PL2457412T3 - Jednostka grzejna, w szczególności wysokotemperaturowa jednostka grzejna jak też sposób jej wytwarzania - Google Patents

Jednostka grzejna, w szczególności wysokotemperaturowa jednostka grzejna jak też sposób jej wytwarzania

Info

Publication number
PL2457412T3
PL2457412T3 PL10736624T PL10736624T PL2457412T3 PL 2457412 T3 PL2457412 T3 PL 2457412T3 PL 10736624 T PL10736624 T PL 10736624T PL 10736624 T PL10736624 T PL 10736624T PL 2457412 T3 PL2457412 T3 PL 2457412T3
Authority
PL
Poland
Prior art keywords
heater
production
particular high
temperature
temperature heater
Prior art date
Application number
PL10736624T
Other languages
English (en)
Inventor
Harun Erismis
Michael Geiss
Dominik Nemec
Frank Jördens
Gerhard Schmidmayer
Philipp Schaller
Jürgen Salomon
Original Assignee
Fraunhofer Ges Forschung
Bsh Bosch & Siemens Hausgeraete Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Ges Forschung, Bsh Bosch & Siemens Hausgeraete Gmbh filed Critical Fraunhofer Ges Forschung
Publication of PL2457412T3 publication Critical patent/PL2457412T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0014—Devices wherein the heating current flows through particular resistances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/011—Heaters using laterally extending conductive material as connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/028—Heaters specially adapted for trays or plates to keep food or liquids hot
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
    • H05B2214/04—Heating means manufactured by using nanotechnology
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
PL10736624T 2009-07-21 2010-07-19 Jednostka grzejna, w szczególności wysokotemperaturowa jednostka grzejna jak też sposób jej wytwarzania PL2457412T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009034307A DE102009034307A1 (de) 2009-07-21 2009-07-21 Hochtemperaturheizung sowie Verfahren zu dessen Herstellung
PCT/EP2010/004389 WO2011009577A1 (de) 2009-07-21 2010-07-19 Heizung, insbesondere hochtemperaturheizung, sowie verfahren zu dessen herstellung
EP10736624.7A EP2457412B1 (de) 2009-07-21 2010-07-19 Heizung, insbesondere hochtemperaturheizung, sowie verfahren zu deren herstellung

Publications (1)

Publication Number Publication Date
PL2457412T3 true PL2457412T3 (pl) 2013-09-30

Family

ID=42668837

Family Applications (1)

Application Number Title Priority Date Filing Date
PL10736624T PL2457412T3 (pl) 2009-07-21 2010-07-19 Jednostka grzejna, w szczególności wysokotemperaturowa jednostka grzejna jak też sposób jej wytwarzania

Country Status (8)

Country Link
US (2) US9578691B2 (pl)
EP (1) EP2457412B1 (pl)
KR (1) KR20120038998A (pl)
DE (1) DE102009034307A1 (pl)
ES (1) ES2422704T3 (pl)
PL (1) PL2457412T3 (pl)
SI (1) SI2457412T1 (pl)
WO (1) WO2011009577A1 (pl)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011086448A1 (de) * 2011-11-16 2013-05-16 Margarete Franziska Althaus Verfahren zum Herstellen eines Heizelements
WO2013129814A1 (ko) * 2012-02-28 2013-09-06 한라비스테온공조 주식회사 차량용 히터
US10231287B2 (en) 2012-04-20 2019-03-12 Universitat Bremen (Bccms) Electrical heating device, component and method for the production thereof
JP5989901B2 (ja) * 2012-07-09 2016-09-14 ハノン システムズ 車両用ヒーター
ITMO20120243A1 (it) * 2012-10-04 2014-04-05 Giemme S N C Di Corradini Marco & C Pannello riscaldante ad elevata efficienza e relativo procedimento di realizzazione
FR3005388B1 (fr) * 2013-05-03 2017-10-06 Topinox Sarl Element de chauffage a sections ayant differentes puissances de chauffage, et appareil de cuisson.
DE102014110186B4 (de) * 2014-07-18 2018-10-31 Anneliese Backtechnik Gmbh Vorrichtung zur Wärmebehandlung von Lebensmitteln
KR101718076B1 (ko) * 2015-05-14 2017-03-20 주식회사 대화알로이테크 전기차량의 히터장치 및 그 제어방법
KR101698908B1 (ko) 2015-05-14 2017-02-01 주식회사 대화알로이테크 하이브리드 차량용 배터리 프리 히팅장치 및 그 제어 방법
FR3054947A1 (fr) * 2016-08-05 2018-02-09 Bp Systemes Int Structure chauffante
US10917942B2 (en) 2017-07-31 2021-02-09 Samsung Electronics Co., Ltd. Structure, planar heater including the same, heating device including the planar heater, and method of preparing the structure
DE102018203430A1 (de) 2018-03-07 2019-09-12 Voestalpine Stahl Gmbh Flächenelektrobauteil und verfahren zur herstellung
FR3088835B1 (fr) * 2018-11-27 2022-03-04 Blackleaf Procédé de réalisation, d’application et de fixation d’un revêtement de surface multicouches sur un substrat hôte et dispositif de substrat hôte susceptible d’être obtenu par ledit procédé
DE102019112528A1 (de) * 2019-05-14 2020-11-19 Michael Steidle Flächenheizelement
US11825568B2 (en) * 2021-04-01 2023-11-21 Whirlpool Corporation Segmented thermoresistive heating system

