PH12015502208A1 - Protective film-forming film and protective film-forming composite sheet - Google Patents

Protective film-forming film and protective film-forming composite sheet

Info

Publication number
PH12015502208A1
PH12015502208A1 PH12015502208A PH12015502208A PH12015502208A1 PH 12015502208 A1 PH12015502208 A1 PH 12015502208A1 PH 12015502208 A PH12015502208 A PH 12015502208A PH 12015502208 A PH12015502208 A PH 12015502208A PH 12015502208 A1 PH12015502208 A1 PH 12015502208A1
Authority
PH
Philippines
Prior art keywords
protective film
forming
film
composite sheet
protective
Prior art date
Application number
PH12015502208A
Other versions
PH12015502208B1 (en
Inventor
Saiki Naoya
Yamamoto Daisuke
Takano Ken
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12015502208B1 publication Critical patent/PH12015502208B1/en
Publication of PH12015502208A1 publication Critical patent/PH12015502208A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C08J2333/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2463/02—Polyglycidyl ethers of bis-phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2463/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2463/10—Epoxy resins modified by unsaturated compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

[Problem] To provide a protective film-forming film that minimizes warping of a wafer, and is capable of forming a highly-reliable protective film on a chip. [Solution] This protective film-forming film is thermally curable, has a glass transition temperature after being thermally cured of 150 to 300oC, and has a modulus of elasticity at a temperature of 23oC after being thermally cured of 0.5 to 10 GPa.
PH12015502208A 2013-03-22 2015-09-22 Protective film-forming film and protective film-forming composite sheet PH12015502208A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013059951 2013-03-22
PCT/JP2014/058038 WO2014148642A1 (en) 2013-03-22 2014-03-24 Protective film-forming film and protective film-forming composite sheet

Publications (2)

Publication Number Publication Date
PH12015502208B1 PH12015502208B1 (en) 2016-02-01
PH12015502208A1 true PH12015502208A1 (en) 2016-02-01

Family

ID=51580310

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015502208A PH12015502208A1 (en) 2013-03-22 2015-09-22 Protective film-forming film and protective film-forming composite sheet

Country Status (7)

