PH12015501521A1 - Silver alloy bonding wire - Google Patents
Silver alloy bonding wireInfo
- Publication number
- PH12015501521A1 PH12015501521A1 PH12015501521A PH12015501521A PH12015501521A1 PH 12015501521 A1 PH12015501521 A1 PH 12015501521A1 PH 12015501521 A PH12015501521 A PH 12015501521A PH 12015501521 A PH12015501521 A PH 12015501521A PH 12015501521 A1 PH12015501521 A1 PH 12015501521A1
- Authority
- PH
- Philippines
- Prior art keywords
- bonding wire
- silver
- alloy bonding
- silver alloy
- bonding
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
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- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Wire Bonding (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130001243A KR101416778B1 (ko) | 2013-01-04 | 2013-01-04 | 은 합금 본딩 와이어 |
PCT/KR2014/000038 WO2014107040A1 (fr) | 2013-01-04 | 2014-01-03 | Fil de connexion en alliage d'argent |
Publications (1)
Publication Number | Publication Date |
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PH12015501521A1 true PH12015501521A1 (en) | 2015-09-21 |
Family
ID=51062322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12015501521A PH12015501521A1 (en) | 2013-01-04 | 2015-07-03 | Silver alloy bonding wire |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR101416778B1 (fr) |
CN (1) | CN105122435A (fr) |
PH (1) | PH12015501521A1 (fr) |
WO (1) | WO2014107040A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107195609B (zh) * | 2014-07-10 | 2021-03-23 | 日铁化学材料株式会社 | 半导体装置用接合线 |
SG10201508104TA (en) * | 2015-09-29 | 2017-04-27 | Heraeus Materials Singapore Pte Ltd | Alloyed silver wire |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101001700B1 (ko) * | 2007-03-30 | 2010-12-15 | 엠케이전자 주식회사 | 반도체 패키지용 은합금 와이어 |
US7952028B2 (en) * | 2008-01-25 | 2011-05-31 | Nippon Steel Materials Co., Ltd. | Bonding wire for semiconductor device |
US8101123B2 (en) * | 2009-03-23 | 2012-01-24 | Lee Jun-Der | Composite alloy bonding wire and manufacturing method thereof |
US20100239455A1 (en) * | 2009-03-23 | 2010-09-23 | Lee Jun-Der | Composite alloy bonding wire and manufacturing method thereof |
JP5616165B2 (ja) * | 2010-08-24 | 2014-10-29 | タツタ電線株式会社 | 銀ボンディングワイヤ |
-
2013
- 2013-01-04 KR KR1020130001243A patent/KR101416778B1/ko active IP Right Grant
-
2014
- 2014-01-03 WO PCT/KR2014/000038 patent/WO2014107040A1/fr active Application Filing
- 2014-01-03 CN CN201480011968.2A patent/CN105122435A/zh active Pending
-
2015
- 2015-07-03 PH PH12015501521A patent/PH12015501521A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR101416778B1 (ko) | 2014-07-09 |
CN105122435A (zh) | 2015-12-02 |
WO2014107040A1 (fr) | 2014-07-10 |
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