KR970013262A - Leadframe with Extended Internal Leads - Google Patents

Leadframe with Extended Internal Leads Download PDF

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Publication number
KR970013262A
KR970013262A KR1019950027658A KR19950027658A KR970013262A KR 970013262 A KR970013262 A KR 970013262A KR 1019950027658 A KR1019950027658 A KR 1019950027658A KR 19950027658 A KR19950027658 A KR 19950027658A KR 970013262 A KR970013262 A KR 970013262A
Authority
KR
South Korea
Prior art keywords
leadframe
die pad
chip
tie bar
internal leads
Prior art date
Application number
KR1019950027658A
Other languages
Korean (ko)
Inventor
김재홍
성시찬
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950027658A priority Critical patent/KR970013262A/en
Publication of KR970013262A publication Critical patent/KR970013262A/en

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Abstract

본 발명은 리드프레임에 관한 것으로, 내부리드들은 다이패드의 내측 방향으로 가장 근접되게 형성시켜 다양한 칩의 크기에 대응할 수 있으며, 또한 상기 다이패드에 인접된 타이바에 여러 가지 요철부를 형성시켜 다이접착 공정에 발생되는 칩과 다이패드간의 응력을 방지할 수 있는 효과를 가진다.The present invention relates to a lead frame, the inner leads are formed closest to the inner direction of the die pad to correspond to the size of the various chips, and also the die bonding process by forming a variety of irregularities in the tie bar adjacent to the die pad It has an effect that can prevent the stress between the chip and the die pad is generated.

Description

연장된 내부리드를 갖는 리드프레임Leadframe with Extended Internal Leads

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3A도는 본 발명의 일실시예에 의한 크기가 작은 칩에 대응되는 리드프레임의 평면도, 제3B도는 본 발명의 다른 실시예에 의한 크기가 큰 칩에 대응되는 리드프레임의 평면도.3A is a plan view of a lead frame corresponding to a small chip according to an embodiment of the present invention, and FIG. 3B is a plan view of a lead frame corresponding to a large chip according to another embodiment of the present invention.

Claims (4)

칩이 탑재되는 다이패드와; 그 칩의 상면에 형성된 본딩패드들에 각기 대응하여 전기적 연결되는 내부리드들과; 그 다이패드를 기계적으로 지지하는 타이바를 갖는 리드프레임에 있어서, 다양한 크기의 칩을 탑재하기 위해 연장된 내부리드들을 포함하는 것을 특징으로 하는 연장된 내부리드를 갖는 리드프레임.A die pad on which a chip is mounted; Internal leads electrically connected to bonding pads formed on an upper surface of the chip, respectively; A leadframe having a tie bar that mechanically supports the die pad, the leadframe having an extended inner lead comprising extended inner leads for mounting chips of various sizes. 제1항에 있어서, 상기 연장된 내부리드들이 더미패드 역할을 하는 것을 특징으로 하는 연장된 내부리드를 갖는 리드프레임.2. The leadframe of claim 1, wherein the extended inner leads serve as dummy pads. 제1항에 있어서, 상기 타이바가 상기 다이패드와 인접되게 형성된 것을 특징으로 하는 연장된 내부리드를 갖는 리드프레임.The leadframe according to claim 1, wherein the tie bar is formed adjacent to the die pad. 제1항 또는 제 3항에 있어서, 상기 타이바가 상기 칩과 다이패드간의 응력을 방지하기 위해 요철부가 형성된 것을 특징으로 하는 연장된 내부리드를 갖는 리드프레임.The lead frame according to claim 1 or 3, wherein the tie bar is formed with an uneven portion to prevent stress between the chip and the die pad.
KR1019950027658A 1995-08-30 1995-08-30 Leadframe with Extended Internal Leads KR970013262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950027658A KR970013262A (en) 1995-08-30 1995-08-30 Leadframe with Extended Internal Leads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950027658A KR970013262A (en) 1995-08-30 1995-08-30 Leadframe with Extended Internal Leads

Publications (1)

Publication Number Publication Date
KR970013262A true KR970013262A (en) 1997-03-29

Family

ID=66596872

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950027658A KR970013262A (en) 1995-08-30 1995-08-30 Leadframe with Extended Internal Leads

Country Status (1)

Country Link
KR (1) KR970013262A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101242402B1 (en) * 2010-11-08 2013-03-12 에이에스엠 어쌤블리 오토메이션 리미티드 Die bonder incorporating dual-head dispenser

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101242402B1 (en) * 2010-11-08 2013-03-12 에이에스엠 어쌤블리 오토메이션 리미티드 Die bonder incorporating dual-head dispenser

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