PL2118027T3 - Sposób i urządzenie do wytwarzania szczeliny rozdzielczej w szybie szklanej - Google Patents
Sposób i urządzenie do wytwarzania szczeliny rozdzielczej w szybie szklanejInfo
- Publication number
- PL2118027T3 PL2118027T3 PL07845307T PL07845307T PL2118027T3 PL 2118027 T3 PL2118027 T3 PL 2118027T3 PL 07845307 T PL07845307 T PL 07845307T PL 07845307 T PL07845307 T PL 07845307T PL 2118027 T3 PL2118027 T3 PL 2118027T3
- Authority
- PL
- Poland
- Prior art keywords
- glass pane
- production
- dividing gap
- ray bundle
- dividing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
- B23K2103/54—Glass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Joining Of Glass To Other Materials (AREA)
- Laser Beam Processing (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT0002707A AT504726A1 (de) | 2007-01-05 | 2007-01-05 | Verfahren und vorrichtung zum herstellen eines trennspalts in einer glasscheibe |
| EP07845307A EP2118027B1 (de) | 2007-01-05 | 2007-12-21 | Verfahren und vorrichtung zum herstellen eines trennspalts in einer glasscheibe |
| PCT/AT2007/000583 WO2008080182A1 (de) | 2007-01-05 | 2007-12-21 | Verfahren und vorrichtung zum herstellen eines trennspalts in einer glasscheibe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2118027T3 true PL2118027T3 (pl) | 2011-09-30 |
Family
ID=39295905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL07845307T PL2118027T3 (pl) | 2007-01-05 | 2007-12-21 | Sposób i urządzenie do wytwarzania szczeliny rozdzielczej w szybie szklanej |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP2118027B1 (pl) |
| AT (2) | AT504726A1 (pl) |
| DE (1) | DE502007006812D1 (pl) |
| DK (1) | DK2118027T3 (pl) |
| ES (1) | ES2365068T3 (pl) |
| PL (1) | PL2118027T3 (pl) |
| PT (1) | PT2118027E (pl) |
| SI (1) | SI2118027T1 (pl) |
| WO (1) | WO2008080182A1 (pl) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT13206U1 (de) | 2012-07-17 | 2013-08-15 | Lisec Maschb Gmbh | Verfahren und Anordnung zum Teilen von Flachglas |
| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| EP3166895B1 (en) | 2014-07-08 | 2021-11-24 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| JP2017530867A (ja) | 2014-07-14 | 2017-10-19 | コーニング インコーポレイテッド | 長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法 |
| CN208586209U (zh) | 2014-07-14 | 2019-03-08 | 康宁股份有限公司 | 一种用于在工件中形成限定轮廓的多个缺陷的系统 |
| WO2016010991A1 (en) * | 2014-07-14 | 2016-01-21 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| EP3169479B1 (en) | 2014-07-14 | 2019-10-02 | Corning Incorporated | Method of and system for arresting incident crack propagation in a transparent material |
| US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
| KR20170105562A (ko) | 2015-01-12 | 2017-09-19 | 코닝 인코포레이티드 | 다중 광자 흡수 방법을 사용한 열적 템퍼링된 기판의 레이저 절단 |
| JP7292006B2 (ja) | 2015-03-24 | 2023-06-16 | コーニング インコーポレイテッド | ディスプレイガラス組成物のレーザ切断及び加工 |
| EP3274313A1 (en) | 2015-03-27 | 2018-01-31 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| CN107835794A (zh) | 2015-07-10 | 2018-03-23 | 康宁股份有限公司 | 在挠性基材板中连续制造孔的方法和与此相关的产品 |
| EP3452418B1 (en) | 2016-05-06 | 2022-03-02 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
| US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| KR20190035805A (ko) | 2016-07-29 | 2019-04-03 | 코닝 인코포레이티드 | 레이저 처리를 위한 장치 및 방법 |
| JP2019532908A (ja) | 2016-08-30 | 2019-11-14 | コーニング インコーポレイテッド | 強度マッピング光学システムによる材料のレーザー切断 |
| JP6923284B2 (ja) | 2016-09-30 | 2021-08-18 | コーニング インコーポレイテッド | 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法 |
| LT3529214T (lt) | 2016-10-24 | 2021-02-25 | Corning Incorporated | Substrato apdorojimo stotis lakšto formos stiklo substratų lazeriniam mašininiam apdorojimui |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| KR102148013B1 (ko) * | 2018-07-24 | 2020-08-25 | (주) 큐알에스 | 레이어 분리장치 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3790362A (en) * | 1970-09-15 | 1974-02-05 | Ppg Industries Inc | Directional control for thermal severing of glass |
| RU2206525C2 (ru) * | 2001-07-25 | 2003-06-20 | Кондратенко Владимир Степанович | Способ резки хрупких неметаллических материалов |
| AT501000B1 (de) * | 2004-10-25 | 2006-10-15 | Lisec Maschb Gmbh | Verfahren und anordnung zum teilen von glas, insbesondere flachglas |
-
2007
- 2007-01-05 AT AT0002707A patent/AT504726A1/de not_active Application Discontinuation
- 2007-12-21 ES ES07845307T patent/ES2365068T3/es active Active
- 2007-12-21 PT PT07845307T patent/PT2118027E/pt unknown
- 2007-12-21 PL PL07845307T patent/PL2118027T3/pl unknown
- 2007-12-21 DK DK07845307.3T patent/DK2118027T3/da active
- 2007-12-21 DE DE502007006812T patent/DE502007006812D1/de active Active
- 2007-12-21 SI SI200730638T patent/SI2118027T1/sl unknown
- 2007-12-21 WO PCT/AT2007/000583 patent/WO2008080182A1/de not_active Ceased
- 2007-12-21 EP EP07845307A patent/EP2118027B1/de not_active Not-in-force
- 2007-12-21 AT AT07845307T patent/ATE502906T1/de active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2118027B1 (de) | 2011-03-23 |
| SI2118027T1 (sl) | 2011-08-31 |
| DK2118027T3 (da) | 2011-07-18 |
| AT504726A1 (de) | 2008-07-15 |
| ES2365068T3 (es) | 2011-09-21 |
| PT2118027E (pt) | 2011-07-05 |
| ATE502906T1 (de) | 2011-04-15 |
| WO2008080182A1 (de) | 2008-07-10 |
| EP2118027A1 (de) | 2009-11-18 |
| DE502007006812D1 (de) | 2011-05-05 |
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