PL1756330T3 - Sposób redukcji sproszkowanego tlenku metalu i przytwierdzenia go do powierzchni przenoszenia ciepła oraz powierzchnia przenoszenia ciepła - Google Patents
Sposób redukcji sproszkowanego tlenku metalu i przytwierdzenia go do powierzchni przenoszenia ciepła oraz powierzchnia przenoszenia ciepłaInfo
- Publication number
- PL1756330T3 PL1756330T3 PL05746324T PL05746324T PL1756330T3 PL 1756330 T3 PL1756330 T3 PL 1756330T3 PL 05746324 T PL05746324 T PL 05746324T PL 05746324 T PL05746324 T PL 05746324T PL 1756330 T3 PL1756330 T3 PL 1756330T3
- Authority
- PL
- Poland
- Prior art keywords
- heat transfer
- transfer surface
- copper
- oxide powder
- attaching
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000000843 powder Substances 0.000 title abstract 2
- 229910044991 metal oxide Inorganic materials 0.000 title 1
- 150000004706 metal oxides Chemical class 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 4
- 229910052802 copper Inorganic materials 0.000 abstract 4
- 239000010949 copper Substances 0.000 abstract 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract 2
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 2
- 238000005219 brazing Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000009776 industrial production Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/082—Coating starting from inorganic powder by application of heat or pressure and heat without intermediate formation of a liquid in the layer
- C23C24/085—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
- C23C24/087—Coating with metal alloys or metal elements only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0012—Brazing heat exchangers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
- C23C24/106—Coating with metal alloys or metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20040759A FI120050B (fi) | 2004-06-03 | 2004-06-03 | Menetelmä metallioksidipulverin pelkistämiseksi ja liittämiseksi lämmönsiirtopintaan ja lämmönsiirtopinta |
EP05746324A EP1756330B1 (en) | 2004-06-03 | 2005-06-01 | Method for reducing metal oxide powder and attaching it to a heat transfer surface and the heat transfer surface |
PCT/FI2005/000250 WO2005118913A1 (en) | 2004-06-03 | 2005-06-01 | Method for reducing metal oxide powder and attaching it to a heat transfer surface and the heat transfer surface |
Publications (1)
Publication Number | Publication Date |
---|---|
PL1756330T3 true PL1756330T3 (pl) | 2009-01-30 |
Family
ID=32524440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL05746324T PL1756330T3 (pl) | 2004-06-03 | 2005-06-01 | Sposób redukcji sproszkowanego tlenku metalu i przytwierdzenia go do powierzchni przenoszenia ciepła oraz powierzchnia przenoszenia ciepła |
Country Status (9)
Country | Link |
---|---|
US (1) | US20070251410A1 (pl) |
EP (1) | EP1756330B1 (pl) |
CN (1) | CN101027428A (pl) |
AT (1) | ATE404710T1 (pl) |
DE (1) | DE602005008959D1 (pl) |
FI (1) | FI120050B (pl) |
PL (1) | PL1756330T3 (pl) |
TW (1) | TW200602609A (pl) |
WO (1) | WO2005118913A1 (pl) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080290138A1 (en) * | 2007-05-22 | 2008-11-27 | David Myron Lineman | Method for bonding refractory ceramic and metal |
US20110230973A1 (en) * | 2007-10-10 | 2011-09-22 | Zimmer, Inc. | Method for bonding a tantalum structure to a cobalt-alloy substrate |
US20100263842A1 (en) * | 2009-04-17 | 2010-10-21 | General Electric Company | Heat exchanger with surface-treated substrate |
US20100294475A1 (en) * | 2009-05-22 | 2010-11-25 | General Electric Company | High performance heat transfer device, methods of manufacture thereof and articles comprising the same |
US20100294467A1 (en) * | 2009-05-22 | 2010-11-25 | General Electric Company | High performance heat transfer device, methods of manufacture thereof and articles comprising the same |
CN102168932B (zh) * | 2011-04-13 | 2013-01-30 | 西安工程大学 | 间接蒸发冷却器的制备方法 |
CN102653003B (zh) * | 2012-05-09 | 2015-01-21 | 安泰科技股份有限公司 | 一种在换热管管壁上形成金属多孔层的方法 |
US8544597B1 (en) * | 2012-05-31 | 2013-10-01 | Aerojet Rocketdyne Of De, Inc. | Tuned damper member |
DE102012212258A1 (de) * | 2012-07-13 | 2014-01-16 | Robert Bosch Gmbh | Kondensiervorrichtung und Verfahren zum Kondensieren von Feuchtigkeit in einer Fahrzeugbatterie |
WO2015105519A1 (en) * | 2014-01-07 | 2015-07-16 | Zalman Tech Co., Ltd. | Evaporating device having porous media and method for manufacturing thereof |
JP5889938B2 (ja) | 2014-03-06 | 2016-03-22 | 日本発條株式会社 | 積層体および積層体の製造方法 |
JP6011593B2 (ja) | 2014-10-22 | 2016-10-19 | 三菱マテリアル株式会社 | 銅多孔質焼結体の製造方法及び銅多孔質複合部材の製造方法 |
CN104630771B (zh) * | 2015-03-05 | 2017-06-23 | 西安宝德粉末冶金有限责任公司 | 一种在金属载体表面制备多孔氧化物薄膜的方法 |
JP6065059B2 (ja) | 2015-06-12 | 2017-01-25 | 三菱マテリアル株式会社 | 銅多孔質体、銅多孔質複合部材、銅多孔質体の製造方法、及び、銅多孔質複合部材の製造方法 |
JP6565710B2 (ja) * | 2016-01-27 | 2019-08-28 | 三菱マテリアル株式会社 | 銅部材接合体の製造方法 |
DE102016209082A1 (de) * | 2016-05-25 | 2017-11-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verdampfer- und/oder Kondensatorelement mit oberflächlich eingebetteten porösen Partikeln |
CN107168493A (zh) * | 2017-06-01 | 2017-09-15 | 曙光节能技术(北京)股份有限公司 | 一种cpu散热方法和装置 |
CN110004314A (zh) * | 2018-05-25 | 2019-07-12 | 中国科学院金属研究所 | 一种含三维多孔结构金属铜的制备方法 |
CN110160385B (zh) * | 2019-01-31 | 2021-04-27 | 江苏集萃先进金属材料研究所有限公司 | 一种传热组件内部低温烧结的毛细结构及其制造方法 |
CN112444152B (zh) * | 2019-09-03 | 2022-01-11 | 广州力及热管理科技有限公司 | 一种链状铜金属毛细结构及其制作方法 |
CN110670062B (zh) * | 2019-11-07 | 2021-04-02 | 哈尔滨工业大学 | 一种利用粉末热压制备超疏水表面的方法 |
TWI720823B (zh) * | 2020-02-26 | 2021-03-01 | 永源科技材料股份有限公司 | 毛細結構之製作方法 |
CN113896257B (zh) * | 2020-07-07 | 2023-11-17 | 苏州铜宝锐新材料有限公司 | 水处理过滤结构及其制作方法 |
US11794286B2 (en) * | 2020-08-20 | 2023-10-24 | Toyota Motor Engineering & Manufacturing North America, Inc. | Copper solder formulation |
CN112756608A (zh) * | 2020-12-14 | 2021-05-07 | 北京有研粉末新材料研究院有限公司 | 一种原位生成铜包铁热管吸液芯材料的制备方法 |
CN115229200B (zh) * | 2022-07-26 | 2024-04-09 | 西安培华学院 | 一种立方体状多孔银微米材料的制备方法 |
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US3475707A (en) * | 1966-12-21 | 1969-10-28 | Varian Associates | Porous intermediate layer for affixing lossy coatings to r.f. tube circuits |
BE757262A (fr) * | 1969-10-10 | 1971-04-08 | Union Carbide Corp | Couche metallique poreuse et procede pour la former |
US3832242A (en) * | 1970-07-23 | 1974-08-27 | Scm Corp | Brazing and solder compositions comprising a chelating agent |
US3989096A (en) * | 1972-12-18 | 1976-11-02 | Chrysler Corporation | Oxidation resistant brazing |
US3844027A (en) * | 1973-06-25 | 1974-10-29 | Chrysler Corp | Copper brazing of matrix structures |
US4064914A (en) * | 1974-05-08 | 1977-12-27 | Union Carbide Corporation | Porous metallic layer and formation |
US4156329A (en) * | 1977-05-13 | 1979-05-29 | General Electric Company | Method for fabricating a rotary drill bit and composite compact cutters therefor |
US4323390A (en) * | 1979-12-20 | 1982-04-06 | Southern Foundry Supply Company | Process for converting brass scrap to copper powder |
JPS61210186A (ja) * | 1985-03-15 | 1986-09-18 | Nippon Light Metal Co Ltd | 金属体表面に多孔質金属層を形成する方法 |
US5378294A (en) * | 1989-11-17 | 1995-01-03 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
JP2657008B2 (ja) * | 1991-06-26 | 1997-09-24 | 日本特殊陶業株式会社 | セラミックス用メタライズ組成物 |
CA2112441C (en) * | 1992-12-29 | 2005-08-09 | Tomiyoshi Kanai | Corrosion-resistant and brazeable aluminum material and a method of producing same |
US6164370A (en) * | 1993-07-16 | 2000-12-26 | Olin Corporation | Enhanced heat exchange tube |
CN1093251C (zh) * | 1993-12-27 | 2002-10-23 | 日立化成工业株式会社 | 传热构件及其制造方法 |
DE19747041A1 (de) * | 1997-10-24 | 1999-04-29 | Degussa | Flußmittelfreie Hartlotpaste |
US6530514B2 (en) * | 2001-06-28 | 2003-03-11 | Outokumpu Oyj | Method of manufacturing heat transfer tubes |
US9533379B2 (en) * | 2002-08-23 | 2017-01-03 | Lincoln Global, Inc. | Phosphorous-copper base brazing alloy |
JP4491713B2 (ja) * | 2004-04-26 | 2010-06-30 | 関東冶金工業株式会社 | 黄銅製の部品の銅ろう付け方法 |
JP2007205585A (ja) * | 2006-01-31 | 2007-08-16 | Denso Corp | 熱交換器の製造方法および熱交換器 |
-
2004
- 2004-06-03 FI FI20040759A patent/FI120050B/fi active IP Right Grant
-
2005
- 2005-05-26 TW TW094117207A patent/TW200602609A/zh unknown
- 2005-06-01 US US11/597,155 patent/US20070251410A1/en not_active Abandoned
- 2005-06-01 AT AT05746324T patent/ATE404710T1/de not_active IP Right Cessation
- 2005-06-01 CN CNA2005800176402A patent/CN101027428A/zh active Pending
- 2005-06-01 PL PL05746324T patent/PL1756330T3/pl unknown
- 2005-06-01 WO PCT/FI2005/000250 patent/WO2005118913A1/en active IP Right Grant
- 2005-06-01 EP EP05746324A patent/EP1756330B1/en not_active Not-in-force
- 2005-06-01 DE DE602005008959T patent/DE602005008959D1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FI20040759A0 (fi) | 2004-06-03 |
WO2005118913A1 (en) | 2005-12-15 |
DE602005008959D1 (de) | 2008-09-25 |
EP1756330A1 (en) | 2007-02-28 |
US20070251410A1 (en) | 2007-11-01 |
TW200602609A (en) | 2006-01-16 |
FI120050B (fi) | 2009-06-15 |
EP1756330B1 (en) | 2008-08-13 |
FI20040759A (fi) | 2005-12-04 |
ATE404710T1 (de) | 2008-08-15 |
CN101027428A (zh) | 2007-08-29 |
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