PL2603928T3 - Urządzenie i sposób łączenia termicznego - Google Patents

Urządzenie i sposób łączenia termicznego

Info

Publication number
PL2603928T3
PL2603928T3 PL11734169T PL11734169T PL2603928T3 PL 2603928 T3 PL2603928 T3 PL 2603928T3 PL 11734169 T PL11734169 T PL 11734169T PL 11734169 T PL11734169 T PL 11734169T PL 2603928 T3 PL2603928 T3 PL 2603928T3
Authority
PL
Poland
Prior art keywords
thermal interfacing
interfacing
thermal
Prior art date
Application number
PL11734169T
Other languages
English (en)
Inventor
Gary Beale
Eamon Mcerlean
Original Assignee
Emblation Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emblation Limited filed Critical Emblation Limited
Publication of PL2603928T3 publication Critical patent/PL2603928T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/52—Circuit arrangements for protecting such amplifiers
    • H03F1/523—Circuit arrangements for protecting such amplifiers for amplifiers using field-effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
PL11734169T 2010-07-16 2011-07-15 Urządzenie i sposób łączenia termicznego PL2603928T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36489010P 2010-07-16 2010-07-16
EP11734169.3A EP2603928B1 (en) 2010-07-16 2011-07-15 Apparatus and method for thermal interfacing
PCT/GB2011/001059 WO2012007722A2 (en) 2010-07-16 2011-07-15 Apparatus and method for thermal interfacing

Publications (1)

Publication Number Publication Date
PL2603928T3 true PL2603928T3 (pl) 2021-01-11

Family

ID=44628753

Family Applications (1)

Application Number Title Priority Date Filing Date
PL11734169T PL2603928T3 (pl) 2010-07-16 2011-07-15 Urządzenie i sposób łączenia termicznego

Country Status (9)

Country Link
US (1) US9054659B2 (pl)
EP (1) EP2603928B1 (pl)
JP (3) JP2013531389A (pl)
CN (1) CN103189978B (pl)
AU (1) AU2011278089B2 (pl)
CA (1) CA2805695C (pl)
ES (1) ES2797389T3 (pl)
PL (1) PL2603928T3 (pl)
WO (1) WO2012007722A2 (pl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5928233B2 (ja) * 2012-08-03 2016-06-01 富士通株式会社 放熱器及び該放熱器を備えた電子装置
CN108701688B (zh) * 2015-12-04 2021-11-09 罗姆股份有限公司 功率模块装置、冷却构造体、以及电动汽车或混合动力汽车
TWI618477B (zh) * 2016-02-25 2018-03-11 台達電子工業股份有限公司 射頻放大系統及其散熱裝置
WO2018125051A1 (en) 2016-12-27 2018-07-05 Whirlpool Corporation Nano-cooling in solid-state cooking microwave ovens
JP7049574B2 (ja) * 2017-03-16 2022-04-07 カシオ計算機株式会社 冷却装置、光源装置及び投影装置
KR102526941B1 (ko) * 2021-10-19 2023-04-28 엘아이지넥스원 주식회사 고출력 증폭기의 정비성 개선을 위한 방열판 구조 및 고출력 증폭기와 방열판의 분리 방법

