PL2462789T3 - Element czujnikowy z otworem do łączenia wskrośnego - Google Patents

Element czujnikowy z otworem do łączenia wskrośnego

Info

Publication number
PL2462789T3
PL2462789T3 PL10735237T PL10735237T PL2462789T3 PL 2462789 T3 PL2462789 T3 PL 2462789T3 PL 10735237 T PL10735237 T PL 10735237T PL 10735237 T PL10735237 T PL 10735237T PL 2462789 T3 PL2462789 T3 PL 2462789T3
Authority
PL
Poland
Prior art keywords
sensor element
connection hole
interlayer connection
interlayer
hole
Prior art date
Application number
PL10735237T
Other languages
English (en)
Inventor
Oliver Dotterweich
Antje Taeuber
Jens Schneider
Thomas Leuschner
Petri Dulce Maria Couto
Christoph Renger
Michael Sauerhammer
Andreas Rottmann
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of PL2462789T3 publication Critical patent/PL2462789T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/406—Cells and probes with solid electrolytes
    • G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
    • G01N27/4075—Composition or fabrication of the electrodes and coatings thereon, e.g. catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)
  • Molecular Biology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Measuring Oxygen Concentration In Cells (AREA)
PL10735237T 2009-08-03 2010-07-14 Element czujnikowy z otworem do łączenia wskrośnego PL2462789T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009028194A DE102009028194B3 (de) 2009-08-03 2009-08-03 Sensorelement mit Durchkontaktierloch
EP10735237A EP2462789B1 (de) 2009-08-03 2010-07-14 Sensorelement mit durchkontaktierloch
PCT/EP2010/060121 WO2011015432A1 (de) 2009-08-03 2010-07-14 Sensorelement mit durchkontaktierloch

Publications (1)

Publication Number Publication Date
PL2462789T3 true PL2462789T3 (pl) 2013-08-30

Family

ID=42575784

Family Applications (1)

Application Number Title Priority Date Filing Date
PL10735237T PL2462789T3 (pl) 2009-08-03 2010-07-14 Element czujnikowy z otworem do łączenia wskrośnego

Country Status (9)

Country Link
US (1) US20120111726A1 (pl)
EP (1) EP2462789B1 (pl)
JP (1) JP5174991B2 (pl)
CN (1) CN102474990B (pl)
BR (1) BR112012002334B1 (pl)
DE (1) DE102009028194B3 (pl)
ES (1) ES2403088T3 (pl)
PL (1) PL2462789T3 (pl)
WO (1) WO2011015432A1 (pl)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10052848B2 (en) 2012-03-06 2018-08-21 Apple Inc. Sapphire laminates
DE102013211791A1 (de) 2013-06-21 2014-12-24 Robert Bosch Gmbh Sensorelement mit Kontaktfläche
DE102013211796A1 (de) 2013-06-21 2014-12-24 Robert Bosch Gmbh Sensorelement mit Leiterbahn und Durchführung
US9154678B2 (en) 2013-12-11 2015-10-06 Apple Inc. Cover glass arrangement for an electronic device
US9478472B2 (en) * 2014-05-19 2016-10-25 Dyi-chung Hu Substrate components for packaging IC chips and electronic device packages of the same
US10103447B2 (en) 2014-06-13 2018-10-16 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling structure
US9917372B2 (en) 2014-06-13 2018-03-13 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling arrangement
CN104021843A (zh) * 2014-06-27 2014-09-03 东风电子科技股份有限公司 NOx传感器用的绝缘层浆料及其用于制备NOx传感器绝缘层的方法
US10225925B2 (en) * 2014-08-29 2019-03-05 Nxp Usa, Inc. Radio frequency coupling and transition structure
US9887449B2 (en) * 2014-08-29 2018-02-06 Nxp Usa, Inc. Radio frequency coupling structure and a method of manufacturing thereof
US9976979B2 (en) * 2014-09-25 2018-05-22 Ngk Spark Plug Co., Ltd. Gas sensor element, gas sensor, and method of manufacturing gas sensor element
US10406634B2 (en) * 2015-07-01 2019-09-10 Apple Inc. Enhancing strength in laser cutting of ceramic components
DE102015213454A1 (de) * 2015-07-17 2017-01-19 Robert Bosch Gmbh Sensorelement zur Erfassung mindestens einer Eigenschaft eines Messgases in einem Messgasraum

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5425816A (en) * 1991-08-19 1995-06-20 Spectrolab, Inc. Electrical feedthrough structure and fabrication method
US6242078B1 (en) * 1998-07-28 2001-06-05 Isola Laminate Systems Corp. High density printed circuit substrate and method of fabrication
US6388208B1 (en) * 1999-06-11 2002-05-14 Teradyne, Inc. Multi-connection via with electrically isolated segments
DE19928165A1 (de) * 1999-06-19 2000-12-21 Bosch Gmbh Robert Planares Sensorelement für einen Gassensor
DE10014995C1 (de) * 2000-03-25 2001-07-19 Bosch Gmbh Robert Elektrochemischer Meßfühler
JP4025564B2 (ja) * 2001-06-28 2007-12-19 京セラ株式会社 検出素子
DE202004021310U1 (de) * 2003-12-24 2007-09-13 Samsung Electro-Mechanics Co.Ltd., Suwon Gedruckte Leiterplatte und Aufbau mit schrägen Durchkontakten
DE102004025949A1 (de) * 2004-05-27 2005-12-22 Robert Bosch Gmbh Sensorelement für einen Gasmessfühler
JP4936136B2 (ja) * 2006-11-29 2012-05-23 日本特殊陶業株式会社 センサ素子、センサ素子製造方法およびガスセンサ
JP4971829B2 (ja) * 2007-02-27 2012-07-11 日本碍子株式会社 ガスセンサ
DE102007053427A1 (de) * 2007-11-09 2009-05-14 Robert Bosch Gmbh Sensorelement mit Festelektrolyt und isoliertem leitenden Element
JP5125470B2 (ja) * 2007-12-13 2013-01-23 富士通株式会社 配線基板及びその製造方法

Also Published As

Publication number Publication date
CN102474990B (zh) 2015-11-25
WO2011015432A1 (de) 2011-02-10
JP2013501214A (ja) 2013-01-10
ES2403088T3 (es) 2013-05-14
EP2462789B1 (de) 2013-03-27
EP2462789A1 (de) 2012-06-13
JP5174991B2 (ja) 2013-04-03
BR112012002334B1 (pt) 2019-09-03
BR112012002334A2 (pt) 2016-05-31
DE102009028194B3 (de) 2011-03-24
US20120111726A1 (en) 2012-05-10
CN102474990A (zh) 2012-05-23

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