PH21722A - Solderable conductive compositions having high adhesive strength - Google Patents

Solderable conductive compositions having high adhesive strength

Info

Publication number
PH21722A
PH21722A PH32475A PH32475A PH21722A PH 21722 A PH21722 A PH 21722A PH 32475 A PH32475 A PH 32475A PH 32475 A PH32475 A PH 32475A PH 21722 A PH21722 A PH 21722A
Authority
PH
Philippines
Prior art keywords
conductive compositions
resin
adhesive strength
high adhesive
solderable conductive
Prior art date
Application number
PH32475A
Other languages
English (en)
Inventor
Frank St John
Samson Shahbazi
Original Assignee
Electro Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Materials filed Critical Electro Materials
Publication of PH21722A publication Critical patent/PH21722A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mechanical Engineering (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
PH32475A 1984-07-18 1985-07-02 Solderable conductive compositions having high adhesive strength PH21722A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/631,974 US4595606A (en) 1984-07-18 1984-07-18 Solderable conductive compositions having high adhesive strength

Publications (1)

Publication Number Publication Date
PH21722A true PH21722A (en) 1988-02-03

Family

ID=24533555

Family Applications (1)

Application Number Title Priority Date Filing Date
PH32475A PH21722A (en) 1984-07-18 1985-07-02 Solderable conductive compositions having high adhesive strength

Country Status (9)

Country Link
US (1) US4595606A (de)
EP (1) EP0169060B1 (de)
JP (1) JPS6140316A (de)
KR (1) KR860000921A (de)
AT (1) ATE36919T1 (de)
CA (1) CA1246767A (de)
DE (1) DE3564743D1 (de)
PH (1) PH21722A (de)
SG (1) SG86788G (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680141A (en) * 1984-11-29 1987-07-14 Mcdonnell Douglas Corporation Solder composition
US4673532A (en) * 1986-01-22 1987-06-16 Mcdonnell Douglas Corporation Rosin-free solder composition
AU8107987A (en) * 1986-09-30 1988-04-21 Wilde Membran Impulstechnik G.m.b.H. Electrically conductive structure with applied metallization
DE3724013A1 (de) * 1987-07-21 1989-02-02 Flachglas Ag Verfahren zum aufbringen einer farbigen beschichtung auf eine oberflaeche einer glasscheibe
US5147453A (en) * 1987-11-03 1992-09-15 Basf Corporation Paint compositions containing silver metal flake pigment
US4896250A (en) * 1988-02-12 1990-01-23 Emerson & Cuming, Inc. Solvent-processible electrically conductive coatings
US5006575A (en) * 1989-10-20 1991-04-09 E. I. Du Pont De Nemours And Company Die attach adhesive composition
US5183593A (en) * 1989-11-14 1993-02-02 Poly-Flex Circuits, Inc. Electrically conductive cement
US5180523A (en) * 1989-11-14 1993-01-19 Poly-Flex Circuits, Inc. Electrically conductive cement containing agglomerate, flake and powder metal fillers
US5089173A (en) * 1990-05-02 1992-02-18 Advanced Products Inc. Highly conductive polymer thick film compositions
US5112687A (en) * 1990-05-02 1992-05-12 Advanced Products Inc. Highly conductive polymer thick film compositions
JPH0412595A (ja) * 1990-05-02 1992-01-17 Mitsubishi Petrochem Co Ltd 導電性ペースト組成物
US5141777A (en) * 1990-05-02 1992-08-25 Advanced Products, Inc. Highly conductive polymer thick film compositions
US5136365A (en) * 1990-09-27 1992-08-04 Motorola, Inc. Anisotropic conductive adhesive and encapsulant material
JPH07123179B2 (ja) * 1990-10-05 1995-12-25 信越ポリマー株式会社 異方導電接着剤による回路基板の接続構造
JPH04345664A (ja) * 1991-05-01 1992-12-01 Du Pont Japan Ltd 導電性樹脂組成物
DE69221480T2 (de) * 1991-05-01 1998-01-22 Du Pont Elektrisch leitende Polymermischungen
US5283007A (en) * 1992-04-28 1994-02-01 E. I. Du Pont De Nemours And Company Conductive polymer compositions
JPH0521208A (ja) * 1991-05-07 1993-01-29 Daito Tsushinki Kk Ｐｔｃ素子
JPH0826251B2 (ja) * 1991-06-05 1996-03-13 福田金属箔粉工業株式会社 焼付型導電塗料用銀粉及びそれを用いた焼付型導電塗料
JP2730357B2 (ja) * 1991-11-18 1998-03-25 松下電器産業株式会社 電子部品実装接続体およびその製造方法
US5447267A (en) * 1993-02-08 1995-09-05 Matsushita Electric Industrial Co., Ltd. Method of soldering electronic part using a bond for tacking the electronic part
US5780143A (en) * 1995-03-01 1998-07-14 Tokuyama Corporation Circuit board
JPH09116273A (ja) * 1995-08-11 1997-05-02 Shinko Electric Ind Co Ltd 多層回路基板及びその製造方法
JPH0959553A (ja) * 1995-08-30 1997-03-04 Dainippon Printing Co Ltd 透明導電性インキ
AU5561696A (en) * 1996-04-18 1997-11-07 International Business Machines Corporation Organic-metallic composite coating for copper surface protection
KR100629923B1 (ko) * 1998-09-30 2006-09-29 돗빤호무즈가부시기가이샤 도전성페이스트와 도전성페이스트의 경화방법, 및 도전성페이스트를 이용한 비접촉형 데이터송수신체용 안테나의 형성방법과, 비접촉형 데이터송수신체
US6750301B1 (en) * 2000-07-07 2004-06-15 National Starch And Chemical Investment Holding Corporation Die attach adhesives with epoxy compound or resin having allyl or vinyl groups
JP2005234464A (ja) * 2004-02-23 2005-09-02 Tdk Corp 光トランシーバ及びこれに用いる光モジュール
KR20120056885A (ko) * 2009-09-24 2012-06-04 이 아이 듀폰 디 네모아 앤드 캄파니 도금 링크로서 사용하기 위한 중합체 후막 은 전극 조성물
US20120119163A1 (en) * 2010-11-17 2012-05-17 E. I. Du Pont De Nemours And Company Solderable polymer thick film silver electrode composition for use in thin-film photovoltaic cells and other applications
US8704087B2 (en) 2011-06-01 2014-04-22 E I Du Pont De Nemours And Company Solderable polymer thick film conductive electrode composition for use in thin-film photovoltaic cells and other applications
JP6233792B2 (ja) * 2013-01-28 2017-11-22 国立大学法人群馬大学 導電性ペースト
EP2918371A1 (de) * 2014-03-11 2015-09-16 Heraeus Precious Metals North America Conshohocken LLC Lötbare leitfähige Polymer-Dickschichtzusammensetzung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3412043A (en) * 1966-08-05 1968-11-19 Dexter Corp Electrically conductive resinous compositions
GB1251834A (de) * 1968-04-02 1971-11-03
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
US4371459A (en) * 1981-12-17 1983-02-01 E. I. Du Pont De Nemours And Company Flexible screen-printable conductor composition
US4564563A (en) * 1983-09-30 1986-01-14 Electro Materials Corp. Of America Solderable conductor
US4535012A (en) * 1983-09-30 1985-08-13 Electro Materials Corp. Of America Fast curing solderable conductor

