PL2845928T3 - Wodna kompozycja elektrolitu o obniżonej emisji do atmosfery - Google Patents

Wodna kompozycja elektrolitu o obniżonej emisji do atmosfery

Info

Publication number
PL2845928T3
PL2845928T3 PL13183142T PL13183142T PL2845928T3 PL 2845928 T3 PL2845928 T3 PL 2845928T3 PL 13183142 T PL13183142 T PL 13183142T PL 13183142 T PL13183142 T PL 13183142T PL 2845928 T3 PL2845928 T3 PL 2845928T3
Authority
PL
Poland
Prior art keywords
aqueous electrolyte
electrolyte composition
reduced airborne
airborne emission
emission
Prior art date
Application number
PL13183142T
Other languages
English (en)
Inventor
Helmut Horsthemke
Original Assignee
Macdermid Enthone Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=49084935&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL2845928(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Macdermid Enthone Inc. filed Critical Macdermid Enthone Inc.
Publication of PL2845928T3 publication Critical patent/PL2845928T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/04—Electroplating: Baths therefor from solutions of chromium
    • C25D3/10—Electroplating: Baths therefor from solutions of chromium characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C317/00—Sulfones; Sulfoxides
    • C07C317/02—Sulfones; Sulfoxides having sulfone or sulfoxide groups bound to acyclic carbon atoms
    • C07C317/04—Sulfones; Sulfoxides having sulfone or sulfoxide groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PL13183142T 2013-09-05 2013-09-05 Wodna kompozycja elektrolitu o obniżonej emisji do atmosfery PL2845928T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP13183142.2A EP2845928B1 (en) 2013-09-05 2013-09-05 Aqueous electrolyte composition having a reduced airborne emission

Publications (1)

Publication Number Publication Date
PL2845928T3 true PL2845928T3 (pl) 2020-05-18

Family

ID=49084935

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13183142T PL2845928T3 (pl) 2013-09-05 2013-09-05 Wodna kompozycja elektrolitu o obniżonej emisji do atmosfery

Country Status (7)

Country Link
US (1) US10081876B2 (pl)
EP (1) EP2845928B1 (pl)
JP (1) JP6148798B2 (pl)
CN (1) CN105980607B (pl)
ES (1) ES2766775T3 (pl)
PL (1) PL2845928T3 (pl)
WO (1) WO2015035219A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9809891B2 (en) 2014-06-30 2017-11-07 Rohm And Haas Electronic Materials Llc Plating method

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2750334A (en) * 1953-01-29 1956-06-12 Udylite Res Corp Electrodeposition of chromium
US2732398A (en) * 1953-01-29 1956-01-24 cafiicfzsojk
US2750337A (en) * 1953-04-22 1956-06-12 Udylite Res Corp Electroplating of chromium
US2750336A (en) * 1953-08-31 1956-06-12 Udylite Res Corp Chromium plating
US2913377A (en) * 1956-06-11 1959-11-17 Udylite Res Corp Aqueous electrolytic process
FR2241542A1 (en) * 1973-07-13 1975-03-21 Parker Ste Continentale Perfluoroalkyl compounds contg. hydrophilic groups - used in surface coating baths
DE2508708C2 (de) * 1975-02-28 1982-07-01 Bayer Ag, 5090 Leverkusen Elektrolytlösungen auf Cr (VI)-Basis zur galvanischen Abscheidung von Chromschichten
JPS51135836A (en) 1975-05-20 1976-11-25 Matsushita Electric Industrial Co Ltd Electroless copper plating solusion
JPS5476443A (en) * 1977-11-30 1979-06-19 Dainippon Ink & Chem Inc Fluorine type surfactant mixture suitable for preventing planting mist
US4484990A (en) 1980-06-16 1984-11-27 Minnesota Mining And Manufacturing Company Mist suppressant for solvent extraction metal electrowinning
SE8204505L (sv) 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
US4770814A (en) * 1983-08-31 1988-09-13 The Dow Chemical Company Shear stable antimisting formulations
US4849059A (en) * 1988-09-13 1989-07-18 Macdermid, Incorporated Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor
GB2250515B (en) 1990-11-27 1994-09-28 Rhone Poulenc Chemicals Controlling acid misting during electrolytic recovery of metals
US5468353A (en) 1994-05-05 1995-11-21 Minnesota Mining And Manufacturing Company Mist suppressant for solvent extraction metal electrowinning
DE4435840C1 (de) * 1994-10-07 1996-03-21 Bayer Ag Verwendung von alkylsubstituierten Perfluoralkylsulfonamiden als Sprühnebelinhibitoren für basische Elektrolysebäder
ES2310985T3 (es) * 2000-11-11 2009-02-01 Enthone, Inc. Procedimiento para la deposicion electrolitica a partir de una solucion que contiene cromo.
US7384533B2 (en) 2001-07-24 2008-06-10 3M Innovative Properties Company Electrolytic processes with reduced cell voltage and gas formation
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
JP4211313B2 (ja) 2002-01-29 2009-01-21 Ｄｉｃ株式会社 フッ素系界面活性剤組成物
US6833479B2 (en) * 2002-08-16 2004-12-21 Cognis Corporation Antimisting agents
DE10246453A1 (de) * 2002-10-04 2004-04-15 Enthone Inc., West Haven Verfahren zur stromlosen Abscheidung von Nickel
DE102005059367B4 (de) * 2005-12-13 2014-04-03 Enthone Inc. Elektrolytzusammensetzung und Verfahren zur Abscheidung rissfreier, korrosionsbeständiger und harter Chrom- und Chromlegierungsschichten
DE102006042076A1 (de) * 2006-09-05 2008-03-20 Goldschmidt Tib Gmbh Ein neues Additiv für Chromelektrolyte
US8343326B2 (en) 2006-10-06 2013-01-01 Basf Corporation Acid mist mitigation agents for electrolyte solutions
JP2008266714A (ja) 2007-04-19 2008-11-06 Meltex Inc 被めっき物の沈降性改善処理剤及びその沈降性改善処理剤を用いたバレルめっき方法
DE102007048142A1 (de) * 2007-10-05 2009-04-09 Enthone Inc., West Haven Verfahren zur galvanotechnischen Beschichtung von Substratoberflächen
US8263800B2 (en) * 2008-07-01 2012-09-11 E. I. Du Pont De Nemours And Company Partially fluorinated sulfonated surfactants
ES2363566T5 (es) * 2008-10-22 2020-04-16 Macdermid Enthone Inc Procedimiento para la deposición galvánica de capas de cromo duro
US8168683B2 (en) * 2009-10-15 2012-05-01 E. I. Du Pont De Nemours And Company Fluorinated vinylidene cationic surfactant
US8545688B2 (en) 2010-05-28 2013-10-01 Toyota Boshoku Kabushiki Kaisha Method for electrochemically depositing carbon nitride films on a substrate
WO2013071475A1 (zh) * 2011-11-14 2013-05-23 广州天至环保科技有限公司 一种增强pcb镀层抗氧化和耐腐蚀性能的水相封孔剂及其使用方法

Also Published As

Publication number Publication date
US20160222534A1 (en) 2016-08-04
CN105980607B (zh) 2019-07-16
WO2015035219A1 (en) 2015-03-12
CN105980607A (zh) 2016-09-28
ES2766775T3 (es) 2020-06-15
JP6148798B2 (ja) 2017-06-14
EP2845928A1 (en) 2015-03-11
US10081876B2 (en) 2018-09-25
JP2016531206A (ja) 2016-10-06
EP2845928B1 (en) 2019-11-06

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