PL3174659T3 - Moduł lutowania - Google Patents

Moduł lutowania

Info

Publication number
PL3174659T3
PL3174659T3 PL15745731T PL15745731T PL3174659T3 PL 3174659 T3 PL3174659 T3 PL 3174659T3 PL 15745731 T PL15745731 T PL 15745731T PL 15745731 T PL15745731 T PL 15745731T PL 3174659 T3 PL3174659 T3 PL 3174659T3
Authority
PL
Poland
Prior art keywords
soldering module
soldering
module
Prior art date
Application number
PL15745731T
Other languages
English (en)
Inventor
Antonie Cornelis COLIJN
Original Assignee
Illinois Tool Works Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc. filed Critical Illinois Tool Works Inc.
Publication of PL3174659T3 publication Critical patent/PL3174659T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0676—Conveyors therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
PL15745731T 2014-07-29 2015-07-24 Moduł lutowania PL3174659T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014110720.9A DE102014110720A1 (de) 2014-07-29 2014-07-29 Lötmodul
PCT/US2015/042021 WO2016018759A1 (en) 2014-07-29 2015-07-24 Soldering module
EP15745731.8A EP3174659B1 (en) 2014-07-29 2015-07-24 Soldering module

Publications (1)

Publication Number Publication Date
PL3174659T3 true PL3174659T3 (pl) 2019-09-30

Family

ID=53777032

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15745731T PL3174659T3 (pl) 2014-07-29 2015-07-24 Moduł lutowania

Country Status (8)

Country Link
US (1) US10086460B2 (pl)
EP (1) EP3174659B1 (pl)
CN (1) CN106536109B (pl)
DE (1) DE102014110720A1 (pl)
ES (1) ES2735080T3 (pl)
PL (1) PL3174659T3 (pl)
PT (1) PT3174659T (pl)
WO (1) WO2016018759A1 (pl)

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WO2019108508A1 (en) * 2017-11-28 2019-06-06 Nordson Corporation Synchronous motion selective soldering apparatus and method
JP6852710B2 (ja) * 2018-04-20 2021-03-31 オムロン株式会社 噴流式はんだ付け装置
CN108705170A (zh) * 2018-05-31 2018-10-26 深圳市阿拉玎光电自动化有限公司 双炉胆焊接装置以及焊接设备
JP7272579B2 (ja) * 2019-01-15 2023-05-12 セイテック株式会社 ポイントはんだ付け装置
JP6928018B2 (ja) * 2019-03-06 2021-09-01 ファナック株式会社 半田付けを行うロボット装置
EP3785837A1 (en) * 2019-08-27 2021-03-03 Illinois Tool Works, Inc. Nozzle, system and method
EP3936271A1 (en) * 2020-07-08 2022-01-12 Illinois Tool Works, Inc. Soldering nozzle, system and use
EP3939731A1 (en) * 2020-07-08 2022-01-19 Illinois Tool Works, Inc. Soldering system and use
CN114515881A (zh) * 2022-03-26 2022-05-20 宁波诚兴道电子科技有限公司 一种pcba线路板焊接设备及工艺
CN116500050B (zh) * 2023-06-28 2024-01-12 四川托璞勒科技有限公司 一种pcb板视觉检测系统

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Also Published As

Publication number Publication date
US10086460B2 (en) 2018-10-02
PT3174659T (pt) 2019-07-25
US20170209949A1 (en) 2017-07-27
EP3174659A1 (en) 2017-06-07
CN106536109A (zh) 2017-03-22
EP3174659B1 (en) 2019-05-01
DE102014110720A1 (de) 2016-02-04
CN106536109B (zh) 2019-09-03
ES2735080T3 (es) 2019-12-16
WO2016018759A1 (en) 2016-02-04

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