Country Link
JP (1) JP5615471B1 (en)
KR (4) KR102541666B1 (en)
CN (1) CN104937712B (en)
PH (1) PH12015502208A1 (en)
SG (1) SG11201507775XA (en)
TW (1) TWI516530B (en)
WO (1) WO2014148642A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
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WO2016143192A1 (en) * 2015-03-12 2016-09-15 リンテック株式会社 Film for forming protection film
JP6454580B2 (en) * 2015-03-30 2019-01-16 デクセリアルズ株式会社 Thermosetting adhesive sheet and method for manufacturing semiconductor device
JP6517588B2 (en) * 2015-05-27 2019-05-22 デクセリアルズ株式会社 Thermosetting adhesive sheet and method of manufacturing semiconductor device
JP2017011134A (en) * 2015-06-23 2017-01-12 株式会社ディスコ Method for manufacturing device chip
JP6660156B2 (en) * 2015-11-13 2020-03-04 日東電工株式会社 Manufacturing method of laminated body and combined body / semiconductor device
KR102456771B1 (en) * 2016-04-28 2022-10-20 린텍 가부시키가이샤 A film for forming a protective film and a composite sheet for forming a protective film
CN109071845A (en) * 2016-04-28 2018-12-21 琳得科株式会社 Protective film formation film and protective film formation composite sheet
JP6863375B2 (en) * 2016-05-20 2021-04-21 昭和電工マテリアルズ株式会社 Release film
JP6921644B2 (en) * 2017-06-27 2021-08-18 日東電工株式会社 Backside protective film with integrated dicing tape
JP6950330B2 (en) * 2017-07-28 2021-10-13 東レ株式会社 Laminated body and resin film
TW201930511A (en) * 2017-12-28 2019-08-01 日商日東電工股份有限公司 Semiconductor back surface adhering film
JP2020101708A (en) * 2018-12-21 2020-07-02 日東電工株式会社 Semiconductor reverse surface adhesive film
JP2020102553A (en) * 2018-12-21 2020-07-02 日東電工株式会社 Semiconductor backside adhesion film
JP7211804B2 (en) * 2018-12-21 2023-01-24 日東電工株式会社 Semiconductor back adhesion film
WO2019131850A1 (en) * 2017-12-28 2019-07-04 日東電工株式会社 Semiconductor back surface adhering film
JP7169093B2 (en) * 2017-12-28 2022-11-10 日東電工株式会社 Semiconductor back adhesion film
JP7211803B2 (en) * 2018-12-21 2023-01-24 日東電工株式会社 Semiconductor back adhesion film
JPWO2019208402A1 (en) * 2018-04-24 2021-05-13 三菱瓦斯化学株式会社 Laminated board, printed wiring board, multilayer printed wiring board, laminated body, and manufacturing method of laminated board
JP7108516B2 (en) * 2018-10-25 2022-07-28 リンテック株式会社 Sheet pasting method
CN112703239B (en) * 2018-11-22 2022-10-04 琳得科株式会社 Film for forming thermosetting protective film, composite sheet for forming protective film, and method for producing chip
JP7217175B2 (en) * 2019-03-01 2023-02-02 日東電工株式会社 Semiconductor back adhesion film and dicing tape integrated semiconductor back adhesion film
JP6867522B2 (en) * 2020-01-21 2021-04-28 デクセリアルズ株式会社 Manufacturing method of thermosetting adhesive sheet and semiconductor device
JP2023043538A (en) 2021-09-16 2023-03-29 リンテック株式会社 Protective film forming film, composite sheet for forming protective film and method for manufacturing workpiece article with protective film
WO2023145590A1 (en) 2022-01-28 2023-08-03 リンテック株式会社 Thermosetting resin film, composite sheet, semiconductor chip, and production method for semiconductor chip
JP2024514991A (en) 2022-03-23 2024-04-04 エルジー・ケム・リミテッド Polycarbonate resin and its manufacturing method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4364508B2 (en) 2002-12-27 2009-11-18 リンテック株式会社 Protective film forming sheet for chip back surface and manufacturing method of chip with protective film
JP5435685B2 (en) * 2007-02-28 2014-03-05 ナミックス株式会社 Resin film for sealing
WO2008108131A1 (en) * 2007-03-01 2008-09-12 Nitto Denko Corporation Thermosetting die bonding film
CN101597417B (en) * 2008-06-05 2011-04-13 中国科学院化学研究所 High-temperature resistant and high-toughness epoxy matrix resin as well as preparation method and application thereof
JP5681377B2 (en) 2010-04-20 2015-03-04 日東電工株式会社 Manufacturing method of semiconductor device and flip chip type semiconductor device
JP5384443B2 (en) * 2010-07-28 2014-01-08 日東電工株式会社 Flip chip type semiconductor back film, dicing tape integrated semiconductor back film, semiconductor device manufacturing method, and flip chip type semiconductor device
JP6051630B2 (en) * 2011-07-13 2016-12-27 味の素株式会社 Semiconductor package

Also Published As

Publication number Publication date
KR20210074413A (en) 2021-06-21
PH12015502208B1 (en) 2016-02-01
KR20220035981A (en) 2022-03-22
KR20150135284A (en) 2015-12-02
KR102377100B1 (en) 2022-03-21
JP5615471B1 (en) 2014-10-29
TWI516530B (en) 2016-01-11
TW201510008A (en) 2015-03-16
KR102541666B1 (en) 2023-06-13
WO2014148642A1 (en) 2014-09-25
CN104937712B (en) 2018-03-27
CN104937712A (en) 2015-09-23
JPWO2014148642A1 (en) 2017-02-16
KR20210074414A (en) 2021-06-21
SG11201507775XA (en) 2015-10-29

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