CN101101885A - Wiring machine platform and wiring method - Google Patents
Wiring machine platform and wiring method Download PDFInfo
- Publication number
- CN101101885A CN101101885A CNA2007101398919A CN200710139891A CN101101885A CN 101101885 A CN101101885 A CN 101101885A CN A2007101398919 A CNA2007101398919 A CN A2007101398919A CN 200710139891 A CN200710139891 A CN 200710139891A CN 101101885 A CN101101885 A CN 101101885A
- Authority
- CN
- China
- Prior art keywords
- routing
- chip
- head
- routing head
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention is concerned with the thread feeder arm that is used to process thread to at least the first chip and the second chip on the basis synchronously, includes: at least the first thread head and the second thread head, the driving unit, the processing unit, the database. It is: the driving unit uses to move the first thread head and the second thread head; the processing unit uses to output the controlling order to the driving unit in order to control the first thread head and the second thread head; the database stores the operating parameter data, the processing unit control the first thread head and the second thread head according to the operating parameter data.
Description
Technical field
The invention relates to a kind of wire bonding machine table and routing method thereof, and particularly have wire bonding machine table and a routing method thereof that at least two routing heads carry out routing simultaneously relevant for a kind of.
Background technology
Along with the arriving in consumer electronics epoch, in recent years for each adhesive integrated circuit (integratedcircuit, the also rapid increase of demand IC).Therefore, also related increase is for the demand of IC encapsulation production capacity.So, how under prior art, increase the efficient and the production capacity of encapsulation, just become and respectively encapsulate factory and promote key of competitiveness.
IC need pass through routing processing procedure (wire-bonding process) electrical contact on the IC is connected to pin on the substrate, again through becoming the electronic building brick that can assemble after the encapsulation.And tradition only can be carried out routing with single wire bonder on a substrate, and under the situation that can't expand production line, the speed of routing is difficult to remarkable lifting.
Summary of the invention
In view of this, purpose of the present invention is providing a kind of wire bonding machine table and routing method thereof exactly, provides at least two routing heads to carry out routing simultaneously, can significantly improve the speed of routing.
According to purpose of the present invention, a kind of wire bonding machine table is proposed, in order at least one first chip on the substrate and one second chip are carried out routing simultaneously.Wire bonding machine table comprises at least one first routing head and one second routing head, a driver element, a processing unit and a database.Driver element is in order to moving the first routing head and the second routing head, processing unit in order to the output control command to driver element to control the first routing head and the second routing head.Database storage one operational parameter data, processing unit are to control the first routing head and the second routing head according to operational parameter data.
According to purpose of the present invention, a kind of routing method of wire bonding machine table is proposed.Wire bonding machine table comprises at least one first routing head and one second routing head, wire bonding machine table is in order to carry out routing simultaneously at least one first chip on the substrate and one second chip, routing method comprises: at first, obtain the elements of a fix of first chip and the second chip position; Then, whether the spacing of judging first chip and second chip sets spacing greater than one; When the spacing of first chip and second chip when setting spacing, the first routing head and the second routing head carry out routing to first chip and second chip respectively simultaneously.
Wire bonding machine table of the present invention and routing method provide at least two routing heads to carry out routing simultaneously, can significantly improve the speed of routing.
Description of drawings
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
Fig. 1 illustrates the functional block diagram of a kind of wire bonding machine table of the present invention;
Fig. 2 illustrates the schematic diagram of wire bonding machine table and substrate and chip thereof; And
Fig. 3 illustrates the routing method flow chart of a kind of wire bonding machine table of the present invention.
The primary clustering symbol description
100: wire bonding machine table
110: processing unit
120: driver element
130: the first routing heads
140: the second routing heads
150: database
160: positioner
210: substrate
212: the first chips
214: the second chips
216: the three chips
Embodiment
Please refer to Fig. 1, it illustrates the functional block diagram of a kind of wire bonding machine table of the present invention.Wire bonding machine table 100 is in order to carry out routing simultaneously at least one first chip on the substrate and one second chip (not illustrating among the figure).Wire bonding machine table 100 comprises the first routing head 130 and the second routing head 140, driver element 120 and processing unit 110.Driver element 120 for example is a CD-ROM drive motor in order to move the first routing head 130 and the second routing head 140; Processing unit 110 is in order to export control command to driver element 120, with move mode and the routing action of controlling the first routing head 130 and the second routing head 140, processing unit 110 for example be a microprocessor or an application-specific integrated circuit (ASIC) (application specificintegrated circuit, ASIC).
In addition, wire bonding machine table 100 more comprises the database 150 in order to the store operation supplemental characteristic, and processing unit 110 is to control the first routing head 130 and the second routing head 140 according to operational parameter data.The operational parameter data of indication is to comprise the spacing of chip on the substrate, the size of chip herein, and the elements of a fix of chip position.When the first routing head 130 and the second routing head 140 carry out routing simultaneously, whether the elements of a fix are positioned at a safe range in order to the spacing that provides processing unit 110 to judge the first routing head 130 and the second routing head 140, and for the first routing head 130 and the second routing head 140 is initial and the usefulness of chip chamber location.
In addition, the technical field under the present invention has knows the knowledgeable usually, and technology of the present invention as can be known is not limited thereto.Wire bonding machine table 10 can be to have the first routing head 130 and the second routing head 140 on the single wire bonding machine table simultaneously, also can be the wire bonder combination that has single routing head with original two, sees through processing unit 110 and controls two wire bonders simultaneously.And driver element 120 can be the CD-ROM drive motor on the wire bonder separately, or can control the integration CD-ROM drive motor of the first routing head 130 and the second routing head 140 on the single wire bonding machine table simultaneously.
In addition, wire bonding machine table 100 more comprises positioner 160, in order to the primary importance and the second place at the place of confirming first chip and second chip, processing unit 110 is according to primary importance and the second place is controlled the first routing head 130 and the second routing head 140 carries out routing.That is to say, by positioner 160 can the auxiliary judgment first routing head 130 and the second routing head 140 whether be positioned on the correct position.Positioner 160 comprises that (chargecoupled device CCD), also can be to have a CCD respectively on the first routing head 130 and the second routing head 140 at least one electric coupling assembly in the present embodiment.And whether the first routing head 130 and the second routing head 140 are positioned on the correct position, can receive the image of the first routing head 130 and the second routing head 140 and substrate by CCD after, be shown on the screen manually to judge; Or receive the image of the first routing head 130 and the second routing head 140 and substrate by CCD after, by processing unit 110 or be coupled to a computer in addition and judge.First chip and second chip are straight lines that is arranged in substrate in fact in the present embodiment, for example same row or with in the delegation.The first routing head 130 and the second routing head 140 are to move and routing along straight line.
Please refer to Fig. 2, it illustrates the schematic diagram of wire bonding machine table and substrate and chip thereof.And please be simultaneously with reference to Fig. 1 and Fig. 3, Fig. 3 is the routing method flow chart that illustrates a kind of wire bonding machine table of the present invention.
Please refer to Fig. 2.At first, shown in step 310, obtain the elements of a fix of first chip 212 and second chip, 214 positions on the substrate 210.This step can be obtained from database 150 by processing unit 110.
Then, shown in step 320, whether the space D of judging first chip 212 and second chip 214 is greater than a setting spacing, and these data of setting spacing can be stored in the database 150.This step is for fear of when space D is too small, the first routing head 130 and the second routing head 140 may because in the routing process too near and take place mutually that collision causes damage.
Therefore, when space D during less than default spacing, then shown in step 330, the second routing head 140 is away from the first routing head 130 and move to the top of one the 3rd chip 216 of substrate 210.In the present embodiment, first chip 212, second chip 214 and the 3rd chip 216 are straight lines that are arranged in substrate 210 in fact, for example same listing.The first routing head 130 and the second routing head 140 are to move and routing in same listing.But the invention is not restricted to this, also can be that first chip 212, second chip 214 and the 3rd chip 216 are positioned at in the delegation, and the first routing head 130 and the second routing head 140 are to move and routing on delegation.
Then, shown in step 340, processing unit 110 is to send location signal to the first a routing head 130 and the second routing head 140 respectively, makes the first routing head 130 and the second routing head 140 contraposition first chip 212 and the 3rd chip 216 respectively.
Then, shown in step 350, the first routing head 130 and the second routing head 140 carry out routing to first chip 212 and the 3rd chip 216 respectively simultaneously.
When the space D of judging first chip 212 and second chip 214 in the step 320 when setting spacing, then jump directly to step 350, send framing signal to the first routing head 130 and the second routing head 140 respectively by processing unit 110, after making the first routing head 130 and the second routing head, 140 difference contraposition first chips 212 and second chip 214, the first routing head 130 and the second routing head 140 carry out routing to first chip 212 and second chip 214 respectively simultaneously.
After the first routing head 130 and the second routing head 140 are finished the routing of first chip 212 and second chip 214/ the 3rd chip 216 respectively, be to move and carry out routing toward same row or with following two chips in the delegation respectively, in the present embodiment the first routing head 130 and the second routing head 140 be same list mobile.Basically, the location of the first routing head 130 and the second routing head 140 and the judgement of spacing only need to carry out at the beginning the time, follow-up chip is because all with certain spacing arrangement, and the first routing head 130 and the second routing head 140 only need corresponding mobile same spacing and to carry out routing with next chip contraposition.Behind the routing of finishing the same chip that lists, the first routing head 130 and 140 chips that move on next column or the next line of the second routing head are proceeded routing, till the whole routings of the chip on the substrate 210 are finished.
Yet the technical field under the present invention has knows the knowledgeable usually, and technology of the present invention as can be known is not limited thereto.Wire bonding machine table 100 also can have plural routing head, as long as the routing head can carry out routing simultaneously at same straight line and all belong to scope of the present invention.In addition, the present invention also can be applicable to glutinous brilliant board, as long as the first routing head 130 and the second routing head 140 are replaced as glutinous brilliant device, promptly can stick brilliant operation by the same manner.
Disclosed wire bonding machine table of the above embodiment of the present invention and routing method thereof are to carry out the routing operation at same straight line simultaneously with at least two routing heads simultaneously.Can significantly increase the speed of routing operation not needing to extend under the condition of production line.
In sum, though the present invention discloses as above with a preferred embodiment, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (11)
1. wire bonding machine table in order at least one first chip on the substrate and one second chip are carried out routing simultaneously, is characterized in that this wire bonding machine table comprises:
At least one first routing head and one second routing head;
One driver element is in order to move this first routing head and this second routing head;
One processing unit, in order to output control command to this driver element to control this first routing head and this second routing head; And
One database, this database storage one operational parameter data, this processing unit is to control this first routing head and this second routing head according to this operational parameter data.
2. wire bonding machine table as claimed in claim 1 is characterized in that, this operational parameter data comprises the spacing of chip, the size of chip and the elements of a fix of chip position.
3. wire bonding machine table as claimed in claim 1, it is characterized in that, more comprise a location device, in order to a primary importance and a second place at the place of confirming this first chip and this second chip, this processing unit is according to this primary importance and this second place is controlled this first routing head and this second routing head carries out routing.
4. wire bonding machine table as claimed in claim 3 is characterized in that, this positioner comprises at least one electric coupling assembly.
5. wire bonding machine table as claimed in claim 1 is characterized in that, this first chip and this second chip are straight lines that is arranged in this substrate in fact, and this first routing head and this second routing head are to move and routing along this straight line.
6. the routing method of a wire bonding machine table, it is characterized in that, this wire bonding machine table comprises at least one first routing head and one second routing head, and this wire bonding machine table is in order to carry out routing simultaneously at least one first chip on the substrate and one second chip, and this routing method comprises:
(a) obtain the elements of a fix of this first chip and this second chip position;
(b) whether the spacing of judging this first chip and this second chip sets spacing greater than one; And
(c) when the spacing of this first chip and this second chip was set spacing greater than this, this first routing head and this second routing head carried out routing to this first chip and this second chip respectively simultaneously.
7. routing method as claimed in claim 6, it is characterized in that, this wire bonding machine table more comprises a processing unit, this processing unit is to send a location signal respectively to this first routing head and this second routing head in the step (c), makes this first routing head and this second routing head this first chip of contraposition and this second chip respectively.
