NO984135D0 - Fremgangsmåte ved fremstilling av et metallag på en overflate av en gjenstand for skjerming mot elektromagnetisk stråling - Google Patents
Fremgangsmåte ved fremstilling av et metallag på en overflate av en gjenstand for skjerming mot elektromagnetisk strålingInfo
- Publication number
- NO984135D0 NO984135D0 NO984135A NO984135A NO984135D0 NO 984135 D0 NO984135 D0 NO 984135D0 NO 984135 A NO984135 A NO 984135A NO 984135 A NO984135 A NO 984135A NO 984135 D0 NO984135 D0 NO 984135D0
- Authority
- NO
- Norway
- Prior art keywords
- shielding
- producing
- metal layer
- electromagnetic radiation
- electromagnetic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0092—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive pigments, e.g. paint, ink, tampon printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Printing Methods (AREA)
- Decoration By Transfer Pictures (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9600967A SE9600967D0 (sv) | 1995-12-07 | 1996-03-13 | Sätt att åstadkomma ett metalliskt skikt på en detaljs yta för avskärmning mot elektromagnetisk strålning |
PCT/SE1997/000372 WO1997034459A2 (en) | 1996-03-13 | 1997-03-04 | Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation |
Publications (2)
Publication Number | Publication Date |
---|---|
NO984135L NO984135L (no) | 1998-09-08 |
NO984135D0 true NO984135D0 (no) | 1998-09-08 |
Family
ID=20401776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO984135A NO984135D0 (no) | 1996-03-13 | 1998-09-08 | Fremgangsmåte ved fremstilling av et metallag på en overflate av en gjenstand for skjerming mot elektromagnetisk stråling |
Country Status (13)
Country | Link |
---|---|
US (1) | US6200630B1 (no) |
EP (1) | EP0886996B1 (no) |
JP (1) | JP4166828B2 (no) |
CN (1) | CN1108736C (no) |
AU (1) | AU710484B2 (no) |
CA (1) | CA2248127A1 (no) |
DE (1) | DE69733342D1 (no) |
HU (1) | HUP9901571A3 (no) |
NO (1) | NO984135D0 (no) |
NZ (1) | NZ331662A (no) |
PL (1) | PL182631B1 (no) |
RU (1) | RU2194376C2 (no) |
WO (1) | WO1997034459A2 (no) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
HUP9901571A3 (en) | 1996-03-13 | 1999-11-29 | Ericsson Telefon Ab L M | Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation |
EP1028611B1 (en) * | 1997-06-24 | 2004-06-09 | Bridgestone Corporation | Electromagnetic wave shielding and light transmitting plate |
SE9703410D0 (sv) * | 1997-09-22 | 1997-09-22 | Ericsson Telefon Ab L M | Sätt att överföra en bild på oregelbundna ytor |
SE518428C2 (sv) * | 1998-04-27 | 2002-10-08 | Ericsson Telefon Ab L M | Anpassat ledande skikt |
SE518429C2 (sv) * | 1998-12-21 | 2002-10-08 | Ericsson Telefon Ab L M | Tampodyna samt förfarande vid tampotryckning |
SE521347C2 (sv) * | 1999-01-22 | 2003-10-21 | Ericsson Telefon Ab L M | Förfarande vid påläggning av en bild på en kliché samt en kliché |
JP2004500714A (ja) | 2000-02-28 | 2004-01-08 | アメスベリー グループ, インコーポレイテッド | Emiシールドのための方法および装置 |
KR20020086586A (ko) * | 2000-02-28 | 2002-11-18 | 아메스 베리 그룹, 인크 | 이엠아이 차폐부품 및 그 제조방법 |
SE517303C2 (sv) * | 2000-03-14 | 2002-05-21 | Ericsson Telefon Ab L M | Förfarande för att trycka en elektriskt ledande beläggning på en elektronisk enhet |
SE0001025D0 (sv) * | 2000-03-21 | 2000-03-21 | Lars Eriksson | Metod att tampongtrycka på en detalj |
NO20014376L (no) * | 2001-09-07 | 2003-03-10 | Pe Dev As | Fremgangsmåte og anordning for skjerming mot elektromagnetiske felter |
CA2614335A1 (en) * | 2005-07-06 | 2007-01-11 | First Data Corporation | Secure rfid packaging |
DE102005034166A1 (de) * | 2005-07-21 | 2007-02-01 | Osram Opto Semiconductors Gmbh | Gehäuse für ein elektromagnetische Strahlung emittierendes optoelektronisches Bauelement, elektromagnetische Strahlung emittierendes Bauelement und Verfahren zum Herstellen eines Gehäuses oder eines Bauelements |
US7743702B2 (en) * | 2006-07-18 | 2010-06-29 | Max Levy Autograph, Inc. | Method for applying electronic circuits to curved surfaces |
CN101547576A (zh) * | 2008-03-25 | 2009-09-30 | 深圳富泰宏精密工业有限公司 | 壳体的制造方法 |
TWI406715B (zh) * | 2008-04-18 | 2013-09-01 | Fih Hong Kong Ltd | 殼體之製造方法 |
US20220401724A1 (en) | 2019-10-01 | 2022-12-22 | Margarita SEROVA | Method for protecting biological objects from the negative influence of technogenic electromagnetic radiation |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3594490A (en) | 1970-07-17 | 1971-07-20 | Ibm | Electronic grounding system |
US4670347A (en) * | 1986-03-12 | 1987-06-02 | Topflight Corp. | RFI/EMI shielding apparatus |
US5047260A (en) * | 1987-02-06 | 1991-09-10 | Key-Tech, Inc. | Method for producing a shielded plastic enclosure to house electronic equipment |
US4890199A (en) * | 1988-11-04 | 1989-12-26 | Motorola, Inc. | Miniature shield with opposing cantilever spring fingers |
KR950007085B1 (ko) * | 1990-03-19 | 1995-06-30 | 아사히가세이고오교 가부시끼가이샤 | 고온 소성용 페이스트(paste) |
US5543333A (en) * | 1993-09-30 | 1996-08-06 | Siemens Solar Gmbh | Method for manufacturing a solar cell having combined metallization |
HUP9901571A3 (en) | 1996-03-13 | 1999-11-29 | Ericsson Telefon Ab L M | Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation |
-
1997
- 1997-03-04 HU HU9901571A patent/HUP9901571A3/hu unknown
- 1997-03-04 JP JP53250997A patent/JP4166828B2/ja not_active Expired - Lifetime
- 1997-03-04 WO PCT/SE1997/000372 patent/WO1997034459A2/en active IP Right Grant
- 1997-03-04 CN CN97194487.3A patent/CN1108736C/zh not_active Expired - Fee Related
- 1997-03-04 PL PL97328805A patent/PL182631B1/pl unknown
- 1997-03-04 US US09/142,798 patent/US6200630B1/en not_active Expired - Lifetime
- 1997-03-04 RU RU98118570/09A patent/RU2194376C2/ru not_active IP Right Cessation
- 1997-03-04 CA CA002248127A patent/CA2248127A1/en not_active Abandoned
- 1997-03-04 DE DE69733342T patent/DE69733342D1/de not_active Expired - Lifetime
- 1997-03-04 NZ NZ331662A patent/NZ331662A/xx not_active IP Right Cessation
- 1997-03-04 EP EP97908623A patent/EP0886996B1/en not_active Expired - Lifetime
- 1997-03-04 AU AU20492/97A patent/AU710484B2/en not_active Ceased
-
1998
- 1998-09-08 NO NO984135A patent/NO984135D0/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO1997034459A2 (en) | 1997-09-18 |
DE69733342D1 (de) | 2005-06-30 |
AU710484B2 (en) | 1999-09-23 |
US6200630B1 (en) | 2001-03-13 |
CN1108736C (zh) | 2003-05-14 |
RU2194376C2 (ru) | 2002-12-10 |
WO1997034459A3 (en) | 1997-12-04 |
CA2248127A1 (en) | 1997-09-18 |
NO984135L (no) | 1998-09-08 |
CN1218605A (zh) | 1999-06-02 |
EP0886996B1 (en) | 2005-05-25 |
HUP9901571A1 (hu) | 1999-08-30 |
NZ331662A (en) | 2000-04-28 |
PL328805A1 (en) | 1999-02-15 |
AU2049297A (en) | 1997-10-01 |
EP0886996A2 (en) | 1998-12-30 |
HUP9901571A3 (en) | 1999-11-29 |
PL182631B1 (pl) | 2002-02-28 |
JP4166828B2 (ja) | 2008-10-15 |
JP2000510650A (ja) | 2000-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |