PH12021050082A1 - An apparatus for semiconductor dies bonding and method thereof - Google Patents

An apparatus for semiconductor dies bonding and method thereof

Info

Publication number
PH12021050082A1
PH12021050082A1 PH12021050082A PH12021050082A PH12021050082A1 PH 12021050082 A1 PH12021050082 A1 PH 12021050082A1 PH 12021050082 A PH12021050082 A PH 12021050082A PH 12021050082 A PH12021050082 A PH 12021050082A PH 12021050082 A1 PH12021050082 A1 PH 12021050082A1
Authority
PH
Philippines
Prior art keywords
semiconductor dies
bonding
indexer
axis direction
dies bonding
Prior art date
Application number
PH12021050082A
Inventor
CHUAN Teh BAN
Original Assignee
Ml Equipment M Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ml Equipment M Sdn Bhd filed Critical Ml Equipment M Sdn Bhd
Publication of PH12021050082A1 publication Critical patent/PH12021050082A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads

Abstract

The present invention relates to an apparatus (1) and method (2) for semiconductor dies bonding, particularly in rotary turret-based semiconductor dies bonding which is capable of increasing the production throughputs and reduce the idling time of the bonding process as compared with the conventional bonding process by virtue of at least one first indexer (109) and at least one second indexer (111) being operative to move sequentially and repetitively in an X-axis direction and a Y-axis direction along a single-track feeding system.
PH12021050082A 2020-05-20 2021-03-03 An apparatus for semiconductor dies bonding and method thereof PH12021050082A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2020002449 2020-05-20

Publications (1)

Publication Number Publication Date
PH12021050082A1 true PH12021050082A1 (en) 2021-11-22

Family

ID=78698112

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12021050082A PH12021050082A1 (en) 2020-05-20 2021-03-03 An apparatus for semiconductor dies bonding and method thereof

Country Status (3)

Country Link
KR (1) KR102518344B1 (en)
PH (1) PH12021050082A1 (en)
TW (2) TWM626077U (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090005114U (en) * 2007-11-23 2009-05-27 세크론 주식회사 Transfer apparatus for semiconductor device die bonder
US7851721B2 (en) * 2009-02-17 2010-12-14 Asm Assembly Automation Ltd Electronic device sorter comprising dual buffers
KR101111952B1 (en) * 2009-09-23 2012-02-14 (주)제이티 Die bonder for LED device
SG170645A1 (en) * 2009-11-02 2011-05-30 Semiconductor Tech & Instr Inc System and method for flexible high speed transfer of semiconductor components
KR101086303B1 (en) * 2009-12-04 2011-11-23 주식회사 탑 엔지니어링 LED Chip bonding apparatus
SG173943A1 (en) * 2010-03-04 2011-09-29 Ah Yoong Sim Rotary die bonding apparatus and methodology thereof
JP5815345B2 (en) * 2011-09-16 2015-11-17 ファスフォードテクノロジ株式会社 Die bonder and bonding method

Also Published As

Publication number Publication date
TWM626077U (en) 2022-04-21
TW202145409A (en) 2021-12-01
KR20210143647A (en) 2021-11-29
TWI765578B (en) 2022-05-21
KR102518344B1 (en) 2023-04-04

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