8. routing method as claimed in claim 6 is characterized in that, more comprises
(d) when the spacing of this first chip and this second chip is set spacing less than this, this second routing head is away from this first routing head and move to one the 3rd chip top of this substrate.
9. routing method as claimed in claim 8 is characterized in that, more comprises:
(e) this first routing head and this second routing head carry out routing to this first chip and the 3rd chip respectively simultaneously.
10. routing method as claimed in claim 8, it is characterized in that, this wire bonding machine table more comprises a processing unit, this processing unit is to send a location signal respectively to this first routing head and this second routing head in the step (d), makes this first routing head and this second routing head this first chip of contraposition and the 3rd chip respectively.
11. routing method as claimed in claim 8 is characterized in that, this first chip, this second chip and the 3rd chip are straight lines that is arranged in this substrate in fact, and this first routing head and this second routing head are to move and routing along this straight line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101398919A CN100530583C (en) | 2007-07-26 | 2007-07-26 | Wiring machine platform and wiring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101398919A CN100530583C (en) | 2007-07-26 | 2007-07-26 | Wiring machine platform and wiring method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101101885A true CN101101885A (en) | 2008-01-09 |
| CN100530583C CN100530583C (en) | 2009-08-19 |
Family
ID=39036079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101398919A Active CN100530583C (en) | 2007-07-26 | 2007-07-26 | Wiring machine platform and wiring method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100530583C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102339771A (en) * | 2011-09-30 | 2012-02-01 | 中南大学 | Dual-bonding wire head lead bonding device |
| CN102569103A (en) * | 2010-11-08 | 2012-07-11 | 先进自动器材有限公司 | Die bonder incorporating dual-head dispenser |
-
2007
- 2007-07-26 CN CNB2007101398919A patent/CN100530583C/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569103A (en) * | 2010-11-08 | 2012-07-11 | 先进自动器材有限公司 | Die bonder incorporating dual-head dispenser |
| CN102569103B (en) * | 2010-11-08 | 2015-04-08 | 先进自动器材有限公司 | Die bonder incorporating dual-head dispenser |
| CN102339771A (en) * | 2011-09-30 | 2012-02-01 | 中南大学 | Dual-bonding wire head lead bonding device |
| CN102339771B (en) * | 2011-09-30 | 2016-03-23 | 中南大学 | A kind of two bonding wire head wirebonding device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100530583C (en) | 2009-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7617966B2 (en) | Semiconductor device | |
| US7687921B2 (en) | High density memory device manufacturing using isolated step pads | |
| US7981788B2 (en) | Semiconductor device and a manufacturing method of the same | |
| US20130068824A1 (en) | Die Bonder and Bonding Method | |
| US20140078289A1 (en) | Die Bonder and Method of Position Recognition of Die | |
| CN101393878B (en) | Wire bonding system utilizing multiple positioning tables | |
| US20070029367A1 (en) | Semiconductor device | |
| KR20050023972A (en) | Wire bonding method of semiconductor device | |
| WO1999045591A1 (en) | An integrated circuit package having interchip bonding and method therefor | |
| US5816477A (en) | Wire bonding apparatus and method | |
| CN100530583C (en) | Wiring machine platform and wiring method | |
| CN103000550A (en) | Die bonder and bonding method | |
| JP3948430B2 (en) | Manufacturing method of semiconductor integrated circuit | |
| JP6367672B2 (en) | Semiconductor or electronic component mounting apparatus and semiconductor or electronic component mounting method | |
| US11594503B2 (en) | Wire bonding method for semiconductor package | |
| US6572001B2 (en) | Bonding system | |
| TW200810051A (en) | Wire-bonding apparatus and wire-bonding method thereof | |
| JPH11295032A (en) | Method for recognizing work position | |
| KR100629272B1 (en) | wire bonding method | |
| JP2907189B2 (en) | Automatic layout device | |
| KR20060094388A (en) | Pattern recognition method for wire bonding of multi-chip package | |
| KR100478205B1 (en) | method of reject die fonder marking | |
| CN110008524A (en) | With the method and large capacity chip of single type chip extension large capacity chip | |
| JP2002231876A (en) | Semiconductor device | |
| KR19990027833A (en) | Semiconductor chip manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |