CN100530583C - Wiring machine platform and wiring method - Google Patents
Wiring machine platform and wiring method Download PDFInfo
- Publication number
- CN100530583C CN100530583C CNB2007101398919A CN200710139891A CN100530583C CN 100530583 C CN100530583 C CN 100530583C CN B2007101398919 A CNB2007101398919 A CN B2007101398919A CN 200710139891 A CN200710139891 A CN 200710139891A CN 100530583 C CN100530583 C CN 100530583C
- Authority
- CN
- China
- Prior art keywords
- chip
- lead bonding
- bonding joint
- joint
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Wire Bonding (AREA)
Abstract
The invention is concerned with the thread feeder arm that is used to process thread to at least the first chip and the second chip on the basis synchronously, includes: at least the first thread head and the second thread head, the driving unit, the processing unit, the database. It is: the driving unit uses to move the first thread head and the second thread head; the processing unit uses to output the controlling order to the driving unit in order to control the first thread head and the second thread head; the database stores the operating parameter data, the processing unit control the first thread head and the second thread head according to the operating parameter data.
Description
Technical field
The invention relates to a kind of wire bonder platform and wire bonding method thereof, and particularly have at least two lead bonding joint go between simultaneously the wire bonder platform and a wire bonding method thereof of bonding relevant for a kind of.
Background technology
Along with the arriving in consumer electronics epoch, in recent years for each adhesive integrated circuit (integratedcircuit, the also rapid increase of demand IC).Therefore, also related increase is for the demand of IC encapsulation production capacity.So, how under prior art, increase the efficient and the production capacity of encapsulation, just become and respectively encapsulate factory and promote key of competitiveness.
IC need be connected to pin on the substrate with the electrical contact on the IC through lead-in wire bonding processing procedure (wire-bonding process), again through becoming the electronic building brick that can assemble after the encapsulation.And tradition only can be with the single wire bonder bonding that goes between on a substrate, and under the situation that can't expand production line, the speed of lead-in wire bonding is difficult to remarkable lifting.
Summary of the invention
In view of this, purpose of the present invention is providing a kind of wire bonder platform and wire bonding method thereof exactly, and at least two lead bonding joint bonding that goes between simultaneously is provided, and can significantly improve the speed of lead-in wire bonding.
According to purpose of the present invention, a kind of wire bonder platform is proposed, in order to bonding that at least one first chip on the substrate and one second chip are gone between simultaneously.The wire bonder platform comprises at least one first lead bonding joint and one second lead bonding joint, a driver element, a processing unit and a database.Driver element is in order to moving first lead bonding joint and second lead bonding joint, processing unit in order to the output control command to driver element to control first lead bonding joint and second lead bonding joint.Database storage one operational parameter data, processing unit are to control first lead bonding joint and second lead bonding joint according to operational parameter data.
According to purpose of the present invention, a kind of wire bonding method of wire bonder platform is proposed.The wire bonder platform comprises at least one first lead bonding joint and one second lead bonding joint, the wire bonder platform is in order to bonding that at least one first chip on the substrate and one second chip are gone between simultaneously, wire bonding method comprises: at first, obtain the elements of a fix of first chip and the second chip position; Then, whether the spacing of judging first chip and second chip sets spacing greater than one; When the spacing of first chip and second chip when setting spacing, first lead bonding joint and second lead bonding joint are respectively simultaneously to first chip and second chip bonding that goes between.
Wire bonder platform of the present invention and wire bonding method provide at least two lead bonding joint bonding that goes between simultaneously, can significantly improve the speed of lead-in wire bonding.
Description of drawings
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
Fig. 1 illustrates the functional block diagram of a kind of wire bonder platform of the present invention;
Fig. 2 illustrates the schematic diagram of wire bonder platform and substrate and chip thereof; And
Fig. 3 illustrates the wire bonding method flow chart of a kind of wire bonder platform of the present invention.
The primary clustering symbol description
100: the wire bonder platform
110: processing unit
120: driver element
130: the first lead bonding joint
140: the second lead bonding joint
150: database
160: positioner
210: substrate
212: the first chips
214: the second chips
216: the three chips
Embodiment
Please refer to Fig. 1, it illustrates the functional block diagram of a kind of wire bonder platform of the present invention.Wire bonder platform 100 is in order to bonding that at least one first chip on the substrate and one second chip (not illustrating among the figure) are gone between simultaneously.Wire bonder platform 100 comprises first lead bonding joint 130 and second lead bonding joint 140, driver element 120 and processing unit 110.Driver element 120 for example is a CD-ROM drive motor in order to move first lead bonding joint 130 and second lead bonding joint 140; Processing unit 110 is in order to export control command to driver element 120, with move mode and the action of lead-in wire bonding of controlling first lead bonding joint 130 and second lead bonding joint 140, processing unit 110 for example be a microprocessor or an application-specific integrated circuit (ASIC) (application specific integrated circuit, ASIC).
In addition, wire bonder platform 100 more comprises the database 150 in order to the store operation supplemental characteristic, and processing unit 110 is to control first lead bonding joint 130 and second lead bonding joint 140 according to operational parameter data.The operational parameter data of indication is to comprise the spacing of chip on the substrate, the size of chip herein, and the elements of a fix of chip position.When first lead bonding joint 130 and second lead bonding joint 140 go between bonding simultaneously, whether the elements of a fix are positioned at a safe range in order to the spacing that provides processing unit 110 to judge first lead bonding joint 130 and second lead bonding joint 140, and for first lead bonding joint 130 and second lead bonding joint 140 is initial and the usefulness of chip chamber location.
In addition, the technical field under the present invention has knows the knowledgeable usually, and technology of the present invention as can be known is not limited thereto.Wire bonder platform 10 can be to have first lead bonding joint 130 and second lead bonding joint 140 on the single wire bonder platform simultaneously, also can be the wire bonder combination that has single lead bonding joint with original two, see through processing unit 110 and control two wire bonders simultaneously.And driver element 120 can be the CD-ROM drive motor on the wire bonder separately, or can control the integration CD-ROM drive motor of first lead bonding joint 130 and second lead bonding joint 140 on the single wire bonder platform simultaneously.
In addition, wire bonder platform 100 more comprises positioner 160, in order to the primary importance and the second place at the place of confirming first chip and second chip, processing unit 110 is to control first lead bonding joint 130 and second lead bonding joint 140 bonding that goes between according to primary importance and the second place.That is to say, by positioner 160 can auxiliary judgment first lead bonding joint 130 and second lead bonding joint 140 whether be positioned on the correct position.Positioner 160 comprises that (charge coupled device CCD), also can be to have a CCD respectively on first lead bonding joint 130 and second lead bonding joint 140 at least one electric coupling assembly in the present embodiment.And whether first lead bonding joint 130 and second lead bonding joint 140 are positioned on the correct position, can receive the image of first lead bonding joint 130 and second lead bonding joint 140 and substrate by CCD after, be shown on the screen manually to judge; Or receive the image of first lead bonding joint 130 and second lead bonding joint 140 and substrate by CCD after, by processing unit 110 or be coupled to a computer in addition and judge.First chip and second chip are straight lines that is arranged in substrate in fact in the present embodiment, for example same row or with in the delegation.First lead bonding joint 130 and second lead bonding joint 140 are along the straight line bonding that moves and go between.
Please refer to Fig. 2, it illustrates the schematic diagram of wire bonder platform and substrate and chip thereof.And please be simultaneously with reference to Fig. 1 and Fig. 3, Fig. 3 is the wire bonding method flow chart that illustrates a kind of wire bonder platform of the present invention.
Please refer to Fig. 2.At first, shown in step 310, obtain the elements of a fix of first chip 212 and second chip, 214 positions on the substrate 210.This step can be obtained from database 150 by processing unit 110.
Then, shown in step 320, whether the space D of judging first chip 212 and second chip 214 is greater than a setting spacing, and these data of setting spacing can be stored in the database 150.This step is for fear of when space D is too small, first lead bonding joint 130 and second lead bonding joint 140 may because in the lead-in wire bonding process too near and take place mutually that collision causes damage.
Therefore, when space D during less than default spacing, then shown in step 330, second lead bonding joint 140 is away from first lead bonding joint 130 and move to the top of one the 3rd chip 216 of substrate 210.In the present embodiment, first chip 212, second chip 214 and the 3rd chip 216 are straight lines that are arranged in substrate 210 in fact, for example same listing.First lead bonding joint 130 and second lead bonding joint 140 are to move and the lead-in wire bonding in same listing.But the invention is not restricted to this, also can be that first chip 212, second chip 214 and the 3rd chip 216 are positioned at in the delegation, and first lead bonding joint 130 and second lead bonding joint 140 are to move and the lead-in wire bonding on delegation.
Then, shown in step 340, processing unit 110 is to send location signal to the first lead bonding joint 130 and second lead bonding joint 140 respectively, makes first lead bonding joint 130 and second lead bonding joint 140 contraposition first chip 212 and the 3rd chip 216 respectively.
Then, shown in step 350, first lead bonding joint 130 and second lead bonding joint 140 are respectively simultaneously to first chip 212 and the 3rd chip 216 bonding that goes between.
When the space D of judging first chip 212 and second chip 214 in the step 320 when setting spacing, then jump directly to step 350, send framing signal to the first lead bonding joint 130 and second lead bonding joint 140 respectively by processing unit 110, make first lead bonding joint 130 and second lead bonding joint 140 respectively behind contraposition first chips 212 and second chip 214, first lead bonding joint 130 and second lead bonding joint 140 are respectively simultaneously to first chip 212 and second chip 214 bonding that goes between.
After first lead bonding joint 130 and second lead bonding joint 140 are finished the lead-in wire bonding of first chip 212 and second chip 214/ the 3rd chip 216 respectively, be to move the line lead bonding of going forward side by side toward same row or with following two chips in the delegation respectively, in the present embodiment first lead bonding joint 130 and second lead bonding joint 140 be same list mobile.Basically, the location of first lead bonding joint 130 and second lead bonding joint 140 and the judgement of spacing only need to carry out at the beginning the time, follow-up chip is because all with certain spacing arrangement, first lead bonding joint 130 and second lead bonding joint 140 only need corresponding move same spacing can with the next chip contraposition line lead bonding of going forward side by side.Behind the lead-in wire bonding of finishing the same chip that lists, first lead bonding joint 130 and 140 chips that move on next column or the next line of second lead bonding joint are proceeded the bonding that goes between, and all go between till bonding finishes up to the chip on the substrate 210.
Yet the technical field under the present invention has knows the knowledgeable usually, and technology of the present invention as can be known is not limited thereto.Wire bonder platform 100 also can have plural lead bonding joint, as long as lead bonding joint can all belong to scope of the present invention at the same straight line bonding that goes between simultaneously.In addition, the present invention also can be applicable to glutinous brilliant board, as long as first lead bonding joint 130 and second lead bonding joint 140 are replaced as glutinous brilliant device, promptly can stick brilliant operation by the same manner.
Disclosed wire bonder platform of the above embodiment of the present invention and wire bonding method thereof, be simultaneously with at least two lead bonding joint simultaneously in the bonding operation that goes between of same straight line.Can not need to extend under the condition of production line, significantly increase the speed of lead-in wire bonding operation.
In sum, though the present invention discloses as above with a preferred embodiment, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (11)
1. wire bonder platform in order to bonding that at least one first chip on the substrate and one second chip are gone between simultaneously, is characterized in that this wire bonder platform comprises:
At least one first lead bonding joint and one second lead bonding joint;
One driver element is in order to move this first lead bonding joint and this second lead bonding joint;
One processing unit, in order to output control command to this driver element to control this first lead bonding joint and this second lead bonding joint; And
One database, this database storage one operational parameter data, this processing unit is to control this first lead bonding joint and this second lead bonding joint according to this operational parameter data.
2. wire bonder platform as claimed in claim 1 is characterized in that, this operational parameter data comprises the spacing of chip, the size of chip and the elements of a fix of chip position.
3. wire bonder platform as claimed in claim 1, it is characterized in that, more comprise a location device, in order to a primary importance and a second place at the place of confirming this first chip and this second chip, this processing unit is to control this first lead bonding joint and this second lead bonding joint bonding that goes between according to this primary importance and this second place.
4. wire bonder platform as claimed in claim 3 is characterized in that, this positioner comprises at least one electric coupling assembly.
5. wire bonder platform as claimed in claim 1 is characterized in that, this first chip and this second chip are straight lines that is arranged in this substrate, and this first lead bonding joint and this second lead bonding joint are along this straight line bonding that moves and go between.
6. the wire bonding method of a wire bonder platform, it is characterized in that, this wire bonder platform comprises at least one first lead bonding joint and one second lead bonding joint, this wire bonder platform is in order to bonding that at least one first chip on the substrate and one second chip are gone between simultaneously, and this wire bonding method comprises:
(a) obtain the elements of a fix of this first chip and this second chip position;
(b) whether the spacing of judging this first chip and this second chip sets spacing greater than one; And
(c) when the spacing of this first chip and this second chip is set spacing greater than this, this first lead bonding joint and this second lead bonding joint are respectively simultaneously to this first chip and this second chip bonding that goes between.
