PH12017500592A1 - Copper film-forming composition and method for manufacturing copper film in which said composition is used - Google Patents

Copper film-forming composition and method for manufacturing copper film in which said composition is used

Info

Publication number
PH12017500592A1
PH12017500592A1 PH12017500592A PH12017500592A PH12017500592A1 PH 12017500592 A1 PH12017500592 A1 PH 12017500592A1 PH 12017500592 A PH12017500592 A PH 12017500592A PH 12017500592 A PH12017500592 A PH 12017500592A PH 12017500592 A1 PH12017500592 A1 PH 12017500592A1
Authority
PH
Philippines
Prior art keywords
copper film
composition
forming composition
general formula
manufacturing
Prior art date
Application number
PH12017500592A
Other versions
PH12017500592B1 (en
Inventor
Tetsuji Abe
Kazuya Saito
Yasuhisa Furihata
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of PH12017500592A1 publication Critical patent/PH12017500592A1/en
Publication of PH12017500592B1 publication Critical patent/PH12017500592B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material

Abstract

The present invention provides a copper film-forming composition in the form of a solution that does not contain a solid phase such as microparticles, said composition making it possible to obtain a copper film having sufficient electroconductivity by being applied onto a substrate and heated at less than 160oC. The copper film-forming composition contains 0.1-3.0 mol/kg of copper formate or a hydrate thereof, at least one compound selected from the group consisting of compounds represented by general formula (1) and compounds represented by general formula (1'), and a piperidine compound represented by general formula (2).
PH12017500592A 2014-10-03 2017-03-30 Copper film-forming composition and method for manufacturing copper film in which said composition is used PH12017500592B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014204419A JP6387280B2 (en) 2014-10-03 2014-10-03 Composition for forming copper film and method for producing copper film using the same
PCT/JP2015/076062 WO2016052162A1 (en) 2014-10-03 2015-09-14 Copper film-forming composition and method for manufacturing copper film in which said composition is used

Publications (2)

Publication Number Publication Date
PH12017500592A1 true PH12017500592A1 (en) 2017-08-30
PH12017500592B1 PH12017500592B1 (en) 2017-08-30

Family

ID=55630204

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12017500592A PH12017500592B1 (en) 2014-10-03 2017-03-30 Copper film-forming composition and method for manufacturing copper film in which said composition is used

Country Status (6)

Country Link
JP (1) JP6387280B2 (en)
KR (1) KR20170057443A (en)
CN (1) CN107075681B (en)
PH (1) PH12017500592B1 (en)
TW (1) TWI656239B (en)
WO (1) WO2016052162A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6815219B2 (en) * 2017-02-13 2021-01-20 株式会社Adeka Composition for forming a nickel film and a method for producing a nickel film

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004162110A (en) * 2002-11-12 2004-06-10 Mitsubishi Paper Mills Ltd Copper/amine composition
JP2004277868A (en) * 2003-03-19 2004-10-07 Mitsubishi Paper Mills Ltd Preparation method of conductive composition
JP2011034750A (en) * 2009-07-31 2011-02-17 Tosoh Corp Composition for conductive film formation and conductive film formation method
JP5620795B2 (en) * 2010-11-26 2014-11-05 株式会社Adeka Composition for forming copper film and method for producing copper film using the composition
JP5923351B2 (en) * 2012-03-16 2016-05-24 株式会社Adeka Composition for forming copper film and method for producing copper film using the composition
JP6156991B2 (en) * 2013-07-25 2017-07-05 株式会社Adeka Composition for forming copper film and method for producing copper film using the same
JP6254025B2 (en) * 2014-03-12 2017-12-27 株式会社Adeka Composition for forming copper film and method for producing copper film using the same

Also Published As

Publication number Publication date
JP6387280B2 (en) 2018-09-05
WO2016052162A1 (en) 2016-04-07
TWI656239B (en) 2019-04-11
JP2016074925A (en) 2016-05-12
CN107075681A (en) 2017-08-18
CN107075681B (en) 2019-04-23
KR20170057443A (en) 2017-05-24
TW201619438A (en) 2016-06-01
PH12017500592B1 (en) 2017-08-30

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