PH21883A - Metallization of ceramics - Google Patents

Metallization of ceramics

Info

Publication number
PH21883A
PH21883A PH30785A PH30785A PH21883A PH 21883 A PH21883 A PH 21883A PH 30785 A PH30785 A PH 30785A PH 30785 A PH30785 A PH 30785A PH 21883 A PH21883 A PH 21883A
Authority
PH
Philippines
Prior art keywords
metallization
ceramics
Prior art date
Application number
PH30785A
Other languages
English (en)
Inventor
Michael A Deluca
John F Mccormack
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of PH21883A publication Critical patent/PH21883A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G5/00Storing fluids in natural or artificial cavities or chambers in the earth
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/53After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
    • C04B41/5338Etching
    • C04B41/5361Etching with molten material
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/85Coating or impregnation with inorganic materials
    • C04B41/88Metals
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/89Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/91After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/122Organic non-polymeric compounds, e.g. oil, wax or thiol
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30Hydrogen technology
    • Y02E60/32Hydrogen storage

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
PH30785A 1983-06-09 1984-06-07 Metallization of ceramics PH21883A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50274883A 1983-06-09 1983-06-09
US06/607,874 US4604299A (en) 1983-06-09 1984-05-10 Metallization of ceramics

Publications (1)

Publication Number Publication Date
PH21883A true PH21883A (en) 1988-03-25

Family

ID=27054267

Family Applications (1)

Application Number Title Priority Date Filing Date
PH30785A PH21883A (en) 1983-06-09 1984-06-07 Metallization of ceramics

Country Status (12)

Country Link
US (1) US4604299A (de)
EP (1) EP0128476B1 (de)
KR (1) KR870001779B1 (de)
AU (1) AU570690B2 (de)
BR (1) BR8402803A (de)
CA (1) CA1217686A (de)
DE (2) DE3476871D1 (de)
DK (1) DK282584A (de)
ES (1) ES8507311A1 (de)
GB (1) GB2141741B (de)
IN (1) IN165152B (de)
PH (1) PH21883A (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
EP0185967A3 (de) * 1984-12-10 1988-08-03 Kollmorgen Corporation Verfahren zur Vermeidung der Blasenbildung bei der elektrolosen Metallisierung keramischer Substrate
US4871108A (en) * 1985-01-17 1989-10-03 Stemcor Corporation Silicon carbide-to-metal joint and method of making same
US4696851A (en) * 1985-03-25 1987-09-29 Olin Corporation Hybrid and multi-layer circuitry
DE3523960A1 (de) * 1985-07-04 1987-01-08 Licentia Gmbh Verfahren zur metallisierung eines elektrisch schlecht leitenden substrates aus einem anorganischen material
DE3523958A1 (de) * 1985-07-04 1987-01-08 Licentia Gmbh Verfahren zur chemischen behandlung von keramikkoerpern mit nachfolgender metallisierung
DE3523957A1 (de) * 1985-07-04 1987-01-08 Licentia Gmbh Verfahren zur metallisierung von keramik
DE3523956A1 (de) * 1985-07-04 1987-01-08 Licentia Gmbh Verfahren zur chemischen metallisierung eines elektrisch schlecht leitenden traegerkoerpers aus einem anorganischen material
DE3523961A1 (de) * 1985-07-04 1987-01-15 Licentia Gmbh Vorrichtung zum behandeln mindestens eines keramikgegenstandes in einer alkalihydroxidschmelze
DE3672441D1 (de) * 1985-10-15 1990-08-09 Nec Corp Metallisiertes keramiksubstrat und herstellungsverfahren.
DE3601834A1 (de) * 1986-01-20 1987-07-23 Schering Ag Verfahren zur haftfesten metallisierung von keramischen materialien
US5058799A (en) * 1986-07-24 1991-10-22 Zsamboky Kalman F Metallized ceramic substrate and method therefor
US4778825A (en) * 1986-08-29 1988-10-18 The University Of Akron Macrophage stimulation by quadrol
DE3744747C3 (de) * 1986-11-08 1997-07-17 Matsushita Electric Works Ltd Verfahren zur Herstellung einer keramischen Leiterplatte sowie Anwendung des Verfahrens
JPH0653253B2 (ja) * 1986-11-08 1994-07-20 松下電工株式会社 セラミツク基板の粗化法
US5389496A (en) * 1987-03-06 1995-02-14 Rohm And Haas Company Processes and compositions for electroless metallization
US5244849A (en) * 1987-05-06 1993-09-14 Coors Porcelain Company Method for producing transparent polycrystalline body with high ultraviolet transmittance
US4930731A (en) * 1987-05-06 1990-06-05 Coors Porcelain Company Dome and window for missiles and launch tubes with high ultraviolet transmittance
US4983555A (en) * 1987-05-06 1991-01-08 Coors Porcelain Company Application of transparent polycrystalline body with high ultraviolet transmittance
JPH0686666B2 (ja) * 1988-01-12 1994-11-02 清 岡林 化学メッキ用増感活性剤
US5082739A (en) * 1988-04-22 1992-01-21 Coors Porcelain Company Metallized spinel with high transmittance and process for producing
DE3813946A1 (de) * 1988-04-26 1989-11-09 Asea Brown Boveri Verfahren zum aufbringen einer aus edelmetallen und/oder edelmetallverbindungen bestehenden katalysatorschicht auf einen traeger aus keramischem material
DE3827893A1 (de) * 1988-08-17 1990-03-01 Hoechst Ceram Tec Ag Verfahren zur stromlosen abscheidung von nickel
DE3833441A1 (de) * 1988-10-01 1990-04-05 Hoechst Ag Verfahren zum metallisieren von aluminiumoxid-substraten
JP2637804B2 (ja) * 1988-12-20 1997-08-06 日本碍子株式会社 メッキ付き基材
US5342501A (en) * 1989-11-21 1994-08-30 Eric F. Harnden Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating
US5071517A (en) * 1989-11-21 1991-12-10 Solution Technology Systems Method for directly electroplating a dielectric substrate and plated substrate so produced
DE4113263A1 (de) * 1991-04-23 1992-10-29 Siemens Ag Verfahren zur ganzflaechigen, stromlosen beschichtung von kleinen formteilen aus keramischem material
US5262042A (en) * 1991-12-12 1993-11-16 Eric F. Harnden Simplified method for direct electroplating of dielectric substrates
US5268088A (en) * 1991-12-12 1993-12-07 Eric F. Harnden Simplified method for direct electroplating of acrylic or epoxy containing dielectric substrates
US5167913A (en) * 1991-12-23 1992-12-01 International Business Machines Corporation Method of forming an adherent layer of metallurgy on a ceramic substrate
DE4342258A1 (de) * 1993-12-10 1995-06-14 Resma Gmbh Verfahren zur Erzeugung elektrisch leitender Bereiche an keramischen Werkstücken
US5683758A (en) * 1995-12-18 1997-11-04 Lucent Technologies Inc. Method of forming vias
US6316097B1 (en) 1998-09-28 2001-11-13 Seagate Technology Llc Electroless plating process for alternative memory disk substrates
US6685990B1 (en) 1999-04-20 2004-02-03 Seagate Technology Llc Nodule-free electroless nip plating
KR100356112B1 (ko) * 2000-03-23 2002-10-25 (주) 씨엠테크 브레이징 접합 도금층을 가진 세라믹체
JP2001130986A (ja) * 2000-04-27 2001-05-15 Yamatoya & Co Ltd 銅メッキセラミックス基板、及びそれを用いたペルチィエ素子、並びに銅メッキセラミックス基板の製造方法
KR100499134B1 (ko) * 2002-10-28 2005-07-04 삼성전자주식회사 압축 접합 방법
JP2005060822A (ja) * 2003-08-08 2005-03-10 Rohm & Haas Electronic Materials Llc 複合基体の電気メッキ
GB2417127A (en) * 2004-08-12 2006-02-15 Vetco Gray Controls Ltd Surface metallization of contact pads
JP4559936B2 (ja) * 2004-10-21 2010-10-13 アルプス電気株式会社 無電解めっき方法およびこの方法を用いた回路形成方法
JP2009041097A (ja) * 2007-08-10 2009-02-26 Rohm & Haas Electronic Materials Llc 銅めっき方法
KR101508793B1 (ko) * 2009-02-25 2015-04-06 한라비스테온공조 주식회사 열전소자 모듈을 이용한 열교환기의 제조방법
EP2657990B1 (de) * 2010-12-20 2016-03-23 Ocean's King Lighting Science & Technology Co., Ltd. Lichtemittierende vorrichtung und herstellungsverfahren dafür
US9161444B2 (en) * 2011-10-28 2015-10-13 Kyocera Corporation Circuit board and electronic apparatus provided with the same
US9885124B2 (en) * 2011-11-23 2018-02-06 University Of South Carolina Method of growing high quality, thick SiC epitaxial films by eliminating silicon gas phase nucleation and suppressing parasitic deposition
US9644288B2 (en) 2011-11-23 2017-05-09 University Of South Carolina Pretreatment method for reduction and/or elimination of basal plane dislocations close to epilayer/substrate interface in growth of SiC epitaxial films
US9568496B1 (en) 2015-11-17 2017-02-14 International Business Machines Corporation Scanning probe sensor with a ferromagnetic fluid
US11084761B2 (en) 2018-09-14 2021-08-10 Honeywell International Inc. Method of pressure sintering an environmental barrier coating on a surface of a ceramic substrate
US11827574B2 (en) 2018-09-14 2023-11-28 Honeywell International Inc. Method of pressure sintering an environmental barrier coating on a surface of a ceramic substrate
KR102201500B1 (ko) * 2018-12-13 2021-01-13 주식회사 케이씨씨 세라믹 하우징 및 세라믹 기재의 도금 방법

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3309760A (en) * 1964-11-03 1967-03-21 Bendix Corp Attaching leads to semiconductors
US3296012A (en) * 1965-04-30 1967-01-03 Corning Glass Works Electroless copper plating on ceramic material
GB1159844A (en) * 1967-06-02 1969-07-30 Nii Phiziki Poluprovodnikovykh Method of Metallizing Non-metallic Articles, predominantly with Nickel
SE332214B (de) * 1968-07-12 1971-02-01 Gylling & Co
US3672986A (en) * 1969-12-19 1972-06-27 Day Co Nv Metallization of insulating substrates
US3628999A (en) * 1970-03-05 1971-12-21 Frederick W Schneble Jr Plated through hole printed circuit boards
US3690921A (en) * 1970-12-07 1972-09-12 Ibm Method for strongly adhering a metal film on ceramic substrates
US3772056A (en) * 1971-07-29 1973-11-13 Kollmorgen Photocircuits Sensitized substrates for chemical metallization
US3772078A (en) * 1971-07-29 1973-11-13 Kollmorgen Photocircuits Process for the formation of real images and products produced thereby
US3907621A (en) * 1971-07-29 1975-09-23 Photocircuits Corp Method of sensitizing substrates for chemical metallization
US3993802A (en) * 1971-07-29 1976-11-23 Photocircuits Division Of Kollmorgen Corporation Processes and products for making articles for electroless plating
US3994727A (en) * 1971-07-29 1976-11-30 Photocircuits Divison Of Kollmorgen Corporation Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents
US3959547A (en) * 1971-07-29 1976-05-25 Photocircuits Division Of Kollmorgen Corporation Process for the formation of real images and products produced thereby
US3925578A (en) * 1971-07-29 1975-12-09 Kollmorgen Photocircuits Sensitized substrates for chemical metallization
US3930963A (en) * 1971-07-29 1976-01-06 Photocircuits Division Of Kollmorgen Corporation Method for the production of radiant energy imaged printed circuit boards
US3766634A (en) * 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
US3744120A (en) * 1972-04-20 1973-07-10 Gen Electric Direct bonding of metals with a metal-gas eutectic
JPS49128917A (de) * 1973-04-11 1974-12-10
US4187193A (en) * 1974-09-24 1980-02-05 Champion International Corporation Micro-capsules containing ureido fluoran chromogenic compounds
JPS5147536A (en) * 1974-10-22 1976-04-23 Toko Inc Mukizaishitsuni mudenkaimetsukio hodokosuhoho
DE2453192C3 (de) * 1974-11-09 1978-09-14 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Verbesserung der Haftfestigkeit von Metallschichten auf elektrisch nicht leitenden Trägerkörpern
GB1519333A (en) * 1975-07-16 1978-07-26 Kollmorgen Corp Processes for production of metal layers and products produced thereby
DE2533524C3 (de) * 1975-07-26 1978-05-18 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Herstellung eines Belages aus Kupfer oder einer Kupferlegierung auf einem Trägerkörper
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
JPS5319932A (en) * 1976-08-09 1978-02-23 Nakamura Minoru Preetreatment method of nonnelectrolytic plating on glass
DE2733684A1 (de) * 1977-07-26 1979-02-08 Siemens Ag Verfahren zum aufbringen einer metallschicht auf einen keramikkoerper aus blei enthaltendem material
US4206254A (en) * 1979-02-28 1980-06-03 International Business Machines Corporation Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern
DE3032508A1 (de) * 1980-08-28 1982-04-01 Siemens AG, 1000 Berlin und 8000 München Verfahren der vorbehandlung von zirkonium und zirkonium-legierungen, insbesondere zircaloy, fuer die stromlose oder galvanische metallisierung
US4428986A (en) * 1982-11-18 1984-01-31 Eaton Corporation Method of preparing a beryllia substrate for subsequent autocatalytic deposition of a metallized film directly thereon

Also Published As

Publication number Publication date
KR850000025A (ko) 1985-02-25
GB2141741A (en) 1985-01-03
KR870001779B1 (ko) 1987-10-10
AU2922084A (en) 1984-12-13
BR8402803A (pt) 1985-05-21
IN165152B (de) 1989-08-19
EP0128476A3 (en) 1987-03-25
AU570690B2 (en) 1988-03-24
CA1217686A (en) 1987-02-10
EP0128476B1 (de) 1989-03-01
DE3476871D1 (en) 1989-04-06
ES533259A0 (es) 1985-09-01
DE3421989A1 (de) 1984-12-13
GB2141741B (en) 1987-04-01
GB8414304D0 (en) 1984-07-11
DE3421989C2 (de) 1988-11-17
DK282584A (da) 1984-12-10
US4604299A (en) 1986-08-05
EP0128476A2 (de) 1984-12-19
DK282584D0 (da) 1984-06-08
ES8507311A1 (es) 1985-09-01

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