KR970013262A - Leadframe with Extended Internal Leads - Google Patents
Leadframe with Extended Internal Leads Download PDFInfo
- Publication number
- KR970013262A KR970013262A KR1019950027658A KR19950027658A KR970013262A KR 970013262 A KR970013262 A KR 970013262A KR 1019950027658 A KR1019950027658 A KR 1019950027658A KR 19950027658 A KR19950027658 A KR 19950027658A KR 970013262 A KR970013262 A KR 970013262A
- Authority
- KR
- South Korea
- Prior art keywords
- leadframe
- die pad
- chip
- tie bar
- internal leads
- Prior art date
Links
Abstract
본 발명은 리드프레임에 관한 것으로, 내부리드들은 다이패드의 내측 방향으로 가장 근접되게 형성시켜 다양한 칩의 크기에 대응할 수 있으며, 또한 상기 다이패드에 인접된 타이바에 여러 가지 요철부를 형성시켜 다이접착 공정에 발생되는 칩과 다이패드간의 응력을 방지할 수 있는 효과를 가진다.The present invention relates to a lead frame, the inner leads are formed closest to the inner direction of the die pad to correspond to the size of the various chips, and also the die bonding process by forming a variety of irregularities in the tie bar adjacent to the die pad It has an effect that can prevent the stress between the chip and the die pad is generated.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제3A도는 본 발명의 일실시예에 의한 크기가 작은 칩에 대응되는 리드프레임의 평면도, 제3B도는 본 발명의 다른 실시예에 의한 크기가 큰 칩에 대응되는 리드프레임의 평면도.3A is a plan view of a lead frame corresponding to a small chip according to an embodiment of the present invention, and FIG. 3B is a plan view of a lead frame corresponding to a large chip according to another embodiment of the present invention.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950027658A KR970013262A (en) | 1995-08-30 | 1995-08-30 | Leadframe with Extended Internal Leads |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950027658A KR970013262A (en) | 1995-08-30 | 1995-08-30 | Leadframe with Extended Internal Leads |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970013262A true KR970013262A (en) | 1997-03-29 |
Family
ID=66596872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950027658A KR970013262A (en) | 1995-08-30 | 1995-08-30 | Leadframe with Extended Internal Leads |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970013262A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101242402B1 (en) * | 2010-11-08 | 2013-03-12 | 에이에스엠 어쌤블리 오토메이션 리미티드 | Die bonder incorporating dual-head dispenser |
-
1995
- 1995-08-30 KR KR1019950027658A patent/KR970013262A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101242402B1 (en) * | 2010-11-08 | 2013-03-12 | 에이에스엠 어쌤블리 오토메이션 리미티드 | Die bonder incorporating dual-head dispenser |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |