gmbh Verfahren und vorrichtung zum wechsel von testsubstraten in einer vakuumdurchlaufanlage, behandlungsverfahren und vakuumdurchlaufanlage
DE102024113390A1 (de) * 2024-05-14 2025-11-20 VON ARDENNE Asset GmbH & Co. KG Substratträger, Substratträger-Haltevorrichtung, Vakuumanordnung, Verwendung und Verfahren

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
US3396696A (en) * 1966-10-06 1968-08-13 Ralph F. Becker Lens turner for high vacuum evaporators
NL7205670A (pl) * 1972-03-16 1973-09-18
CH668430A5 (de) * 1986-07-31 1988-12-30 Satis Vacuum Ag Vakuum-beschichtungsanlage fuer optische substrate.
US4849250A (en) * 1988-01-27 1989-07-18 Storage Technology Corporation Method and apparatus for producing magnetically oriented films on substrates
DE4110490C2 (de) * 1991-03-30 2002-02-28 Unaxis Deutschland Holding Kathodenzerstäubungsanlage
US5911830A (en) * 1996-05-09 1999-06-15 Lucent Technologies Inc. Method and fixture for laser bar facet coating
DE19822064A1 (de) * 1998-05-16 1999-11-18 Leybold Ag Vorrichtung zum Halten von Linsen, insbesondere für in einer Vakuum-Aufdampfanlage oder Sputteranlage zu beschichtender Brillengläser
JP2002050678A (ja) * 2000-08-02 2002-02-15 Fujitsu Amd Semiconductor Kk ウェーハ搬送体、ウェーハ搬送機構及び方法、及び半導体製造装置
US6609877B1 (en) * 2000-10-04 2003-08-26 The Boc Group, Inc. Vacuum chamber load lock structure and article transport mechanism
DE102006041137B4 (de) * 2006-09-01 2015-02-12 Carl Zeiss Vision Gmbh Vorrichtung zum Wenden eines Gegenstands in einer Vakuumbeschichtungsanlage, Verfahren zum Wenden eines Gegenstands in einer Vakuumbeschichtungsanlage sowie deren Verwendung
JP5238657B2 (ja) * 2009-09-17 2013-07-17 富士フイルム株式会社 ワーク反転ユニット
JPWO2011013648A1 (ja) * 2009-07-30 2013-01-07 Hoya株式会社 光学レンズの蒸着装置
TW201134967A (en) * 2010-04-08 2011-10-16 Hon Hai Prec Ind Co Ltd Sputtering bracket and sputtering machine
CN103014617B (zh) * 2011-09-22 2014-05-14 株式会社新柯隆 薄膜形成装置
KR101928356B1 (ko) * 2012-02-16 2018-12-12 엘지이노텍 주식회사 반도체 제조 장치
US20140065303A1 (en) * 2012-08-31 2014-03-06 Robert Dennis Grejda Holding device for optical element
EP3289113A1 (de) * 2015-03-31 2018-03-07 Bühler Alzenau GmbH Verfahren zur herstellung von beschichteten substraten
TWM539150U (zh) * 2016-11-21 2017-04-01 環球晶圓股份有限公司 晶圓承載盤
US20190295880A1 (en) * 2018-03-26 2019-09-26 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover

Also Published As

Publication number Publication date
EP3567129C0 (de) 2024-12-11
US20190345601A1 (en) 2019-11-14
CN110473820A (zh) 2019-11-19
DE102019112088A1 (de) 2019-11-14
KR20190129008A (ko) 2019-11-19
HRP20250295T1 (hr) 2025-04-25
US11332819B2 (en) 2022-05-17
KR102719516B1 (ko) 2024-10-17
RS66601B1 (sr) 2025-04-30
JP7442273B2 (ja) 2024-03-04
CN110473820B (zh) 2024-09-27
TW201947699A (zh) 2019-12-16
TWI794475B (zh) 2023-03-01
JP2019208019A (ja) 2019-12-05
EP3567129A1 (de) 2019-11-13
HUE070507T2 (hu) 2025-06-28
EP3567129B1 (de) 2024-12-11

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