NO981064L - Etynyl substituerte aromatiske forbindelser, samt polymere derav og fremgangsmÕte for Õ fremstille og anvende forbindelsene - Google Patents

Etynyl substituerte aromatiske forbindelser, samt polymere derav og fremgangsmÕte for Õ fremstille og anvende forbindelsene

Info

Publication number
NO981064L
NO981064L NO981064A NO981064A NO981064L NO 981064 L NO981064 L NO 981064L NO 981064 A NO981064 A NO 981064A NO 981064 A NO981064 A NO 981064A NO 981064 L NO981064 L NO 981064L
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NO
Norway
Prior art keywords
compounds
polymers
substituted aromatic
preparing
group
Prior art date
Application number
NO981064A
Other languages
English (en)
Other versions
NO981064D0 (no
Inventor
David A Babb
Jr Dennis W Smith
Steven J Martin
James P Godschalx
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of NO981064D0 publication Critical patent/NO981064D0/no
Publication of NO981064L publication Critical patent/NO981064L/no

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C13/00—Cyclic hydrocarbons containing rings other than, or in addition to, six-membered aromatic rings
    • C07C13/28—Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof
    • C07C13/32—Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with condensed rings
    • C07C13/54—Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with condensed rings with three condensed rings
    • C07C13/547—Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with condensed rings with three condensed rings at least one ring not being six-membered, the other rings being at the most six-membered
    • C07C13/567—Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with condensed rings with three condensed rings at least one ring not being six-membered, the other rings being at the most six-membered with a fluorene or hydrogenated fluorene ring system
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C15/00—Cyclic hydrocarbons containing only six-membered aromatic rings as cyclic parts
    • C07C15/40—Cyclic hydrocarbons containing only six-membered aromatic rings as cyclic parts substituted by unsaturated carbon radicals
    • C07C15/50—Cyclic hydrocarbons containing only six-membered aromatic rings as cyclic parts substituted by unsaturated carbon radicals polycyclic non-condensed
    • C07C15/54—Cyclic hydrocarbons containing only six-membered aromatic rings as cyclic parts substituted by unsaturated carbon radicals polycyclic non-condensed containing a group with formula
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C17/00—Preparation of halogenated hydrocarbons
    • C07C17/26—Preparation of halogenated hydrocarbons by reactions involving an increase in the number of carbon atoms in the skeleton
    • C07C17/263—Preparation of halogenated hydrocarbons by reactions involving an increase in the number of carbon atoms in the skeleton by condensation reactions
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C22/00—Cyclic compounds containing halogen atoms bound to an acyclic carbon atom
    • C07C22/02—Cyclic compounds containing halogen atoms bound to an acyclic carbon atom having unsaturation in the rings
    • C07C22/04—Cyclic compounds containing halogen atoms bound to an acyclic carbon atom having unsaturation in the rings containing six-membered aromatic rings
    • C07C22/08—Cyclic compounds containing halogen atoms bound to an acyclic carbon atom having unsaturation in the rings containing six-membered aromatic rings containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C321/00—Thiols, sulfides, hydropolysulfides or polysulfides
    • C07C321/24—Thiols, sulfides, hydropolysulfides, or polysulfides having thio groups bound to carbon atoms of six-membered aromatic rings
    • C07C321/28—Sulfides, hydropolysulfides, or polysulfides having thio groups bound to carbon atoms of six-membered aromatic rings
    • C07C321/30—Sulfides having the sulfur atom of at least one thio group bound to two carbon atoms of six-membered aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00—Ethers; Compounds having groups, groups or groups
    • C07C43/02—Ethers
    • C07C43/257—Ethers having an ether-oxygen atom bound to carbon atoms both belonging to six-membered aromatic rings
    • C07C43/285—Ethers having an ether-oxygen atom bound to carbon atoms both belonging to six-membered aromatic rings having unsaturation outside the six-membered aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/28—Phosphorus compounds with one or more P—C bonds
    • C07F9/50—Organo-phosphines
    • C07F9/53—Organo-phosphine oxides; Organo-phosphine thioxides
    • C07F9/5325—Aromatic phosphine oxides or thioxides (P-C aromatic linkage)
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2603/00—Systems containing at least three condensed rings
    • C07C2603/02—Ortho- or ortho- and peri-condensed systems
    • C07C2603/04—Ortho- or ortho- and peri-condensed systems containing three rings
    • C07C2603/06—Ortho- or ortho- and peri-condensed systems containing three rings containing at least one ring with less than six ring members
    • C07C2603/10—Ortho- or ortho- and peri-condensed systems containing three rings containing at least one ring with less than six ring members containing five-membered rings
    • C07C2603/12—Ortho- or ortho- and peri-condensed systems containing three rings containing at least one ring with less than six ring members containing five-membered rings only one five-membered ring
    • C07C2603/18—Fluorenes; Hydrogenated fluorenes