7. wire bonding method as claimed in claim 6, it is characterized in that, this wire bonder platform more comprises a processing unit, this processing unit is to send a location signal respectively to this first lead bonding joint and this second lead bonding joint in the step (c), makes this first lead bonding joint and this second lead bonding joint this first chip of contraposition and this second chip respectively.
8. wire bonding method as claimed in claim 6 is characterized in that, more comprises
(d) when the spacing of this first chip and this second chip is set spacing less than this, this second lead bonding joint is away from this first lead bonding joint and move to one the 3rd chip top of this substrate.
9. wire bonding method as claimed in claim 8 is characterized in that, also comprises after carrying out described step (d):
(e) this first lead bonding joint and this second lead bonding joint are respectively simultaneously to this first chip and the 3rd chip bonding that goes between.
10. wire bonding method as claimed in claim 8, it is characterized in that, this wire bonder platform more comprises a processing unit, this processing unit is to send a location signal respectively to this first lead bonding joint and this second lead bonding joint in the step (d), makes this first lead bonding joint and this second lead bonding joint this first chip of contraposition and the 3rd chip respectively.
11. wire bonding method as claimed in claim 8, it is characterized in that, this first chip, this second chip and the 3rd chip are straight lines that is arranged in this substrate, and this first lead bonding joint and this second lead bonding joint are along this straight line bonding that moves and go between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101398919A CN100530583C (en) | 2007-07-26 | 2007-07-26 | Wiring machine platform and wiring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101398919A CN100530583C (en) | 2007-07-26 | 2007-07-26 | Wiring machine platform and wiring method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101101885A CN101101885A (en) | 2008-01-09 |
| CN100530583C true CN100530583C (en) | 2009-08-19 |
Family
ID=39036079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101398919A Active CN100530583C (en) | 2007-07-26 | 2007-07-26 | Wiring machine platform and wiring method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100530583C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7977231B1 (en) * | 2010-11-08 | 2011-07-12 | Asm Assembly Automation Ltd | Die bonder incorporating dual-head dispenser |
| CN102339771B (en) * | 2011-09-30 | 2016-03-23 | 中南大学 | A kind of two bonding wire head wirebonding device |
-
2007
- 2007-07-26 CN CNB2007101398919A patent/CN100530583C/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101101885A (en) | 2008-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7617966B2 (en) | Semiconductor device | |
| US7981788B2 (en) | Semiconductor device and a manufacturing method of the same | |
| US7687921B2 (en) | High density memory device manufacturing using isolated step pads | |
| US20070029367A1 (en) | Semiconductor device | |
| CN101393878B (en) | Wire bonding system utilizing multiple positioning tables | |
| KR20050023972A (en) | Wire bonding method of semiconductor device | |
| US5816477A (en) | Wire bonding apparatus and method | |
| CN100530583C (en) | Wiring machine platform and wiring method | |
| CN103000550A (en) | Die bonder and bonding method | |
| US20100295180A1 (en) | Wire bonding structure and manufacturing method thereof | |
| TWI599276B (en) | Electronic element and manufacturing method | |
| JP4666592B2 (en) | Manufacturing method of semiconductor device | |
| CN101266955B (en) | Semiconductor device and its making method | |
| US20080035706A1 (en) | Wire-bonding apparatus and wire-bonding method thereof | |
| US7446400B2 (en) | Chip package structure and fabricating method thereof | |
| JP2016072381A (en) | Semiconductor or electronic component mounting device and semiconductor or electronic component mounting method | |
| US6572001B2 (en) | Bonding system | |
| US7893530B2 (en) | Circuit substrate and the semiconductor package having the same | |
| KR100629272B1 (en) | wire bonding method | |
| KR102489320B1 (en) | Semiconductor die bonding apparatus and method for cantilever type | |
| JPH1079466A (en) | Semiconductor device | |
| KR101362713B1 (en) | Semiconductor device package | |
| JP3148710U (en) | Stacked multichip wire bonding package structure | |
| KR20060094388A (en) | Pattern recognition method for wire bonding of multi-chip package | |
| KR20000015595A (en) | Solder ball bumping method for fabricating a semiconductor package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |