NO984135L - FremgangsmÕte ved fremstilling av et metallag pÕ en overflate av en gjenstand for skjerming mot elektromagnetisk strÕling - Google Patents

FremgangsmÕte ved fremstilling av et metallag pÕ en overflate av en gjenstand for skjerming mot elektromagnetisk strÕling

Info

Publication number
NO984135L
NO984135L NO984135A NO984135A NO984135L NO 984135 L NO984135 L NO 984135L NO 984135 A NO984135 A NO 984135A NO 984135 A NO984135 A NO 984135A NO 984135 L NO984135 L NO 984135L
Authority
NO
Norway
Prior art keywords
producing
metal layer
electromagnetic radiation
protection against
against electromagnetic
Prior art date
Application number
NO984135A
Other languages
English (en)
Norwegian (no)
Other versions
NO984135D0 (no
Inventor
Lars Eriksson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SE9600967A external-priority patent/SE9600967D0/xx
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of NO984135L publication Critical patent/NO984135L/no
Publication of NO984135D0 publication Critical patent/NO984135D0/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0092—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive pigments, e.g. paint, ink, tampon printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Printing Methods (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Decoration By Transfer Pictures (AREA)
NO984135A 1996-03-13 1998-09-08 Fremgangsmåte ved fremstilling av et metallag på en overflate av en gjenstand for skjerming mot elektromagnetisk stråling NO984135D0 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9600967A SE9600967D0 (sv) 1995-12-07 1996-03-13 Sätt att åstadkomma ett metalliskt skikt på en detaljs yta för avskärmning mot elektromagnetisk strålning
PCT/SE1997/000372 WO1997034459A2 (fr) 1996-03-13 1997-03-04 Procede de formation d'une couche metallique a la surface d'un element destinee a menager un blindage contre les rayonnements electromagnetiques

Publications (2)

Publication Number Publication Date
NO984135L true NO984135L (no) 1998-09-08
NO984135D0 NO984135D0 (no) 1998-09-08

Family

ID=20401776

Family Applications (1)

Application Number Title Priority Date Filing Date
NO984135A NO984135D0 (no) 1996-03-13 1998-09-08 Fremgangsmåte ved fremstilling av et metallag på en overflate av en gjenstand for skjerming mot elektromagnetisk stråling

Country Status (13)

Country Link
US (1) US6200630B1 (fr)
EP (1) EP0886996B1 (fr)
JP (1) JP4166828B2 (fr)
CN (1) CN1108736C (fr)
AU (1) AU710484B2 (fr)
CA (1) CA2248127A1 (fr)
DE (1) DE69733342D1 (fr)
HU (1) HUP9901571A3 (fr)
NO (1) NO984135D0 (fr)
NZ (1) NZ331662A (fr)
PL (1) PL182631B1 (fr)
RU (1) RU2194376C2 (fr)
WO (1) WO1997034459A2 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0886996B1 (fr) 1996-03-13 2005-05-25 Telefonaktiebolaget LM Ericsson (publ) Procede de formation d'une couche metallique a la surface d'un element destinee a menager un blindage contre les rayonnements electromagnetiques
DE69838762T2 (de) * 1997-06-24 2008-04-30 Bridgestone Corp. Elektromagnetische Wellen abschirmende lichtdurchlässige Platte
SE9703410D0 (sv) * 1997-09-22 1997-09-22 Ericsson Telefon Ab L M Sätt att överföra en bild på oregelbundna ytor
SE518428C2 (sv) * 1998-04-27 2002-10-08 Ericsson Telefon Ab L M Anpassat ledande skikt
SE518429C2 (sv) * 1998-12-21 2002-10-08 Ericsson Telefon Ab L M Tampodyna samt förfarande vid tampotryckning
SE521347C2 (sv) * 1999-01-22 2003-10-21 Ericsson Telefon Ab L M Förfarande vid påläggning av en bild på en kliché samt en kliché
CA2401168A1 (fr) 2000-02-28 2001-09-07 Amesbury Group, Inc. Procede et dispositif d'antiparasitage
EP1266549A2 (fr) * 2000-02-28 2002-12-18 Amesbury Group, Inc. Procede et dispositif d'antiparasitage
SE517303C2 (sv) * 2000-03-14 2002-05-21 Ericsson Telefon Ab L M Förfarande för att trycka en elektriskt ledande beläggning på en elektronisk enhet
SE0001025D0 (sv) * 2000-03-21 2000-03-21 Lars Eriksson Metod att tampongtrycka på en detalj
NO20014376L (no) * 2001-09-07 2003-03-10 Pe Dev As Fremgangsmåte og anordning for skjerming mot elektromagnetiske felter
US8063781B2 (en) * 2005-07-06 2011-11-22 First Data Corporation Secure RFID packaging
DE102005034166A1 (de) * 2005-07-21 2007-02-01 Osram Opto Semiconductors Gmbh Gehäuse für ein elektromagnetische Strahlung emittierendes optoelektronisches Bauelement, elektromagnetische Strahlung emittierendes Bauelement und Verfahren zum Herstellen eines Gehäuses oder eines Bauelements
US7743702B2 (en) * 2006-07-18 2010-06-29 Max Levy Autograph, Inc. Method for applying electronic circuits to curved surfaces
CN101547576A (zh) * 2008-03-25 2009-09-30 深圳富泰宏精密工业有限公司 壳体的制造方法
TWI406715B (zh) * 2008-04-18 2013-09-01 Fih Hong Kong Ltd 殼體之製造方法
EP4037758A1 (fr) 2019-10-01 2022-08-10 Uab "Technano" Procédé de protection d'objets biologiques contre l'influence négative d'un rayonnement électromagnétique technogène

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3594490A (en) 1970-07-17 1971-07-20 Ibm Electronic grounding system
US4670347A (en) * 1986-03-12 1987-06-02 Topflight Corp. RFI/EMI shielding apparatus
US5047260A (en) * 1987-02-06 1991-09-10 Key-Tech, Inc. Method for producing a shielded plastic enclosure to house electronic equipment
US4890199A (en) * 1988-11-04 1989-12-26 Motorola, Inc. Miniature shield with opposing cantilever spring fingers
RU2082237C1 (ru) * 1990-03-19 1997-06-20 Асахи Касеи Когио Кабусики Кайся Композиция
US5543333A (en) * 1993-09-30 1996-08-06 Siemens Solar Gmbh Method for manufacturing a solar cell having combined metallization
EP0886996B1 (fr) 1996-03-13 2005-05-25 Telefonaktiebolaget LM Ericsson (publ) Procede de formation d'une couche metallique a la surface d'un element destinee a menager un blindage contre les rayonnements electromagnetiques

Also Published As

Publication number Publication date
DE69733342D1 (de) 2005-06-30
EP0886996B1 (fr) 2005-05-25
EP0886996A2 (fr) 1998-12-30
JP2000510650A (ja) 2000-08-15
PL328805A1 (en) 1999-02-15
WO1997034459A3 (fr) 1997-12-04
PL182631B1 (pl) 2002-02-28
JP4166828B2 (ja) 2008-10-15
AU2049297A (en) 1997-10-01
CN1218605A (zh) 1999-06-02
NO984135D0 (no) 1998-09-08
WO1997034459A2 (fr) 1997-09-18
CA2248127A1 (fr) 1997-09-18
NZ331662A (en) 2000-04-28
RU2194376C2 (ru) 2002-12-10
HUP9901571A1 (hu) 1999-08-30
CN1108736C (zh) 2003-05-14
AU710484B2 (en) 1999-09-23
US6200630B1 (en) 2001-03-13
HUP9901571A3 (en) 1999-11-29

Similar Documents

Publication Publication Date Title
NO984135L (no) FremgangsmÕte ved fremstilling av et metallag pÕ en overflate av en gjenstand for skjerming mot elektromagnetisk strÕling
US5120381B1 (en) Method of forming a protective coating on metallic pipe
HUP0001688A3 (en) Method for providing a metal surface with a vitreous layer
NO934862D0 (no) Fremgangsmaate for aa produsere et termisk barrierebelegg paa et met allsubstrat
DE3666594D1 (en) Method of forming a composite layer by laser irradiation on an aluminium alloy substrate surface
BR9612520A (pt) Camada para cobrir e proteger um substrato em forma de imagem processo para proteção de um substrato em forma de imagem e compósito
GB2321256B (en) Three-dimensional masking method for control of optical coating thickness
GB2245596B (en) A method of forming a metal wiring layer
BR9607325A (pt) Processo de formação de um revestimento protetor sobre uma superficie metálica
KR970703205A (ko) 희생 표면 피복에 의해 열 차단 피복재를 보호하기 위한 방법 및 복합재(method and composite for protection of thermal barrier coating by a sacrificial surface coating)
BR9501591A (pt) Método de formação de um revestimento protetor de alto brilho em imagens
GB2329600B (en) Method of forming protective film of coating surface of automobiles
TR199600891A2 (tr) Bakirsiz bir yansitici metal tabaka üzerinde koruyucu bir tabaka olusturma metodu.
EP1025912A4 (fr) Procede de formation d'un film protecteur metallique a deux couches
GB9718654D0 (en) A method of forming a layer
GB2286051B (en) Apparatus for discontinuously determining the thickness of layers on a metal melt
NO973829D0 (no) Fremgangsmåte ved fremstilling av et beskyttende belegg på flaten av glass- eller keramiske varer
NO944446D0 (no) Fremgangsmåte ved fremstilling av metall
BR9701172A (pt) Revestimento de superfície metálica objeto metálico e processo de aplicação de um revestimento
SE9604090D0 (sv) Sätt att åstadkomma ett matalliskt skikt på en på detaljs yta för avskärmning mot elektromagnetisk strålning
GB9404738D0 (en) A computer-aided method of designing a carry-lookahead adder
SE9504384D0 (sv) Sätt att åstadkomma ett metalliskt skikt på en detaljs yta för avskärmning mot elektromagnetisk strålning
SE9600967D0 (sv) Sätt att åstadkomma ett metalliskt skikt på en detaljs yta för avskärmning mot elektromagnetisk strålning
AU1171899A (en) Sensor actuated hood lock and method for implementing such lock
IT9067362A0 (it) Procedimento per la realizzazione su metalli di un rivestimento protettivo superficiale colorato

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application