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Polyethers (AREA)
  • Paints Or Removers (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

Forbindelser av etynylaromatiske forbindelser med strukturen (I) (R-C^C-HAr-L-f-Ar-t-C^C-RU, (I), hvor hver Ar er en aromatisk gruppe eller en inert substituert aromatisk gruppe; hver R er uavhengig hydrogen, en alkyl-, aryl- eller inert substituert alkyl- eller arylgruppe; L er en kovalent binding eller en gruppe som binder en Ar til minst en annen Ar; n og m er hele tall på minst 2; og q er et helt tall på minst 1, danner polymerer som har høy termisk stabilitet. Monomerene er egnet for belegging av mange forskjellige substanser så som dielektriske belegg hvor høy termisk resis- tans er ønskelig, innbefattende elektroniske komponenter så som datamaskin- brikker.
NO981064A 1995-09-12 1998-03-11 Etynyl substituerte aromatiske forbindelser, samt polymere derav og fremgangsmÕte for Õ fremstille og anvende forbindelsene NO981064L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US362995P 1995-09-12 1995-09-12
PCT/US1996/014427 WO1997010193A1 (en) 1995-09-12 1996-09-11 Ethynyl substituted aromatic compounds, synthesis, polymers and uses thereof

Publications (2)

Publication Number Publication Date
NO981064D0 NO981064D0 (no) 1998-03-11
NO981064L true NO981064L (no) 1998-05-12

Family

ID=21706790

Family Applications (1)

Application Number Title Priority Date Filing Date
NO981064A NO981064L (no) 1995-09-12 1998-03-11 Etynyl substituerte aromatiske forbindelser, samt polymere derav og fremgangsmÕte for Õ fremstille og anvende forbindelsene

Country Status (11)

Country Link
US (1) US6121495A (no)
EP (1) EP0854849B1 (no)
JP (1) JP4260882B2 (no)
KR (1) KR100469551B1 (no)
CN (1) CN1103329C (no)
BR (1) BR9610547A (no)
CA (1) CA2231726A1 (no)
DE (1) DE69616580T2 (no)
NO (1) NO981064L (no)
TW (1) TW438823B (no)
WO (1) WO1997010193A1 (no)

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100323840B1 (ko) * 1997-05-30 2002-02-07 우노 마사야스 (메타)아크릴레이트 유도체의 제조법
US6060170A (en) * 1998-02-25 2000-05-09 Air Products And Chemicals, Inc. Functional groups for thermal crosslinking of polymeric systems
US6660875B1 (en) 1998-06-09 2003-12-09 Ppt Technologies, Llc Ion exchange purification of dielectric condensate precursor fluids and silicate esters such as tetraethylorthosilicate (TEOS)
US6333141B1 (en) 1998-07-08 2001-12-25 International Business Machines Corporation Process for manufacture of integrated circuit device using inorganic/organic matrix comprising polymers of three dimensional architecture
US6143643A (en) * 1998-07-08 2000-11-07 International Business Machines Corporation Process for manufacture of integrated circuit device using organosilicate insulative matrices
US6093636A (en) * 1998-07-08 2000-07-25 International Business Machines Corporation Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets
US6472335B1 (en) * 1998-10-19 2002-10-29 Taiwan Semiconductor Manufacturing Company Methods of adhesion promoter between low-K layer and underlying insulating layer
ATE323132T1 (de) 1998-11-24 2006-04-15 Dow Global Technologies Inc Eine zusammensetzung enthaltend einen vernetzbaren matrixpercursor und eine porenstruktur bildendes material und eine daraus hergestellte poröse matrix
US6399666B1 (en) 1999-01-27 2002-06-04 International Business Machines Corporation Insulative matrix material
US6265753B1 (en) 1999-06-11 2001-07-24 International Business Machines Corporation Interconnect dielectric compositions, preparation thereof, and integrated circuit devices fabricated therewith
US6493208B1 (en) * 1999-07-27 2002-12-10 Eikos, Inc. Triphenyl phosphine oxide polymer capacitors
US6359091B1 (en) * 1999-11-22 2002-03-19 The Dow Chemical Company Polyarylene compositions with enhanced modulus profiles
DE10033111A1 (de) * 2000-07-07 2002-01-24 Siemens Ag Copolymere halbleitende Materialien auf der Basis von Oligo-Phenylen
CN1252132C (zh) * 2000-07-19 2006-04-19 陶氏环球技术公司 含涂布增强剂的旋布介电层组合物
JP4697361B2 (ja) * 2000-07-24 2011-06-08 Ｊｓｒ株式会社 膜形成用組成物および絶縁膜形成用材料
JP5350571B2 (ja) 2000-08-21 2013-11-27 ダウ グローバル テクノロジーズ エルエルシー マイクロ電子デバイス製造に使用する有機ポリマー絶縁膜用ハードマスクとしての有機シリケート樹脂
US6593155B2 (en) 2000-12-28 2003-07-15 Dow Global Technologies Inc. Method for determination of cure and oxidation of spin-on dielectric polymers
DE10131669A1 (de) * 2001-06-29 2003-01-16 Infineon Technologies Ag Herstellung von organischen Halbleitern mit hoher Ladungsträgermobilität durch pi-konjugierte Vernetzungsgruppen
KR100821889B1 (ko) * 2001-09-05 2008-04-16 학교법인 포항공과대학교 신규 형광물질 및 그의 제조방법
DE10147927B8 (de) 2001-09-28 2004-07-08 Infineon Technologies Ag Poly-o-hydroxyamide, Polybenzoxazole, elektronisches Bauteil sowie Verfahren zu ihrer Herstellung
DE10155802B4 (de) 2001-11-14 2006-03-02 Infineon Technologies Ag Halbleiterchip mit FIB-Schutz
US7307119B2 (en) * 2002-08-01 2007-12-11 Electronics And Telecommunications Research Institute Thin film material using pentaerythritol acrylate for encapsulation of organic or polymeric light emitting device, and encapsulation method for LED using the same
US7635741B2 (en) 2002-02-15 2009-12-22 Dow Global Technologies Inc. Multifunctional monomers and their use in making cross-linked polymers and porous films
KR100491893B1 (ko) * 2002-02-27 2005-05-27 이석현 광미세가공 및 다기능 센서용 감광성 고분자 및 이를포함하는 감광성 수지 조성물
DE10228770A1 (de) 2002-06-27 2004-02-12 Infineon Technologies Ag Dielektrikum mit Sperrwirkung gegen Kupferdiffusion
DE10238024B4 (de) * 2002-08-20 2007-03-08 Infineon Technologies Ag Verfahren zur Integration von Luft als Dielektrikum in Halbleitervorrichtungen
US7368483B2 (en) * 2002-12-31 2008-05-06 International Business Machines Corporation Porous composition of matter, and method of making same
TW200505966A (en) 2003-04-02 2005-02-16 Dow Global Technologies Inc Organosilicate resin formulation for use in microelectronic devices
US20040253442A1 (en) * 2003-06-11 2004-12-16 Ervin Mubarekyan Method of forming a nanoporous film and compositions useful in such methods
JP4794436B2 (ja) 2004-04-28 2011-10-19 ケンブリッジユニバーシティテクニカルサービスリミテッド 化合物の合成方法および合成反応触媒
CN100376534C (zh) * 2004-12-23 2008-03-26 吉林大学 含侧基苯乙炔的双官能团单体的制备及其应用
KR101139055B1 (ko) * 2005-11-25 2012-04-30 삼성전자주식회사 신규한 방향족 엔다이인 유도체, 이를 이용한 유기 반도체및 전자소자
US7534899B2 (en) 2005-11-25 2009-05-19 Smasung Electronics Co., Ltd. Aromatic enediyne derivatives, organic semiconductor thin films using the same and manufacturing methods thereof, and electronic devices incorporating such films
US7811499B2 (en) * 2006-06-26 2010-10-12 International Business Machines Corporation Method for high density data storage and read-back
US8017296B2 (en) * 2007-05-22 2011-09-13 Az Electronic Materials Usa Corp. Antireflective coating composition comprising fused aromatic rings
KR100928055B1 (ko) * 2007-12-24 2009-11-23 한국과학기술원 프로피오릭산 유도체로부터 탈 이산화탄소 반응을 통한아릴알킨 화합물 및 그의 제조 방법
JP5461037B2 (ja) * 2008-03-21 2014-04-02 大阪瓦斯株式会社 臭素含有フルオレン化合物の製造方法
US7989144B2 (en) * 2008-04-01 2011-08-02 Az Electronic Materials Usa Corp Antireflective coating composition
US7932018B2 (en) * 2008-05-06 2011-04-26 Az Electronic Materials Usa Corp. Antireflective coating composition
JP5270758B2 (ja) * 2008-08-12 2013-08-21 エア プロダクツ アンド ケミカルズ インコーポレイテッド パー（フェニルエチニル）アレーン誘導体を含有するポリマー組成物
US20100119979A1 (en) * 2008-11-13 2010-05-13 Rahman M Dalil Antireflective Coating Composition Comprising Fused Aromatic Rings
US20100119980A1 (en) * 2008-11-13 2010-05-13 Rahman M Dalil Antireflective Coating Composition Comprising Fused Aromatic Rings
US20100316949A1 (en) * 2009-06-10 2010-12-16 Rahman M Dalil Spin On Organic Antireflective Coating Composition Comprising Polymer with Fused Aromatic Rings
WO2011076652A1 (en) 2009-12-23 2011-06-30 Solvay Solexis S.P.A. Curable composition
US8486609B2 (en) * 2009-12-23 2013-07-16 Az Electronic Materials Usa Corp. Antireflective coating composition and process thereof
TWI419290B (zh) * 2010-10-29 2013-12-11 Advanced Semiconductor Eng 四方扁平無引腳封裝及其製作方法
KR101616868B1 (ko) 2011-11-18 2016-04-29 델스퍼 엘피 유리전이온도가 높은 폴리머를 위한 가교 화합물
US8853342B2 (en) 2012-09-24 2014-10-07 Ticona Llc Crosslinkable liquid crystalline polymer
US9145519B2 (en) 2012-09-24 2015-09-29 Ticona Llc Crosslinkable aromatic polyester
US8822628B2 (en) 2012-09-24 2014-09-02 Ticona Llc Crosslinkable liquid crystalline polymer
US9145469B2 (en) 2012-09-27 2015-09-29 Ticona Llc Aromatic polyester containing a biphenyl chain disruptor
US9269623B2 (en) 2012-10-25 2016-02-23 Rohm And Haas Electronic Materials Llc Ephemeral bonding
US9273215B2 (en) 2012-10-30 2016-03-01 Rohm And Haas Electronic Materials Llc Adhesion promoter
KR102222665B1 (ko) * 2013-06-24 2021-03-05 제이에스알 가부시끼가이샤 막 형성용 조성물, 레지스트 하층막 및 그의 형성 방법, 패턴 형성 방법 및 화합물
US9315696B2 (en) 2013-10-31 2016-04-19 Dow Global Technologies Llc Ephemeral bonding
US20150147463A1 (en) 2013-11-25 2015-05-28 Rohm And Haas Electronic Materials Llc Dielectric materials
US9153357B1 (en) 2014-03-27 2015-10-06 Rohm And Haas Electronic Materials Llc Adhesion promoter
WO2016003588A1 (en) 2014-07-01 2016-01-07 Ticona Llc Laser activatable polymer composition
US9868820B2 (en) 2014-08-29 2018-01-16 Rohm And Haas Electronic Materials Llc Polyarylene materials
US9481810B2 (en) 2014-12-15 2016-11-01 Rohm And Haas Electronic Materials Llc Silylated polyarylenes
US9644118B2 (en) 2015-03-03 2017-05-09 Dow Global Technologies Llc Method of releasably attaching a semiconductor substrate to a carrier
US9752051B2 (en) 2015-04-06 2017-09-05 Rohm And Haas Electronic Materials Llc Polyarylene polymers
US20170009006A1 (en) 2015-07-06 2017-01-12 Rohm And Haas Electronic Materials Llc Polyarylene materials
US10790146B2 (en) 2016-12-05 2020-09-29 Rohm And Haas Electronic Materials Llc Aromatic resins for underlayers
US10894848B2 (en) 2016-12-14 2021-01-19 Rohm And Haas Electronic Materials Llc Polyarylene resins
US20180162967A1 (en) 2016-12-14 2018-06-14 Rohm And Haas Electronic Materials Llc Polyarylene resin compositions
US20180162992A1 (en) 2016-12-14 2018-06-14 Rohm And Haas Electronic Materials Llc Polyarylene compositions and methods
US20180171069A1 (en) 2016-12-19 2018-06-21 Rohm And Haas Electronic Materials Llc Polyarylene resins
US11404644B2 (en) * 2016-12-22 2022-08-02 Guangzhou Chinaray Optoelectronic Materials Ltd. Organic functional compounds, mixtures, formulations, organic functional thin films and preparation methods therefor and organic electronic devices
KR102113659B1 (ko) * 2017-11-28 2020-05-21 삼성에스디아이 주식회사 하드마스크 조성물 및 패턴 형성 방법
TWI759573B (zh) 2018-01-15 2022-04-01 美商羅門哈斯電子材料有限公司 聲波感測器及感測氣相分析物之方法
EP3867219A4 (en) * 2018-10-19 2022-07-06 Mitsubishi Gas Chemical Company, Inc. POLYCYCLIC COMPOUNDS
US12099300B2 (en) 2018-11-02 2024-09-24 Rohm And Haas Electronic Materials Llc Aromatic underlayer
US11746184B2 (en) 2019-11-19 2023-09-05 Rohm And Haas Electronic Materials Llc Polyimide-polyarylene polymers
US11940732B2 (en) 2020-05-02 2024-03-26 Rohm And Haas Electronic Materials Llc Coating compositions and methods of forming electronic devices
US11817316B2 (en) 2020-05-02 2023-11-14 Rohm And Haas Electronic Materials Llc Coating compositions and methods of forming electronic devices
JP7541939B2 (ja) 2021-02-15 2024-08-29 信越化学工業株式会社 有機膜形成用材料、半導体装置製造用基板、有機膜の形成方法、パターン形成方法、及び有機膜形成用化合物
EP4317339A1 (en) 2021-03-30 2024-02-07 Nissan Chemical Corporation Adhesive composition, laminate, method for manufacturing laminate, and method for manufacturing processed substrate
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CN117157738A (zh) 2021-03-31 2023-12-01 日产化学株式会社 层叠体、剥离剂组合物以及经加工的半导体基板的制造方法
US20240213072A1 (en) 2021-03-31 2024-06-27 Nissan Chemical Corporation Laminate, release agent composition, and method for manufacturing processed semiconductor substrate
EP4415023A1 (en) 2021-10-29 2024-08-14 Nissan Chemical Corporation Laminate, release agent composition, and method for manufacturing processed semiconductor substrate
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Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU302021A1 (no) * 1969-10-23 1973-02-08
US4465833A (en) * 1980-10-15 1984-08-14 Hughes Aircraft Company Process for preparing ethynylated benzoic acid derivatives
US4814472A (en) * 1981-11-06 1989-03-21 Hughes Aircraft Company Diethynylated diphenyl hexafluoropropanes
EP0248286B1 (de) * 1986-06-02 1990-08-22 Siemens Aktiengesellschaft Verfahren und Anordnung zur Nasszerlegung radioaktiv kontaminierter oder aktivierter Komponenten von Kernreaktoranlagen
US5227457A (en) * 1988-02-17 1993-07-13 Maxdem Incorporated Rigid-rod polymers
US5169929A (en) * 1990-06-25 1992-12-08 University Of South Carolina Lithium/hmpa-promoted synthesis of poly(phenylenes)
DE4024647A1 (de) * 1990-08-03 1992-02-06 Basf Ag Aromatische kondensationsprodukte
US5236686A (en) * 1991-08-19 1993-08-17 University Of South Carolina Precursor polyphenylene for and method of producing glassy carbon
US5264511A (en) * 1992-06-30 1993-11-23 The United States Of America As Represented By The Secretary Of The Navy Polymers of bis (ethynylstyryl) benzene and related monomers
US5312994A (en) * 1993-04-02 1994-05-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Phenylethynyl endcapping reagents and reactive diluents
US5338457A (en) * 1993-04-19 1994-08-16 General Chemical Corporation Removal of aluminum and sulfate ions from aqueous solutions

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Publication number Publication date
BR9610547A (pt) 1999-07-06
WO1997010193A9 (en) 2018-02-08
DE69616580D1 (de) 2001-12-06
KR100469551B1 (ko) 2005-05-27
CN1199389A (zh) 1998-11-18
TW438823B (en) 2001-06-07
MX9801925A (es) 1998-08-30
DE69616580T2 (de) 2002-05-29
CA2231726A1 (en) 1997-03-20
EP0854849B1 (en) 2001-10-31
CN1103329C (zh) 2003-03-19
NO981064D0 (no) 1998-03-11
EP0854849A1 (en) 1998-07-29
WO1997010193A1 (en) 1997-03-20
JP4260882B2 (ja) 2009-04-30
JPH11512430A (ja) 1999-10-26
KR19990044584A (ko) 1999-06-25
US6121495A (en) 2000-09-19

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