PH12011000344A1 - Die bonder incorporating dual-head dispenser - Google Patents
Die bonder incorporating dual-head dispenserInfo
- Publication number
- PH12011000344A1 PH12011000344A1 PH12011000344A PH12011000344A PH12011000344A1 PH 12011000344 A1 PH12011000344 A1 PH 12011000344A1 PH 12011000344 A PH12011000344 A PH 12011000344A PH 12011000344 A PH12011000344 A PH 12011000344A PH 12011000344 A1 PH12011000344 A1 PH 12011000344A1
- Authority
- PH
- Philippines
- Prior art keywords
- substrate
- axis
- nozzle
- bond pads
- dispensing
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
- H01L2224/2731—Manufacturing methods by local deposition of the material of the layer connector in liquid form
- H01L2224/27312—Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/2902—Disposition
- H01L2224/29034—Disposition the layer connector covering only portions of the surface to be connected
- H01L2224/29036—Disposition the layer connector covering only portions of the surface to be connected covering only the central area of the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/75611—Feeding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
Abstract
Adhesive is dispensed for conducting die bonding onto a substrate including rows of bond pads aligned along a first axis and columns of bond pads aligned along a second axis transverse to the first axis where target dispensing positions are located. A first dispensing head incorporating a first nozzle and a second dispensing head incorporating a second nozzle are provided and the substrate is fed along the first axis to a position where the first and second dispensing heads are located. Pattern recognition of a columnar section of the substrate comprising one or more consecutive columns of bond pads with an optical system may be conducted by moving the optical system along the second axis relative to the substrate. Thereafter, the first nozzle and the second nozzle are driven concurrently to dispense adhesive from the first and second nozzles onto the target dispensing positions in the same columnar section of the substrate.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/941,174 US7977231B1 (en) | 2010-11-08 | 2010-11-08 | Die bonder incorporating dual-head dispenser |
Publications (2)
Publication Number | Publication Date |
---|---|
PH12011000344A1 true PH12011000344A1 (en) | 2016-04-04 |
PH12011000344B1 PH12011000344B1 (en) | 2016-04-04 |
Family
ID=44245501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12011000344A PH12011000344B1 (en) | 2010-11-08 | 2011-10-26 | Die bonder incorporating dual-head dispenser |
Country Status (10)
Country | Link |
---|---|
US (1) | US7977231B1 (en) |
EP (1) | EP2450947B1 (en) |
JP (1) | JP5745386B2 (en) |
KR (1) | KR101242402B1 (en) |
CN (1) | CN102569103B (en) |
HK (1) | HK1170337A1 (en) |
MY (1) | MY152215A (en) |
PH (1) | PH12011000344B1 (en) |
SG (1) | SG181221A1 (en) |
TW (1) | TWI458024B (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013063719A1 (en) * | 2011-11-02 | 2013-05-10 | 无锡华润安盛科技有限公司 | Method for die-bonding pressure sensor die into pre-plastic packaged lead box, and device thereof |
US8996285B2 (en) | 2012-05-09 | 2015-03-31 | Hyundai Motor Company | System for detecting malfunction of variable valve lift apparatus and method for the same |
JP6073625B2 (en) * | 2012-09-28 | 2017-02-01 | キヤノンマシナリー株式会社 | Substrate transport method and substrate transport apparatus |
TWI587416B (en) * | 2013-01-25 | 2017-06-11 | 先進科技新加坡有限公司 | A wire bonder and method of calibrating a wire bonder |
CH707890B1 (en) | 2013-04-15 | 2017-12-15 | Besi Switzerland Ag | Device for applying adhesive to a substrate. |
US20140341691A1 (en) * | 2013-05-14 | 2014-11-20 | Kui Kam Lam | Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bonding |
KR101647968B1 (en) * | 2015-03-19 | 2016-08-16 | 앰코 테크놀로지 코리아 주식회사 | Chip attach device for manufacturing semiconductor package |
CN108313724A (en) * | 2017-12-28 | 2018-07-24 | 芜湖瑞思机器人有限公司 | A kind of donkey-hide gelatin blob of viscose puts conveying mechanism after inker automatically |
US11289445B2 (en) * | 2018-12-24 | 2022-03-29 | Asm Technology Singapore Pte Ltd | Die bonder incorporating rotatable adhesive dispenser head |