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* Cited by examiner, † Cited by third party
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US4320349A (en) 1979-12-13 1982-03-16 Zenith Radio Corporation Thermal coupler for amplifier temperature compensation
US4376287A (en) * 1980-10-29 1983-03-08 Rca Corporation Microwave power circuit with an active device mounted on a heat dissipating substrate
JPS6096842U (ja) * 1983-12-07 1985-07-02 株式会社安川電機 電子装置
JPH0346521Y2 (pl) * 1985-02-27 1991-10-01
US4967201A (en) 1987-10-22 1990-10-30 Westinghouse Electric Corp. Multi-layer single substrate microwave transmit/receive module
JPH04296103A (ja) * 1991-03-25 1992-10-20 Mitsubishi Electric Corp 高周波半導体混成集積回路装置
US5208554A (en) 1992-01-24 1993-05-04 Systron Donner Corporation High power compact microwave amplifier
US5276585A (en) 1992-11-16 1994-01-04 Thermalloy, Inc. Heat sink mounting apparatus
US5313099A (en) 1993-03-04 1994-05-17 Square Head, Inc. Heat sink assembly for solid state devices
KR100245971B1 (ko) 1995-11-30 2000-03-02 포만 제프리 엘 중합접착제를 금속에 접착시키기 위한 접착력 촉진층을 이용하는 히트싱크어셈블리 및 그 제조방법
US6075701A (en) 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6543524B2 (en) * 2000-11-29 2003-04-08 Cool Options, Inc. Overplated thermally conductive part with EMI shielding
KR100396772B1 (ko) 2001-02-02 2003-09-03 엘지전자 주식회사 마이크로파를 이용한 조명기구
US20020122295A1 (en) * 2001-03-05 2002-09-05 Ralph Laing Hard disk drive tray
JP2003168769A (ja) * 2001-11-30 2003-06-13 Mitsubishi Electric Corp 電力用半導体装置
JP2004158726A (ja) * 2002-11-07 2004-06-03 Kobe Steel Ltd ヒートスプレッダ付半導体素子及び半導体パッケージ
DE10333229A1 (de) * 2003-07-21 2005-02-24 Peter Heiss Vorrichtung zum Kühlen eines wärmeerzeugenden Schaltkreises
JP4296103B2 (ja) 2004-02-17 2009-07-15 株式会社東芝 ポンプ運転支援装置
US7342788B2 (en) * 2004-03-12 2008-03-11 Powerwave Technologies, Inc. RF power amplifier assembly with heat pipe enhanced pallet
JP4543864B2 (ja) * 2004-10-05 2010-09-15 ソニー株式会社 放熱部品及びその製造方法
US7439618B2 (en) * 2005-03-25 2008-10-21 Intel Corporation Integrated circuit thermal management method and apparatus
JP2007019585A (ja) 2005-07-05 2007-01-25 Sharp Corp 高周波電力増幅器および無線通信装置
JP4799069B2 (ja) * 2005-07-28 2011-10-19 Ｊｆｅ精密株式会社 電子機器で用いる放熱板
CN100543974C (zh) 2005-09-02 2009-09-23 富准精密工业(深圳)有限公司 散热模组及其制造方法
TWI305131B (en) * 2005-09-08 2009-01-01 Ind Tech Res Inst Heat dissipation device and composite material with high thermal conductivity
US7278470B2 (en) 2005-11-21 2007-10-09 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7347251B2 (en) * 2005-12-21 2008-03-25 International Business Machines Corporation Heat sink for distributing a thermal load
US20080067668A1 (en) * 2006-09-15 2008-03-20 Wei Shi Microelectronic package, method of manufacturing same, and system containing same
JP4531087B2 (ja) * 2007-11-19 2010-08-25 三菱電機株式会社 電力用半導体装置
JP2009266983A (ja) * 2008-04-24 2009-11-12 Sumitomo Electric Ind Ltd 放熱構造及び該放熱構造の製造方法並びに該放熱構造を用いた放熱装置
JP2009295916A (ja) * 2008-06-09 2009-12-17 Daikin Ind Ltd 冷凍装置

Also Published As

Publication number Publication date
AU2011278089A1 (en) 2013-02-21
CA2805695A1 (en) 2012-01-19
CN103189978A (zh) 2013-07-03
US9054659B2 (en) 2015-06-09
JP2018056585A (ja) 2018-04-05
ES2797389T3 (es) 2020-12-02
EP2603928B1 (en) 2020-03-18
CN103189978B (zh) 2015-12-09
CA2805695C (en) 2019-06-04
JP2013531389A (ja) 2013-08-01
US20130154748A1 (en) 2013-06-20
JP6527928B2 (ja) 2019-06-12
EP2603928A2 (en) 2013-06-19
JP2016139810A (ja) 2016-08-04
WO2012007722A3 (en) 2012-04-05
AU2011278089B2 (en) 2015-07-16
WO2012007722A2 (en) 2012-01-19

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