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9721812D0 (en) * 1997-10-15 1997-12-17 Glaverbel Transparent heat-swellable material
DE10001330A1 (de) 2000-01-14 2001-07-19 Heinrich Schuermann Elektrokochplatte
JP2003109732A (ja) * 2001-09-27 2003-04-11 Seiji Motojima コイル状炭素繊維を備える発熱体及びそれに用いるコイル状炭素繊維並びにそれらの用途
DE10336920A1 (de) 2003-08-07 2005-03-10 Heinrich Schuermann Elektrobratofenplatte(n) zum Heizen
US7164104B2 (en) * 2004-06-14 2007-01-16 Watlow Electric Manufacturing Company In-line heater for use in semiconductor wet chemical processing and method of manufacturing the same
CN101019208B (zh) * 2004-06-28 2010-12-08 京瓷株式会社 晶片加热装置及半导体制造装置
DE102004044352B4 (de) * 2004-09-09 2010-09-02 E.G.O. Elektro-Gerätebau GmbH Heizeinrichtung für ein Elektrowärmegerät
DE202005013822U1 (de) 2005-05-19 2006-09-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Heizelement
DE102005049428A1 (de) 2005-10-15 2007-06-06 Schürmann, Heinrich Plattenförmige elektrische Widerstandsheizung zur Raumklimatisierung in Wohnungen und Gebäuden. Die Verbundplatten können Zimmerwände stabilisieren.
EP1942533B1 (en) * 2005-10-28 2013-05-01 Kyocera Corporation Layered piezoelectric element and injection device using the same
JP4482535B2 (ja) 2006-03-24 2010-06-16 日本碍子株式会社 加熱装置
WO2008002071A1 (en) * 2006-06-27 2008-01-03 Naos Co., Ltd. Method for manufacturing planar heating element using carbon micro-fibers
US8166645B2 (en) * 2006-08-23 2012-05-01 Rockwell Collins, Inc. Method for providing near-hermetically coated, thermally protected integrated circuit assemblies
DE102007018540A1 (de) * 2007-04-19 2008-10-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrisch leitfähige und transparente Zusammensetzung
DE102007028109A1 (de) * 2007-06-19 2008-12-24 Märkisches Werk GmbH Thermisch gespritzte, gasdichte Schutzschicht für metallische Substrate
DE202009000136U1 (de) 2008-07-29 2009-05-20 Beier, Gerhard M., Dipl.-Ing. Infrarot-CNT-Heizeinrichtung
DE102009000136A1 (de) 2009-01-12 2010-07-15 Robert Bosch Gmbh Vorrichtung zur Informationsgewinnung aus einem Fahrzeuginnenraum

Also Published As

Publication number Publication date
WO2011009577A1 (de) 2011-01-27
DE102009034307A1 (de) 2011-01-27
US20120118873A1 (en) 2012-05-17
EP2457412B1 (de) 2013-05-01
ES2422704T3 (es) 2013-09-13
US10149350B2 (en) 2018-12-04
US9578691B2 (en) 2017-02-21
KR20120038998A (ko) 2012-04-24
US20170150552A1 (en) 2017-05-25
EP2457412A1 (de) 2012-05-30
SI2457412T1 (sl) 2013-08-30

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