CN112742631B (en) * | 2020-12-24 | 2021-12-28 | 厦门天马微电子有限公司 | Nozzle assembly, jet printing device and jet printing method |
CN115424947B (en) * | 2022-09-21 | 2023-08-29 | 深圳市三联盛科技股份有限公司 | Semiconductor chip mounting technology and equipment |
CN116544253B (en) * | 2023-05-08 | 2024-03-22 | 马鞍山东大汇泽半导体科技有限公司 | Packaging method of image sensor |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61235075A (en) * | 1985-04-11 | 1986-10-20 | Toshiba Corp | Feeding method for adhesive liquid by dispenser head |
KR970013262A (en) * | 1995-08-30 | 1997-03-29 | 김광호 | Leadframe with Extended Internal Leads |
KR970024104A (en) * | 1995-10-30 | 1997-05-30 | 김광호 | Package with lead structure pad with dual structure |
US5813590A (en) * | 1995-12-18 | 1998-09-29 | Micron Technology, Inc. | Extended travel wire bonding machine |
JPH10137660A (en) * | 1996-11-18 | 1998-05-26 | Ricoh Co Ltd | Paste coating apparatus |
US6204093B1 (en) * | 1997-08-21 | 2001-03-20 | Micron Technology, Inc. | Method and apparatus for applying viscous materials to a lead frame |
US6112973A (en) * | 1997-10-31 | 2000-09-05 | Texas Instruments Incorporated | Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe |
US6331452B1 (en) * | 1999-04-12 | 2001-12-18 | Verdicom, Inc. | Method of fabricating integrated circuit package with opening allowing access to die |
JP4675505B2 (en) * | 2001-06-21 | 2011-04-27 | 株式会社東芝 | Coating device, coating method, and display device manufacturing method |
US6564979B2 (en) * | 2001-07-18 | 2003-05-20 | Micron Technology, Inc. | Method and apparatus for dispensing adhesive on microelectronic substrate supports |
US20030044534A1 (en) * | 2001-09-06 | 2003-03-06 | Lau Siu Wing | Multi-pin epoxy writing apparatus |
US7332819B2 (en) * | 2002-01-09 | 2008-02-19 | Micron Technology, Inc. | Stacked die in die BGA package |
US6861278B2 (en) * | 2002-04-11 | 2005-03-01 | Nordson Corporation | Method and apparatus for underfilling semiconductor devices |
US7179346B2 (en) | 2003-06-03 | 2007-02-20 | Asm Assembly Automation Ltd. | Semiconductor apparatus with multiple delivery devices for components |
US7727800B2 (en) * | 2005-12-12 | 2010-06-01 | Asm Assembly Automation Ltd. | High precision die bonding apparatus |
JP4973842B2 (en) * | 2006-08-21 | 2012-07-11 | Tdk株式会社 | Droplet coating apparatus and method |
CN100530583C (en) * | 2007-07-26 | 2009-08-19 | 日月光半导体制造股份有限公司 | Wiring machine platform and wiring method |
JP4891185B2 (en) * | 2007-09-18 | 2012-03-07 | パナソニック株式会社 | Viscous fluid application device |
US7851930B1 (en) * | 2008-06-04 | 2010-12-14 | Henkel Corporation | Conductive adhesive compositions containing an alloy filler material for better dispense and thermal properties |
JP5634021B2 (en) * | 2008-11-12 | 2014-12-03 | 株式会社東芝 | Semiconductor device manufacturing apparatus and semiconductor device manufacturing method |
-
2010
- 2010-11-08 US US12/941,174 patent/US7977231B1/en active Active
-
2011
- 2011-10-20 TW TW100138005A patent/TWI458024B/en active
- 2011-10-25 MY MYPI2011005161 patent/MY152215A/en unknown
- 2011-10-26 PH PH12011000344A patent/PH12011000344B1/en unknown
- 2011-10-28 SG SG2011079449A patent/SG181221A1/en unknown
- 2011-11-03 KR KR1020110113796A patent/KR101242402B1/en active IP Right Grant
- 2011-11-07 CN CN201110347683.4A patent/CN102569103B/en active Active
- 2011-11-07 EP EP11008850.7A patent/EP2450947B1/en active Active
- 2011-11-07 JP JP2011243597A patent/JP5745386B2/en active Active
-
2012
- 2012-11-02 HK HK12111032.3A patent/HK1170337A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
HK1170337A1 (en) | 2013-02-22 |
US7977231B1 (en) | 2011-07-12 |
CN102569103B (en) | 2015-04-08 |
KR101242402B1 (en) | 2013-03-12 |
EP2450947A3 (en) | 2017-05-10 |
EP2450947A2 (en) | 2012-05-09 |
JP5745386B2 (en) | 2015-07-08 |
TWI458024B (en) | 2014-10-21 |
KR20120049139A (en) | 2012-05-16 |
EP2450947B1 (en) | 2018-07-04 |
CN102569103A (en) | 2012-07-11 |
PH12011000344B1 (en) | 2016-04-04 |
TW201227840A (en) | 2012-07-01 |
SG181221A1 (en) | 2012-06-28 |
MY152215A (en) | 2014-08-29 |
JP2012104828A (en) | 2012-05-31 |
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