PL2118027T3 - Sposób i urządzenie do wytwarzania szczeliny rozdzielczej w szybie szklanej - Google Patents
Sposób i urządzenie do wytwarzania szczeliny rozdzielczej w szybie szklanejInfo
- Publication number
- PL2118027T3 PL2118027T3 PL07845307T PL07845307T PL2118027T3 PL 2118027 T3 PL2118027 T3 PL 2118027T3 PL 07845307 T PL07845307 T PL 07845307T PL 07845307 T PL07845307 T PL 07845307T PL 2118027 T3 PL2118027 T3 PL 2118027T3
- Authority
- PL
- Poland
- Prior art keywords
- glass pane
- production
- dividing gap
- ray bundle
- dividing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Joining Of Glass To Other Materials (AREA)
- Laser Beam Processing (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT0002707A AT504726A1 (de) | 2007-01-05 | 2007-01-05 | Verfahren und vorrichtung zum herstellen eines trennspalts in einer glasscheibe |
EP07845307A EP2118027B1 (de) | 2007-01-05 | 2007-12-21 | Verfahren und vorrichtung zum herstellen eines trennspalts in einer glasscheibe |
PCT/AT2007/000583 WO2008080182A1 (de) | 2007-01-05 | 2007-12-21 | Verfahren und vorrichtung zum herstellen eines trennspalts in einer glasscheibe |
Publications (1)
Publication Number | Publication Date |
---|---|
PL2118027T3 true PL2118027T3 (pl) | 2011-09-30 |
Family
ID=39295905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL07845307T PL2118027T3 (pl) | 2007-01-05 | 2007-12-21 | Sposób i urządzenie do wytwarzania szczeliny rozdzielczej w szybie szklanej |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP2118027B1 (pl) |
AT (2) | AT504726A1 (pl) |
DE (1) | DE502007006812D1 (pl) |
DK (1) | DK2118027T3 (pl) |
ES (1) | ES2365068T3 (pl) |
PL (1) | PL2118027T3 (pl) |
PT (1) | PT2118027E (pl) |
SI (1) | SI2118027T1 (pl) |
WO (1) | WO2008080182A1 (pl) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT13206U1 (de) * | 2012-07-17 | 2013-08-15 | Lisec Maschb Gmbh | Verfahren und Anordnung zum Teilen von Flachglas |
WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
EP3166895B1 (en) | 2014-07-08 | 2021-11-24 | Corning Incorporated | Methods and apparatuses for laser processing materials |
KR20170028943A (ko) | 2014-07-14 | 2017-03-14 | 코닝 인코포레이티드 | 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템 |
WO2016010943A2 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for arresting crack propagation |
EP3169635B1 (en) | 2014-07-14 | 2022-11-23 | Corning Incorporated | Method and system for forming perforations |
JP6788571B2 (ja) * | 2014-07-14 | 2020-11-25 | コーニング インコーポレイテッド | 界面ブロック、そのような界面ブロックを使用する、ある波長範囲内で透過する基板を切断するためのシステムおよび方法 |
US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
WO2016115017A1 (en) | 2015-01-12 | 2016-07-21 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
EP3274306B1 (en) | 2015-03-24 | 2021-04-14 | Corning Incorporated | Laser cutting and processing of display glass compositions |
WO2016160391A1 (en) | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
MY194570A (en) | 2016-05-06 | 2022-12-02 | Corning Inc | Laser cutting and removal of contoured shapes from transparent substrates |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
JP7090594B2 (ja) | 2016-07-29 | 2022-06-24 | コーニング インコーポレイテッド | レーザ加工するための装置および方法 |
EP3507057A1 (en) | 2016-08-30 | 2019-07-10 | Corning Incorporated | Laser processing of transparent materials |
KR102078294B1 (ko) | 2016-09-30 | 2020-02-17 | 코닝 인코포레이티드 | 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법 |
WO2018081031A1 (en) | 2016-10-24 | 2018-05-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
KR102148013B1 (ko) * | 2018-07-24 | 2020-08-25 | (주) 큐알에스 | 레이어 분리장치 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3790362A (en) * | 1970-09-15 | 1974-02-05 | Ppg Industries Inc | Directional control for thermal severing of glass |
RU2206525C2 (ru) * | 2001-07-25 | 2003-06-20 | Кондратенко Владимир Степанович | Способ резки хрупких неметаллических материалов |
AT501000B1 (de) * | 2004-10-25 | 2006-10-15 | Lisec Maschb Gmbh | Verfahren und anordnung zum teilen von glas, insbesondere flachglas |
-
2007
- 2007-01-05 AT AT0002707A patent/AT504726A1/de not_active Application Discontinuation
- 2007-12-21 EP EP07845307A patent/EP2118027B1/de not_active Not-in-force
- 2007-12-21 WO PCT/AT2007/000583 patent/WO2008080182A1/de active Application Filing
- 2007-12-21 PT PT07845307T patent/PT2118027E/pt unknown
- 2007-12-21 AT AT07845307T patent/ATE502906T1/de active
- 2007-12-21 DE DE502007006812T patent/DE502007006812D1/de active Active
- 2007-12-21 SI SI200730638T patent/SI2118027T1/sl unknown
- 2007-12-21 DK DK07845307.3T patent/DK2118027T3/da active
- 2007-12-21 PL PL07845307T patent/PL2118027T3/pl unknown
- 2007-12-21 ES ES07845307T patent/ES2365068T3/es active Active
Also Published As
Publication number | Publication date |
---|---|
EP2118027A1 (de) | 2009-11-18 |
ES2365068T3 (es) | 2011-09-21 |
ATE502906T1 (de) | 2011-04-15 |
WO2008080182A1 (de) | 2008-07-10 |
AT504726A1 (de) | 2008-07-15 |
EP2118027B1 (de) | 2011-03-23 |
PT2118027E (pt) | 2011-07-05 |
SI2118027T1 (sl) | 2011-08-31 |
DE502007006812D1 (de) | 2011-05-05 |
DK2118027T3 (da) | 2011-07-18 |
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