Also Published As

Publication number Publication date
ATE36919T1 (de) 1988-09-15
DE3564743D1 (en) 1988-10-06
SG86788G (en) 1989-06-16
EP0169060A2 (de) 1986-01-22
EP0169060A3 (en) 1986-08-27
CA1246767A (en) 1988-12-13
EP0169060B1 (de) 1988-08-31
JPS6140316A (ja) 1986-02-26
KR860000921A (ko) 1986-02-20
US4595606A (en) 1986-06-17

Similar Documents

Publication Publication Date Title
PH21722A (en) Solderable conductive compositions having high adhesive strength
DE3564742D1 (en) Flexible, directly solderable conductive compositions, compositions useful in forming them, and their use as coatings on substrates
GB8517942D0 (en) Bonding metals to resin coatings
EP0291260A3 (en) Aqueous epoxy resin compositions and metal substrates coated therewith
DE3571772D1 (en) Improvements in or relating to the covering of substrates with synthetic resin films
AU7293681A (en) Structures comprising an element of polyethylene bonded to a surface of a metal substrate, and making such structures
AU575017B2 (en) Modified epoxy resins and coating compositions containing them
AU564748B2 (en) Phosphated epoxy and acrylic resin coating composition
AU569456B2 (en) Epoxy resin composition
DE3564952D1 (en) Novel (meth)acrylate and resin composition comprising the same
ES8308653A1 (es) "procedimiento para la fabricacion de piezas de contacto electricas".
DE3062969D1 (en) Precondensed heat-curable aqueous varnish-coating composition and application thereof to the cathodic electrodeposition on electro-conductive substrates
JPS56167722A (en) Manufacture of water-dilutable resin, resin manufactured thereby and use to thermosetting surface coating
EP0188901A3 (en) Adhesive resin composition
AU567882B2 (en) Advanced epoxy resins and coating compositions containing the advanced epoxy resins.
EP0167308A3 (de) Flüssige copolymere Organosiloxane
EP0251490A3 (de) Metall-Polymer-Verbindung
JPS5269936A (en) Thermosetting powder coating composition
IE850184L (en) Circuit boards made of laminates
EP0089811A3 (de) Modifizierte ungesättigte Polyesterharze
AU568304B2 (en) Epoxy ester resins and coating composition
AU5081785A (en) Adhesive compositions based on phenolic resins
AU2637184A (en) Epoxy resin adhesive composition
DE3480405D1 (en) Thermosetting coating composition useful as chip resistant primer
DE3378473D1 (en) Epoxy ester resin and novel thermosetting coating composition comprising same